公开(公告)号：US09418790B2

公开(公告)日：2016-08-16

申请号：US13433320

申请日：2012-03-29

申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC分类号： H05K3/02 ,  H05K3/10 ,  H01G4/12 ,  H01G4/005 ,  H01G4/232

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US20090161293A1

公开(公告)日：2009-06-25

申请号：US12340570

申请日：2008-12-19

申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC分类号： H01G4/12 ,  B05D5/12

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US08254081B2

公开(公告)日：2012-08-28

申请号：US12617879

申请日：2009-11-13

申请人： Seiichi Nishihara ,  Shuji Matsumoto ,  Akihiro Motoki ,  Makoto Ogawa

发明人： Seiichi Nishihara ,  Shuji Matsumoto ,  Akihiro Motoki ,  Makoto Ogawa

IPC分类号： H01G4/00

CPC分类号： H01G4/2325 ,  H01G4/30

摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

摘要翻译： 在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度 和组件主体。 将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。 此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散 。

公开(公告)号：US08194391B2

公开(公告)日：2012-06-05

申请号：US12340570

申请日：2008-12-19

申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC分类号： H01G4/20 ,  H01G4/06 ,  B05D5/12

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US09123469B2

公开(公告)日：2015-09-01

申请号：US13050977

申请日：2011-03-18

申请人： Akihiro Motoki ,  Syunsuke Takeuchi ,  Makoto Ogawa ,  Seiichi Nishihara ,  Kenichi Kawasaki ,  Shuji Matsumoto

发明人： Akihiro Motoki ,  Syunsuke Takeuchi ,  Makoto Ogawa ,  Seiichi Nishihara ,  Kenichi Kawasaki ,  Shuji Matsumoto

IPC分类号： H01G4/005 ,  H01G4/228 ,  H01G4/12 ,  H01G4/30

CPC分类号： H01G4/248 ,  B32B18/00 ,  B32B37/18 ,  B32B2307/202 ,  B32B2315/02 ,  B32B2457/00 ,  C23C18/40 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

摘要： In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

摘要翻译： 在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。 在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度 设定为约100℃/分钟以上。 该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

公开(公告)号：US20120183682A1

公开(公告)日：2012-07-19

申请号：US13433320

申请日：2012-03-29

申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC分类号： B05D5/00 ,  B05D3/02

CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US08077445B2

公开(公告)日：2011-12-13

申请号：US12405370

申请日：2009-03-17

申请人： Toshiyuki Iwanaga ,  Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Shuji Matsumoto

发明人： Toshiyuki Iwanaga ,  Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Shuji Matsumoto

IPC分类号： H01G4/00

CPC分类号： H01G4/30 ,  B32B18/00 ,  C04B2237/346 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/704 ,  H01C1/142 ,  H01C7/008 ,  H01G4/232 ,  Y10T428/265 ,  Y10T428/31678

摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

摘要翻译： 一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层， 其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。

公开(公告)号：US08547683B2

公开(公告)日：2013-10-01

申请号：US12821305

申请日：2010-06-23

申请人： Masahito Saruban ,  Makoto Ogawa ,  Toshiyuki Iwanaga ,  Seiichi Matsumoto ,  Akihiro Motoki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Kenichi Kawasaki

发明人： Masahito Saruban ,  Makoto Ogawa ,  Toshiyuki Iwanaga ,  Seiichi Matsumoto ,  Akihiro Motoki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Kenichi Kawasaki

IPC分类号： H01G4/228 ,  H01G4/06 ,  H01G7/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01L41/083 ,  H01L41/293

摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.

摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。