Method for producing group III nitride-based compound semiconductor, wafer, and group III nitride-based compound semiconductor device
    1.
    发明授权
    Method for producing group III nitride-based compound semiconductor, wafer, and group III nitride-based compound semiconductor device 有权
    制备III族氮化物类化合物半导体,晶片和III族氮化物类化合物半导体器件的方法

    公开(公告)号:US09263258B2

    公开(公告)日:2016-02-16

    申请号:US12320642

    申请日:2009-01-30

    摘要: Provided is a method for producing a Group III nitride-based compound semiconductor having an M-plane main surface. The method employs a sapphire substrate having a main surface which is inclined by 30° with respect to R-plane about a line of intersection Lsapph-AM formed by R-plane and A-plane perpendicular thereto. R-plane surfaces of the sapphire substrate are exposed, and a silicon dioxide mask is formed on the main surface of the substrate. AlN buffer layers are formed on the exposed R-plane surfaces. A GaN layer is formed on the AlN buffer layers. At an initial stage of GaN growth, the top surface of the sapphire substrate is entirely covered with the GaN layer through lateral growth. The GaN layer is grown so that the a-axis of the layer is perpendicular to the exposed R-plane surfaces of the sapphire substrate; the c-axis of the layer is parallel to the axis direction Lsapph-AM of the sapphire substrate; and the m-axis of the layer, which is inclined by 30° from the a-axis thereof, is perpendicular to the main surface (inclined by 30° from the exposed R-plane surfaces) of the sapphire substrate.

    摘要翻译: 提供一种具有M面主面的III族氮化物系化合物半导体的制造方法。 该方法采用蓝色蓝宝石衬底,该蓝宝石衬底具有主表面,其相对于R平面围绕由R平面和与其垂直的A平面形成的交线Lsapph-AM倾斜30°。 暴露蓝宝石衬底的R平面表面,并且在衬底的主表面上形成二氧化硅掩模。 AlN缓冲层形成在暴露的R平面上。 在AlN缓冲层上形成GaN层。 在GaN生长的初始阶段,蓝宝石衬底的顶表面通过横向生长完全被GaN层覆盖。 生长GaN层使得该层的a轴垂直于蓝宝石衬底的暴露的R平面表面; 层的c轴平行于蓝宝石衬底的轴方向Lsapph-AM; 并且从其a轴倾斜30°的层的m轴垂直于蓝宝石衬底的主表面(从露出的R平面倾斜30°)。

    N-type group III nitride-based compound semiconductor and production method therefor
    2.
    发明申请
    N-type group III nitride-based compound semiconductor and production method therefor 有权
    N型III族氮化物系化合物半导体及其制造方法

    公开(公告)号:US20090294909A1

    公开(公告)日:2009-12-03

    申请号:US12453743

    申请日:2009-05-20

    IPC分类号: H01L29/20 H01L21/20

    CPC分类号: C30B9/12 C30B9/10 C30B29/403

    摘要: An object of the present invention is to realize, by the flux process, the production of a high-quality n-type semiconductor crystal having high concentration of electrons. The method of the invention for producing an n-type Group III nitride-based compound semiconductor by the flux process, the method including preparing a melt by melting at least a Group III element by use of a flux; supplying a nitrogen-containing gas to the melt; and growing an n-type Group III nitride-based compound semiconductor crystal on a seed crystal from the melt. In the method, carbon and germanium are dissolved in the melt, and germanium is incorporated as a donor into the semiconductor crystal, to thereby produce an n-type semiconductor crystal.The mole percentage of germanium to gallium in the melt is 0.05 mol % to 0.5 mol %, and the mole percentage of carbon to sodium is 0.1 mol % to 3.0 mol %.

    摘要翻译: 本发明的目的是通过磁通处理来实现具有高浓度电子的高质量n型半导体晶体的生产。 本发明的用于通过助熔剂制造n型III族氮化物基化合物半导体的方法,该方法包括通过使用助熔剂熔化至少III族元素来制备熔体; 向熔体供给含氮气体; 以及从所述熔体在籽晶上生长n型III族氮化物基化合物半导体晶体。 在该方法中,将碳和锗溶解在熔体中,并将​​锗作为供体掺入到半导体晶体中,从而制备n型半导体晶体。 熔体中锗与镓的摩尔比为0.05摩尔%〜0.5摩尔%,碳与钠的摩尔比为0.1摩尔%〜3.0摩尔%。