METHOD OF MANUFACTURING SiC SINGLE CRYSTAL
    4.
    发明申请
    METHOD OF MANUFACTURING SiC SINGLE CRYSTAL 审中-公开
    制造SiC单晶的方法

    公开(公告)号:US20170067183A1

    公开(公告)日:2017-03-09

    申请号:US15122687

    申请日:2015-03-12

    Abstract: A method of manufacturing an SiC single crystal includes the steps of melting a raw material in a crucible (14) to produce an SIC solution (15); and bringing a crystal growth surface (24A) of an SiC seed crystal (24) into contact with the SiC solution to cause an SiC single crystal to grow on the crystal growth surface. The crystal structure of the SiC seed crystal is the 4H polytype. The off-angle of the crystal growth surface is not smaller than 1° and not larger than 4°. The temperature of the SIC solution during growth of the SiC single crystal is not lower than 1650° C. and not higher than 1850° C. The temperature gradient in a portion of the SiC solution directly below the SiC seed crystal during growth of the SiC single crystal is higher than 0° C./cm and not higher than 19° C./cm.

    Abstract translation: 制造SiC单晶的方法包括以下步骤:在坩埚(14)中熔化原料以产生SIC溶液(15); 并使SiC晶种(24)的晶体生长面(24A)与SiC溶液接触,使SiC单晶在晶体生长面上生长。 SiC晶种的晶体结构是4H多型。 晶体生长面的偏角不小于1°而不大于4°。 SiC单晶生长期间SIC溶液的温度不低于1650℃且不高于1850℃。在SiC生长过程中SiC晶种正下方的一部分SiC溶液中的温度梯度 单晶高于0℃/ cm且不高于19℃/ cm。

    METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR SINGLE CRYSTAL
    5.
    发明申请
    METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR SINGLE CRYSTAL 有权
    用于生产III族氮化物半导体单晶的方法

    公开(公告)号:US20170058425A1

    公开(公告)日:2017-03-02

    申请号:US15239584

    申请日:2016-08-17

    Inventor: Miki MORIYAMA

    Abstract: The present techniques provide a method for producing a Group III nitride semiconductor single crystal that is designed to grow a semiconductor single crystal with high reproducibility. The method for producing a Group III nitride semiconductor single crystal comprises adding a seed crystal substrate, Ga, and Na into a crucible, and growing a Group III nitride semiconductor single crystal. In the growth of the Group III nitride semiconductor single crystal, a measuring device is used to detect the reaction of Ga with Na. Ga is reacted with Na with the temperature of the crucible adjusted within a first temperature range of 80° C. to 200° C. After the measuring device detected the reaction of Ga with Na, the temperature of the crucible is elevated up to a growth temperature of the Group III nitride semiconductor single crystal.

    Abstract translation: 本技术提供了一种用于生产以高再现性生长半导体单晶的III族氮化物半导体单晶的方法。 制造III族氮化物半导体单晶的方法包括将晶种衬底Ga和Na加入到坩埚中,并且生长III族氮化物半导体单晶。 在III族氮化物半导体单晶的生长中,使用测量装置来检测Ga与Na的反应。 Ga与Na反应,坩埚的温度在80℃至200℃的第一温度范围内调节。测量装置检测到Ga与Na的反应后,将坩埚的温度升高至升高 III族氮化物半导体单晶的温度。

    Manufacturing method of group 13 nitride crystal
    6.
    发明授权
    Manufacturing method of group 13 nitride crystal 有权
    13族氮化物晶体的制造方法

    公开(公告)号:US09404196B2

    公开(公告)日:2016-08-02

    申请号:US13592555

    申请日:2012-08-23

    CPC classification number: C30B9/12 C30B9/10 C30B29/406

    Abstract: A method of manufacturing a group 13 nitride crystal includes a crystal growth process to form the group 13 nitride crystal by growing the group 13 nitride crystal having a hexagonal crystal structure from a seed crystal which is a gallium nitride crystal having a hexagonal crystal structure in which a length “L” in a c-axis direction is 9.7 mm or more, and a ratio L/d of the length “L” to a crystal diameter “d” in a c-plane is larger than 0.813. The crystal growth process includes a process of forming an outer periphery containing a {10-10} plane and an outer periphery containing a {10-11} plane at side surfaces of the group 13 nitride crystal, and forming an outer periphery containing a {0001} plane at a bottom surface of the group 13 nitride crystal.

    Abstract translation: 制造13族氮化物晶体的方法包括通过从具有六方晶系结构的氮化镓晶体的晶种生长具有六方晶系结构的13族氮化物晶体来形成氮化镓族晶体的晶体生长工艺,其中 c轴方向的长度“L”为9.7mm以上,c面中的长度“L”与晶体直径“d”的比率L / d大于0.813。 晶体生长工艺包括在第13族氮化物晶体的侧面形成包含{10-10}面和包含{10-11}面的外周的外周的工艺,并且形成含有{ 0001}面。

    APATITE CRYSTAL
    9.
    发明申请
    APATITE CRYSTAL 有权
    APATITE水晶

    公开(公告)号:US20150017442A1

    公开(公告)日:2015-01-15

    申请号:US14497553

    申请日:2014-09-26

    Abstract: An apatite crystal is a single crystal expressed by a general formula (M2)5(PO4)3X. In this formula, M2 indicates at least one type of element selected from the group consisting of bivalent alkaline-earth metals and Eu, and X indicates at least one type of element or molecule selected from the group consisting of halogen elements and OH. And the single crystal is of a tubular shape. The outer shape of the apatite may be a hexagonal prism. The shape of an opening of a hole formed in the upper surface or lower surface of the hexagonal prism may be a hexagon.

    Abstract translation: 磷灰石晶体是由通式(M2)5(PO4)3X表示的单晶。 在该式中,M2表示选自二价碱土金属和Eu中的至少一种元素,X表示选自卤素元素和OH的至少一种元素或分子。 单晶是管状的。 磷灰石的外形可以是六棱柱。 形成在六边形棱镜的上表面或下表面中的孔的形状可以是六边形。

    Composite of III-Nitride Crystal on Laterally Stacked Substrates
    10.
    发明申请
    Composite of III-Nitride Crystal on Laterally Stacked Substrates 有权
    III型氮化物晶体复合材料在双面叠层基板上的应用

    公开(公告)号:US20150008563A1

    公开(公告)日:2015-01-08

    申请号:US14491962

    申请日:2014-09-19

    Abstract: Group-III nitride crystal composites made up of especially processed crystal slices, cut from III-nitride bulk crystal, whose major surfaces are of {1-10±2}, {11-2±2}, {20-2±1} or {22-4±1} orientation, disposed adjoining each other sideways with the major-surface side of each slice facing up, and III-nitride crystal epitaxially present on the major surfaces of the adjoining slices, with the III-nitride crystal containing, as principal impurities, either silicon atoms or oxygen atoms. With x-ray diffraction FWHMs being measured along an axis defined by a direction of the substrate projected onto either of the major surfaces, FWHM peak regions are present at intervals of 3 to 5 mm width. Also, with threading dislocation density being measured along a direction of the III-nitride crystal substrate, threading-dislocation-density peak regions are present at the 3 to 5 mm intervals.

    Abstract translation: III-III族氮化物晶体复合材料由III-氮化物块状晶体切割的特别加工的晶片组成,其主表面为{1-10±2},{11-2±2},{20-2±1} 或{22-4±1}取向,其中每个切片的主表面侧面朝上地彼此相邻地设置,并且III-氮化物晶体外延地存在于相邻切片的主表面上,其中III族氮化物晶体包含 作为主要杂质,硅原子或氧原子。 利用X射线衍射测定FWHM,沿着投影到任一主表面上的衬底的<0001>方向限定的轴测量,FWHM峰值区域以3至5mm的间隔存在。 此外,沿着III族氮化物晶体衬底的<0001>方向测量穿透位错密度,穿透位错密度峰值区域以3至5mm的间隔存在。

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