Chemical supply unit and apparatus for treating a substrate

    公开(公告)号:US10699918B2

    公开(公告)日:2020-06-30

    申请号:US15484377

    申请日:2017-04-11

    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.

    Apparatus for treating substrate
    4.
    发明授权

    公开(公告)号:US10232415B2

    公开(公告)日:2019-03-19

    申请号:US14725515

    申请日:2015-05-29

    Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

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