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8 条记录 (耗时 0.016 秒)

    Electromechanical converter comprising at least one piezoelectric element
    1.
    发明授权
    Electromechanical converter comprising at least one piezoelectric element 失效
    包括至少一个压电元件的机电转换器

    公开(公告)号：US07061165B2

    公开(公告)日：2006-06-13

    申请号：US10478296

    申请日：2002-05-14

    申请人： Sergej Lopatin ,  Dietmar Birgel ,  Karl-Peter Hauptvogel

    发明人： Sergej Lopatin ,  Dietmar Birgel ,  Karl-Peter Hauptvogel

    IPC分类号： H01L41/47

    CPC分类号： H01L41/0474 ,  H01L41/0831 ,  H01L41/0833 ,  H04R17/00

    摘要： An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.

    摘要翻译： 一种具有至少一个压电元件的机电换能器，其中施加有第一电极的第一表面和至少一个触点标记，压电元件通过该至少一个触点标记被电连接。 压电元件的电连接具有非常高的接触可靠性，因为接触标志直接接触第一电极并且呈现至少一个凹陷，粘合剂被放置在该凹陷中，接触标记通过该凹陷与电极连接。

    Device for determining the filling level of a filling material in a container
    4.
    发明授权
    Device for determining the filling level of a filling material in a container 有权
    用于确定容器中填充材料的填充水平的装置

    公开(公告)号：US06266022B1

    公开(公告)日：2001-07-24

    申请号：US09497022

    申请日：2000-02-02

    申请人： Roland Müller ,  Thomas Malzahn ,  Karl-Peter Hauptvogel ,  Dietmar Birgel

    发明人： Roland Müller ,  Thomas Malzahn ,  Karl-Peter Hauptvogel ,  Dietmar Birgel

    IPC分类号： G01R2908

    CPC分类号： G01F23/284

    摘要： The invention relates to a device (1) for determining the filling level in a container (4). Moreover, the invention also relates to a method for fastening an input coupling unit (9) on the antenna (7), the antenna (7) being used in the device (1) according to the invention. It is the object of the invention to provide overvoltage protection for an antenna (7), and a method for producing such an antenna (7). The object is achieved by virtue of the fact that the antenna (7) comprises at least two dielectric layers (12, 13). The first dielectric layer (12) has at least one cutout (15) for holding the input coupling unit (9). The second dielectric layer (13) bears an antenna structure (16) on the side facing the first dielectric layer (12) and has a conductive coating (17) with openings (18) on the side averted from the first dielectric layer (12). Contacts (19) are provided in the second dielectric layer (13) and the conductive layer (17) which connect the input coupling unit (9) to the conductive coating (17). The region of space defined by the contacts (19), the conductive coating (17) and the antenna housing (30) forms a Faraday cage.

    摘要翻译： 本发明涉及一种用于确定容器（4）中的填充水平的装置（1）。 此外，本发明还涉及一种用于将输入耦合单元（9）紧固在天线（7）上的方法，天线（7）用于根据本发明的设备（1）中。 本发明的目的是提供一种用于天线（7）的过电压保护，以及一种用于制造这种天线（7）的方法。 该目的是通过天线（7）包括至少两个电介质层（12,13）的事实来实现的。 第一电介质层（12）具有用于保持输入耦合单元（9）的至少一个切口（15）。 第二电介质层（13）在与第一介电层（12）相对的一侧上承载天线结构（16），并且具有在从第一介电层（12）避开的一侧上具有开口（18）的导电涂层（17） 。 触头（19）设置在第二电介质层（13）和将输入耦合单元（9）连接到导电涂层（17）的导电层（17）上。 由触头（19），导电涂层（17）和天线壳体（30）限定的空间区域形成法拉第笼。

    Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven
    5.
    发明申请
    Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven 有权
    用于保持有线电子元件的电路板用于制造这种电路板的方法及其在焊接炉中的使用

    公开(公告)号：US20070212901A1

    公开(公告)日：2007-09-13

    申请号：US10572953

    申请日：2004-09-20

    申请人： Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger

    发明人： Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger

    IPC分类号： H05K1/00

    CPC分类号： H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

    摘要： In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, a edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

    摘要翻译： 为了在电路板上安全地将大质量或不均匀质量分布的有线部件安全地固定在电路板上，而不需要像现在常用的组件一样被胶合到电路板上或者用卡入式保持器固定在电路板上，集成 进入用于接收电子部件的连接线或销的连接孔，用于固定地保持连接线或销的保持机构。 保持机构表示连接孔的直径小于连接线或销的直径。 保持机构可以例如通过以电路板的一侧钻出的孔的形式而不是完全通过电路板实现的连接孔来实现。 在这种情况下，边缘保持为变窄，其可靠地抓住相关部件的连接销并将固定在电路板上的部件保持在一起。

    Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component
    6.
    发明申请
    Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component 审中-公开
    具有至少一个连接孔的电路板用于有线电子部件的连接线或引脚

    公开(公告)号：US20070212934A1

    公开(公告)日：2007-09-13

    申请号：US10593344

    申请日：2005-03-17

    申请人： Dietmar Birgel ,  Karl-Peter Hauptvogel

    发明人： Dietmar Birgel ,  Karl-Peter Hauptvogel

    IPC分类号： H01R13/60

    CPC分类号： H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2203/1476

    摘要： A circuit board with a holding mechanism integrated into the circuit board for the holding of wired, electronic components. To this end, a connection bore is provided for receiving a connection wire or pin of the component. The connection bore is formed from two neighboring and partially mutually overlapping bores. In such case, the first bore is so placed relative to a second bore that ridges are formed in the interior of the connection bore as a result of the overlapping of the first and second bores. The ridges provide a narrowing of the open passageway through the connection bore. In this narrowing, the connection wire or pin is controllably, securely seized by the ridges.

    摘要翻译： 一种电路板，其具有集成在电路板中用于保持有线，电子部件的保持机构。 为此，提供连接孔以接收部件的连接线或销。 连接孔由两个相邻和部分相互重叠的孔形成。 在这种情况下，第一孔相对于第二孔相对放置，由于第一和第二孔的重叠，脊形成在连接孔的内部。 脊通过连接孔提供开口通道的变窄。 在这种变窄的情况下，连接线或销被脊部可控地牢固地抓住。

    Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components
    7.
    发明申请
    Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components 审中-公开
    具有SMD组件和至少一个有线部件的电路板以及用于组件的固定和电接触的方法

    公开(公告)号：US20060037778A1

    公开(公告)日：2006-02-23

    申请号：US11195600

    申请日：2005-08-03

    申请人： Dietmar Birgel ,  Karl-Peter Hauptvogel

    发明人： Dietmar Birgel ,  Karl-Peter Hauptvogel

    IPC分类号： H05K1/11

    CPC分类号： H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/321 ,  H05K3/3415 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2203/1446 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613

    摘要： A circuit board and method for populating, securing and electrical contacting of components thereon is provided, as an alternative to the known pressfit technology. After the soldering of SMD-components on a first side of a circuit board, conductive adhesive and solder paste are applied on a second side of the circuit board and a connection pin of a thermally critical THT-component is inserted into the special connection bore from the first side of the circuit board. Then, on the second side of the circuit board, SMD-components are set into the solder paste. In a reflow soldering oven, the SMD components are soldered and the conductive adhesive is dried and cured. By the binding effect of a metallizing sleeve of the connection bore, the insertion of the connection pin in the area of the a constriction produces a kind of cold weld connection, which, alongside the electrical connection by the conductive adhesive, represents a redundant connection, which accompanies the highly secure mechanical connection by the conductive adhesive.

    摘要翻译： 提供了一种用于在其上组装，固定和电接触零件的电路板和方法，作为已知的压配技术的替代方案。 在电路板第一面上焊接SMD元件之后，将导电粘合剂和焊膏施加在电路板的第二侧上，并将热临界THT元件的连接销插入到特殊连接孔中 电路板的第一面。 然后，在电路板的第二面，将SMD组件放入焊膏中。 在回流焊炉中，SMD部件被焊接，导电粘合剂被干燥和固化。 通过连接孔的金属化套筒的结合作用，将连接销插入收缩部的区域产生一种冷焊连接，其通过导电粘合剂与电连接一起代表冗余连接， 其伴随着通过导电粘合剂的高度安全的机械连接。