-
1.发明授权Device for determining the filling level of a filling material in a container 有权用于确定容器中填充材料的填充水平的装置公开(公告)号：US06266022B1
公开(公告)日：2001-07-24
申请号：US09497022
申请日：2000-02-02
IPC分类号： G01R2908
CPC分类号： G01F23/284
摘要： The invention relates to a device (1) for determining the filling level in a container (4). Moreover, the invention also relates to a method for fastening an input coupling unit (9) on the antenna (7), the antenna (7) being used in the device (1) according to the invention. It is the object of the invention to provide overvoltage protection for an antenna (7), and a method for producing such an antenna (7). The object is achieved by virtue of the fact that the antenna (7) comprises at least two dielectric layers (12, 13). The first dielectric layer (12) has at least one cutout (15) for holding the input coupling unit (9). The second dielectric layer (13) bears an antenna structure (16) on the side facing the first dielectric layer (12) and has a conductive coating (17) with openings (18) on the side averted from the first dielectric layer (12). Contacts (19) are provided in the second dielectric layer (13) and the conductive layer (17) which connect the input coupling unit (9) to the conductive coating (17). The region of space defined by the contacts (19), the conductive coating (17) and the antenna housing (30) forms a Faraday cage.
摘要翻译： 本发明涉及一种用于确定容器（4）中的填充水平的装置（1）。 此外，本发明还涉及一种用于将输入耦合单元（9）紧固在天线（7）上的方法，天线（7）用于根据本发明的设备（1）中。 本发明的目的是提供一种用于天线（7）的过电压保护，以及一种用于制造这种天线（7）的方法。 该目的是通过天线（7）包括至少两个电介质层（12,13）的事实来实现的。 第一电介质层（12）具有用于保持输入耦合单元（9）的至少一个切口（15）。 第二电介质层（13）在与第一介电层（12）相对的一侧上承载天线结构（16），并且具有在从第一介电层（12）避开的一侧上具有开口（18）的导电涂层（17） 。 触头（19）设置在第二电介质层（13）和将输入耦合单元（9）连接到导电涂层（17）的导电层（17）上。 由触头（19），导电涂层（17）和天线壳体（30）限定的空间区域形成法拉第笼。
-
2.发明授权公开(公告)号：US06881906B2
公开(公告)日：2005-04-19
申请号：US10477201
申请日：2002-05-08
CPC分类号： H01R12/57 , H01R9/16 , H01R43/0256 , H05K1/183 , H05K3/3405 , H05K2201/09036 , H05K2201/10333
摘要： A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a metallizing bordering the recess, the metallizing being connected to a conductor path extending on the circuit board, and, set in the recess, a contact sleeve, which is both mechanically secured and electrically connected to the metallizing by means of a solder connection.
摘要翻译： 具有安装在其上的接触套筒的电路板。 接触套筒可以用于SMD组件的方式电连接。 电路板的上侧具有与凹部接合的凹部和金属化，金属化连接到在电路板上延伸的导体路径，并且在凹部中设置接触套筒，该接触套筒机械地固定和电连接 通过焊接连接到金属化。
-
3.发明申请Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component 审中-公开具有至少一个连接孔的电路板用于有线电子部件的连接线或引脚公开(公告)号：US20070212934A1
公开(公告)日：2007-09-13
申请号：US10593344
申请日：2005-03-17
IPC分类号： H01R13/60
CPC分类号： H05K1/119 , H05K3/0047 , H05K3/306 , H05K3/42 , H05K2201/09854 , H05K2201/1059 , H05K2203/1476
摘要： A circuit board with a holding mechanism integrated into the circuit board for the holding of wired, electronic components. To this end, a connection bore is provided for receiving a connection wire or pin of the component. The connection bore is formed from two neighboring and partially mutually overlapping bores. In such case, the first bore is so placed relative to a second bore that ridges are formed in the interior of the connection bore as a result of the overlapping of the first and second bores. The ridges provide a narrowing of the open passageway through the connection bore. In this narrowing, the connection wire or pin is controllably, securely seized by the ridges.
摘要翻译： 一种电路板，其具有集成在电路板中用于保持有线，电子部件的保持机构。 为此，提供连接孔以接收部件的连接线或销。 连接孔由两个相邻和部分相互重叠的孔形成。 在这种情况下，第一孔相对于第二孔相对放置，由于第一和第二孔的重叠，脊形成在连接孔的内部。 脊通过连接孔提供开口通道的变窄。 在这种变窄的情况下，连接线或销被脊部可控地牢固地抓住。
-
4.发明申请Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components 审中-公开具有SMD组件和至少一个有线部件的电路板以及用于组件的固定和电接触的方法公开(公告)号：US20060037778A1
公开(公告)日：2006-02-23
申请号：US11195600
申请日：2005-08-03
IPC分类号： H05K1/11
CPC分类号： H05K1/119 , H05K3/0047 , H05K3/306 , H05K3/321 , H05K3/3415 , H05K3/42 , H05K2201/09854 , H05K2201/1059 , H05K2203/1446 , H05K2203/1476 , H05K2203/1572 , Y02P70/613
摘要： A circuit board and method for populating, securing and electrical contacting of components thereon is provided, as an alternative to the known pressfit technology. After the soldering of SMD-components on a first side of a circuit board, conductive adhesive and solder paste are applied on a second side of the circuit board and a connection pin of a thermally critical THT-component is inserted into the special connection bore from the first side of the circuit board. Then, on the second side of the circuit board, SMD-components are set into the solder paste. In a reflow soldering oven, the SMD components are soldered and the conductive adhesive is dried and cured. By the binding effect of a metallizing sleeve of the connection bore, the insertion of the connection pin in the area of the a constriction produces a kind of cold weld connection, which, alongside the electrical connection by the conductive adhesive, represents a redundant connection, which accompanies the highly secure mechanical connection by the conductive adhesive.
摘要翻译： 提供了一种用于在其上组装，固定和电接触零件的电路板和方法，作为已知的压配技术的替代方案。 在电路板第一面上焊接SMD元件之后，将导电粘合剂和焊膏施加在电路板的第二侧上，并将热临界THT元件的连接销插入到特殊连接孔中 电路板的第一面。 然后，在电路板的第二面，将SMD组件放入焊膏中。 在回流焊炉中，SMD部件被焊接，导电粘合剂被干燥和固化。 通过连接孔的金属化套筒的结合作用，将连接销插入收缩部的区域产生一种冷焊连接，其通过导电粘合剂与电连接一起代表冗余连接， 其伴随着通过导电粘合剂的高度安全的机械连接。
-
5.发明授权公开(公告)号：US07061165B2
公开(公告)日：2006-06-13
申请号：US10478296
申请日：2002-05-14
IPC分类号： H01L41/47
CPC分类号： H01L41/0474 , H01L41/0831 , H01L41/0833 , H04R17/00
摘要： An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.
摘要翻译： 一种具有至少一个压电元件的机电换能器，其中施加有第一电极的第一表面和至少一个触点标记，压电元件通过该至少一个触点标记被电连接。 压电元件的电连接具有非常高的接触可靠性，因为接触标志直接接触第一电极并且呈现至少一个凹陷，粘合剂被放置在该凹陷中，接触标记通过该凹陷与电极连接。
-
6.发明申请Circuit Board With Holding Mechanism For Holding Wired Electronic Components Method For Manufacture Of Such A Circuit Board And Their Use In A Soldering Oven 有权用于保持有线电子元件的电路板用于制造这种电路板的方法及其在焊接炉中的使用公开(公告)号：US20070212901A1
公开(公告)日：2007-09-13
申请号：US10572953
申请日：2004-09-20
IPC分类号： H05K1/00
CPC分类号： H05K13/0465 , H05K1/036 , H05K1/119 , H05K3/0047 , H05K3/306 , H05K3/326 , H05K2201/0397 , H05K2201/09827 , H05K2201/09845 , H05K2201/10575 , H05K2201/1059 , H05K2203/1476 , Y10T29/49165
摘要： In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, a edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.
摘要翻译： 为了在电路板上安全地将大质量或不均匀质量分布的有线部件安全地固定在电路板上，而不需要像现在常用的组件一样被胶合到电路板上或者用卡入式保持器固定在电路板上，集成 进入用于接收电子部件的连接线或销的连接孔，用于固定地保持连接线或销的保持机构。 保持机构表示连接孔的直径小于连接线或销的直径。 保持机构可以例如通过以电路板的一侧钻出的孔的形式而不是完全通过电路板实现的连接孔来实现。 在这种情况下，边缘保持为变窄，其可靠地抓住相关部件的连接销并将固定在电路板上的部件保持在一起。
-
7.发明授权Circuit board with an electronic component and a method for producing a connection between the circuit board and the component 有权具有电子元件的电路板和用于在电路板和部件之间产生连接的方法公开(公告)号：US06437989B1
公开(公告)日：2002-08-20
申请号：US09577913
申请日：2000-05-24
IPC分类号： H05K710
CPC分类号： H01L24/73 , H01L24/81 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H05K1/189 , H05K3/321 , H05K3/3442 , H05K2201/094 , H05K2201/10083 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49139 , Y10T29/49165
摘要： This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at least one of the electrical contacts is connected to the circuit board by soldering. The circuit board is suitable for fast mechanical mass production. Further a method for the manufacture of the connection between the circuit board and the electronic components is disclosed, in which a solder is applied to soldering points and a conductive adhesive is applied to adhesive points. The circuit board with the components is then placed in a furnace to connect the components to the circuit board.
摘要翻译： 该电路板包含具有电触点的电子部件。 电触点中的至少一个最初使用导电粘合剂粘合到电路板上，并且至少一个电触点通过焊接连接到电路板。 电路板适用于快速机械批量生产。 公开了一种用于制造电路板和电子部件之间的连接的方法，其中将焊料应用于焊接点，并将导电粘合剂施加到粘合点。 然后将具有部件的电路板放置在炉中以将部件连接到电路板。
-
8.发明申请Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method 审中-公开用于安装和焊接电路板，回流炉和电路板的方法公开(公告)号：US20050161252A1
公开(公告)日：2005-07-28
申请号：US10507213
申请日：2003-03-15
申请人： Dietmar Birgel
发明人： Dietmar Birgel
CPC分类号： B23K1/008 , H05K1/0212 , H05K3/3415 , H05K3/3447 , H05K3/3452 , H05K3/3484 , H05K3/3494 , H05K2201/062 , H05K2203/0557 , H05K2203/1121 , H05K2203/1476 , H05K2203/1572 , H05K2203/304 , Y02P70/613 , Y10T29/49144
摘要： A method for populating and soldering a circuit board, which is populated with a wired, electrical component having at least one connection wire or pin and a housing or casing thermally critical for conventional, automatic soldering methods. Additionally, a reflow oven for the soldering of the circuit board and a circuit board for such method are discussed. Soldering of the thermally critical component in the reflow oven is enabled by using the circuit board itself for the thermal shielding of the thermally critical THT-components against the heat energy acting on the circuit board and required for the soldering. The circuit boards are placed on frames for this purpose, for example, and transported through the reflow oven in such a manner that the thermally critical components are arranged on the under side of the circuit board facing away from the heat energy.
摘要翻译： 一种用于填充和焊接电路板的方法，其布置有具有至少一个连接线或针的有线电气部件和用于常规的自动焊接方法热关键的壳体或壳体。 另外，讨论了用于焊接电路板的回流炉和用于这种方法的电路板。 通过使用电路板本身来抵抗热关键THT部件的热屏蔽，抵抗作用在电路板上的热能和焊接所需的热能，能够焊接回流炉中的热关键部件。 例如，为了这个目的，电路板被放置在框架上，并通过回流炉传送，使得热关键部件被布置在远离热能的电路板的下侧。
-
公开(公告)号：US20050006140A1
公开(公告)日：2005-01-13
申请号：US10478295
申请日：2002-05-18
申请人： Dietmar Birgel , Sergej Lopatin
发明人： Dietmar Birgel , Sergej Lopatin
CPC分类号： H05K3/363 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/114 , H05K3/28 , H05K3/321 , H05K3/361 , H05K2201/09063 , H05K2201/0979 , H05K2201/10666 , H01L2224/05647 , H01L2924/00014 , H01L2224/05655
摘要： A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.
摘要翻译： 在电路板和布置在其上的部件之间具有高机械承载能力的电气和机械连接的电路板。 所述电路板包括至少一个内部定位的导体路径，布置在所述电路板的第一表面上的第一绝缘层，布置在所述电路板的第二表面上的第二绝缘层，所述导体路径为 可接近的第二接触位置，导体路径可以通过完全穿过电路板的孔访问，以及布置在第一表面上的电子部件。 该部件具有通过焊料或导电粘合剂与第一接触位置连接的第一接触表面，以及通过焊料或粘合剂与第二接触位置连接的第二接触表面。
-
公开(公告)号：US06946779B2
公开(公告)日：2005-09-20
申请号：US10296248
申请日：2001-05-16
申请人： Dietmar Birgel
发明人： Dietmar Birgel
IPC分类号： H01L41/047 , H04R17/00 , H04R31/00 , H05K1/18 , H01L41/083
CPC分类号： H01L41/0471 , H01L41/0472 , H01L41/0475 , H01L41/0825 , H01L41/0833 , H04R17/005 , H05K1/189
摘要： The invention relates to an electromechanical transducer that is easy and inexpensive to produce. The inventive transducer comprises stacked piezoelectric elements between which contact electrodes (G, S, E) are interposed via which the piezoelectric elements are electrically connected. The contact electrodes (G, S, E) are configured as planar terminal lugs that are connected to the outside from a flexible printed board.
摘要翻译： 本发明涉及一种机电换能器，其易于制造并且便宜。 本发明的换能器包括堆叠的压电元件，在其间插入有接触电极（G，S，E），压电元件经由该电极被电连接。 接触电极（G，S，E）被构造成从柔性印刷电路板连接到外部的平面端子凸耳。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.019 秒)
