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公开(公告)号：US20110031113A1
公开(公告)日：2011-02-10
申请号：US12906008
申请日：2010-10-15
IPC分类号： C25D17/00
CPC分类号： H01L31/022425 , C25D5/022 , C25D5/10 , C25D7/126 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译： 本发明的实施例考虑使用新颖的高速电镀方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的选择性形成的金属线的金属接触结构。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。
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公开(公告)号：US20080092947A1
公开(公告)日：2008-04-24
申请号：US11552497
申请日：2006-10-24
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/02245 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell metal contact structure that has improved electrical and mechanical properties through the use of an electrochemical plating process. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connections that is reliable and cost effective. One or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing common metal, such as copper. However, generally the electroplated portions of the interconnecting layer may contain a substantially pure metal or a metal alloy layer. Methods are discussed herein that are used to form a solar cell containing conductive metal interconnect layer(s) that have a low intrinsic stress.
摘要翻译： 本发明的实施例考虑到通过使用电化学电镀工艺形成具有改善的电气和机械性能的低成本太阳能电池金属接触结构。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 使用本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。 然而，通常互连层的电镀部分可以包含基本上纯的金属或金属合金层。 本文讨论了用于形成含有具有低固有应力的导电金属互连层的太阳能电池的方法。
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3.发明申请HIGH-ASPECT RATIO ANODE AND APPARATUS FOR HIGH-SPEED ELECTROPLATING ON A SOLAR CELL SUBSTRATE 失效高比例阳极和用于太阳能电池基板上高速电镀的装置公开(公告)号：US20080128268A1
公开(公告)日：2008-06-05
申请号：US11566202
申请日：2006-12-01
IPC分类号： C23C14/00
CPC分类号： C25D5/022 , C25D7/08 , C25D17/00 , C25D17/001 , C25D17/008 , H01L31/022425 , H01L31/022433 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译： 本发明的实施例考虑使用新颖的高速电镀方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的选择性形成的金属线的金属接触结构。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。
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4.发明授权Precision printing electroplating through plating mask on a solar cell substrate 失效通过电镀掩模在太阳能电池基板上精密印刷电镀公开(公告)号：US07736928B2
公开(公告)日：2010-06-15
申请号：US11566205
申请日：2006-12-01
申请人： Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
发明人： Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
IPC分类号： H01L21/20
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
摘要翻译： 本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。 本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。 本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。
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5.发明授权High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrate 失效高比例阳极和太阳能电池基板上的高速电镀装置公开(公告)号：US07704352B2
公开(公告)日：2010-04-27
申请号：US11566202
申请日：2006-12-01
IPC分类号： C25D17/00
CPC分类号： C25D5/022 , C25D7/08 , C25D17/00 , C25D17/001 , C25D17/008 , H01L31/022425 , H01L31/022433 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译： 本发明的实施例考虑使用新颖的高速电镀方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的选择性形成的金属线的金属接触结构。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。
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6.发明申请PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 失效精密印刷通过太阳能电池基板上的电镀掩模进行电镀公开(公告)号：US20080132082A1
公开(公告)日：2008-06-05
申请号：US11566205
申请日：2006-12-01
申请人： Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
发明人： Sergey Lopatin , John O. Dukovic , David Eaglesham , Nicolay Y. Kovarsky , Robert Bachrach , John Busch , Charles Gay
IPC分类号： H01L21/469 , B05C13/02
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
摘要翻译： 本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。 本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。 本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。
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公开(公告)号：US20080128019A1
公开(公告)日：2008-06-05
申请号：US11566201
申请日：2006-12-01
CPC分类号： H01L31/022425 , C25D5/022 , C25D5/10 , C25D7/126 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译： 本发明的实施例考虑使用新颖的高速电镀方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的选择性形成的金属线的金属接触结构。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。
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公开(公告)号：US07799182B2
公开(公告)日：2010-09-21
申请号：US11566200
申请日：2006-12-01
申请人： Sergey Lopatin , David Eaglesham , Charles Gay
发明人： Sergey Lopatin , David Eaglesham , Charles Gay
IPC分类号： C25D17/00
CPC分类号： C25D5/022 , C25D5/18 , C25D7/08 , C25D17/00 , C25D17/001 , H01L31/022425 , H01L31/02245 , H01L31/022466 , H01L31/03926 , H01L31/0465 , H01L31/0508 , H01L31/0512 , H01L31/0516 , H01L31/188 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power. The flexible substrates may have a flexible base that is adapted to support the active region of the solar cell device.
摘要翻译： 本发明的实施例考虑使用新颖的电镀方法和装置形成金属接触结构来形成低成本的柔性太阳能电池。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 可以受益于本发明的太阳能电池基板包括柔性基板可以具有含有有机材料，单晶硅，多晶硅，多晶硅，锗和砷化镓，碲化镉，硫化镉，铜铟镓硒的有源区 ，铜铟硒化铟，磷化铟镓，以及用于将阳光转换成电力的异质结电池。 柔性基板可以具有适于支撑太阳能电池装置的有源区域的柔性基座。
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公开(公告)号：US20080128013A1
公开(公告)日：2008-06-05
申请号：US11566200
申请日：2006-12-01
申请人： Sergey Lopatin , David Eaglesham , Charles Gay
发明人： Sergey Lopatin , David Eaglesham , Charles Gay
IPC分类号： H01L31/042 , C23C14/00
CPC分类号： C25D5/022 , C25D5/18 , C25D7/08 , C25D17/00 , C25D17/001 , H01L31/022425 , H01L31/02245 , H01L31/022466 , H01L31/03926 , H01L31/0465 , H01L31/0508 , H01L31/0512 , H01L31/0516 , H01L31/188 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power. The flexible substrates may have a flexible base that is adapted to support the active region of the solar cell device.
摘要翻译： 本发明的实施例考虑使用新颖的电镀方法和装置形成金属接触结构来形成低成本的柔性太阳能电池。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 可以受益于本发明的太阳能电池基板包括柔性基板可以具有含有有机材料，单晶硅，多晶硅，多晶硅，锗和砷化镓，碲化镉，硫化镉，铜铟镓硒的有源区 ，铜铟硒化铟，磷化铟镓，以及用于将阳光转换成电力的异质结电池。 柔性基板可以具有适于支撑太阳能电池装置的有源区域的柔性基座。
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公开(公告)号：US20080121276A1
公开(公告)日：2008-05-29
申请号：US11564812
申请日：2006-11-29
申请人： Sergey Lopatin , Arulkumar Shanmugasundram , Robert Z. Bachrach , Charles Gay , David Eaglesham
发明人： Sergey Lopatin , Arulkumar Shanmugasundram , Robert Z. Bachrach , Charles Gay , David Eaglesham
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/022433 , H01L31/02245 , Y02E10/50
摘要： A metal contact structure of a solar cell substrate includes a contact with a conductive layer or a capping layer that is formed using an electroless plating process. The contact may be disposed within a hole formed through the solar cell substrate or on a non-light-receiving surface of the solar cell substrate. The electroless plating process for the conductive layer uses a seed layer that includes an activation layer for electroless plating.
摘要翻译： 太阳能电池基板的金属接触结构包括与使用无电解电镀工艺形成的导电层或覆盖层的接触。 接触可以设置在通过太阳能电池基板形成的孔内或太阳能电池基板的非光接收表面上。 用于导电层的化学镀处理使用包括用于无电镀的活化层的晶种层。
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