公开(公告)号：US20130047420A1

公开(公告)日：2013-02-28

申请号：US13328236

申请日：2011-12-16

申请人： Seung Hyun Ra ,  Sang Su Hong

发明人： Seung Hyun Ra ,  Sang Su Hong

IPC分类号： H01H65/00

CPC分类号： G06F3/041 ,  G06F2203/04103 ,  Y10T29/49105

摘要： Disclosed herein is a method for manufacturing a touch panel, the method including: (A) applying a barrier layer to a transparent substrate; (B) patterning the bather layer using a stamp so that open parts are formed in the barrier layer; and (C) forming sensing electrodes in the open parts, the sensing electrode being made of a metal. The bather layer is patterned using the stamp and the sensing electrodes are then formed in the open parts of the barrier layer, thereby making it possible to simplify a manufacturing process as compared to a photolithography process and to reduce a manufacturing cost.

摘要翻译： 本发明公开了一种制造触摸屏的方法，该方法包括：（A）将阻挡层施加到透明基板上; （B）使用印模图案化沐浴层，使得在阻挡层中形成开放部分; 和（C）在开放部分形成感测电极，感测电极由金属制成。 使用印模对沐浴层进行图案化，然后在阻挡层的开放部分中形成感测电极，从而与光刻工艺相比可以简化制造工艺并降低制造成本。

公开(公告)号：US20130307565A1

公开(公告)日：2013-11-21

申请号：US13554071

申请日：2012-07-20

申请人： Seung Hyun Ra ,  Chung Mo Yang

发明人： Seung Hyun Ra ,  Chung Mo Yang

IPC分类号： G01R27/00 ,  G01R3/00

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

摘要： Disclosed herein are a touch sensor and a method of manufacturing the same, the touch sensor including: a transparent substrate; a shielding film formed on one surface of the transparent substrate; a resin layer formed above the transparent substrate and one surface of the shielding film; and an electrode buried in one surface of the resin layer.

摘要翻译： 这里公开了一种触摸传感器及其制造方法，所述触摸传感器包括：透明基板; 形成在所述透明基板的一个表面上的屏蔽膜; 形成在所述透明基板的上方和所述屏蔽膜的一个表面上的树脂层; 以及埋在树脂层的一个表面中的电极。

公开(公告)号：US20100277052A1

公开(公告)日：2010-11-04

申请号：US12236337

申请日：2008-09-23

申请人： Seung Hyun Ra ,  Kay Hyeok An ,  Young Hee Lee ,  Jong Myeon Lee

发明人： Seung Hyun Ra ,  Kay Hyeok An ,  Young Hee Lee ,  Jong Myeon Lee

IPC分类号： H01J1/02

CPC分类号： H01J1/304 ,  B82Y10/00 ,  D01D5/003 ,  H01J9/025 ,  H01J2201/30469

摘要： The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.

摘要翻译： 本发明提供一种场致发射电极及其制造方法。 该方法包括将可碳化聚合物，碳纳米管和溶剂混合以制备含碳纳米管的聚合物溶液，静电纺丝（或静电纺丝）聚合物溶液以在基材上形成纳米纤维网层，使纳米纤维网层 使得存在于纳米纤维网层中的聚合物交联，并将纳米纤维网层碳化，使得交联聚合物转化为碳纤维。

公开(公告)号：US07338854B2

公开(公告)日：2008-03-04

申请号：US11002183

申请日：2004-12-03

申请人： Ho Sung Choo ,  Seung Hyun Ra ,  Yong Suk Kim ,  Jung Woo Lee ,  Hyo Soon Shin ,  Hyoung Ho Kim

发明人： Ho Sung Choo ,  Seung Hyun Ra ,  Yong Suk Kim ,  Jung Woo Lee ,  Hyo Soon Shin ,  Hyoung Ho Kim

IPC分类号： H01L21/8242

CPC分类号： H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/417

摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.

摘要翻译： 一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。 该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度 设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

公开(公告)号：US06876840B2

公开(公告)日：2005-04-05

申请号：US10196271

申请日：2002-07-17

申请人： Yu Seon Shin ,  Seung Hyun Ra ,  Chang Yong Lee

发明人： Yu Seon Shin ,  Seung Hyun Ra ,  Chang Yong Lee

IPC分类号： H03H7/075 ,  H01P1/20 ,  H03H7/46 ,  H04B1/18 ,  H04B1/3822 ,  H04B1/50

CPC分类号： H04B1/005 ,  H04B1/406

摘要： A triplexer and a multilayered structure thereof. The triplexer comprises a first filter circuit and a low pass filter circuit connected in parallel to an input terminal, and a second filter circuit and a third filter circuit connected in parallel to an output terminal of the low pass filter circuit. The first filter circuit passes a signal of a first frequency band, and the low pass filter circuit passes a signal of a predetermined frequency band which is lower than the first frequency band. The second filter circuit extracts a signal of a second frequency band from the predetermined frequency band signal, and the third filter circuit extracts a signal of a third frequency band from the predetermined frequency band signal, which third frequency band is lower than the second frequency band. The low pass filter circuit includes a notch circuit for extending a portion of the predetermined frequency band, neighboring the first frequency band. According to the invention, the triplexer can separate an input signal received at the input terminal into the signals of the first, second and third frequency bands.

摘要翻译： 三工器及其多层结构。 三工器包括与输入端子并联连接的第一滤波器电路和低通滤波器电路，以及与低通滤波器电路的输出端并联连接的第二滤波器电路和第三滤波器电路。 第一滤波器电路通过第一频带的信号，并且低通滤波器电路通过低于第一频带的预定频带的信号。 第二滤波器电路从预定频带信号中提取第二频带的信号，并且第三滤波器电路从预定频带信号中提取第三频带的信号，该第三频带低于第二频带 。 低通滤波器电路包括用于扩展与第一频带相邻的预定频带的一部分的陷波电路。 根据本发明，三工器可以将在输入端接收的输入信号分离成第一，第二和第三频带的信号。

公开(公告)号：US20130328575A1

公开(公告)日：2013-12-12

申请号：US13586801

申请日：2012-08-15

申请人： Seung Hyun Ra ,  Jin Uk Lee

发明人： Seung Hyun Ra ,  Jin Uk Lee

IPC分类号： G01R27/00 ,  H05K13/00

CPC分类号： G06F3/041 ,  G06F2203/04103

摘要： Disclosed herein are a touch sensor and a method of manufacturing the same. The touch sensor includes: a transparent substrate; a resin layer formed on one surface of the transparent substrate; and an electrode formed on one surface of the resin layer, wherein one surface of the resin layer is formed with a substrate prominence and depression part having a prominence and depression shape.

摘要翻译： 这里公开了一种触摸传感器及其制造方法。 触摸传感器包括：透明基板; 形成在所述透明基板的一个表面上的树脂层; 以及形成在树脂层的一个表面上的电极，其中树脂层的一个表面形成有具有突出和凹陷形状的基底突起和凹陷部分。

公开(公告)号：US20130277100A1

公开(公告)日：2013-10-24

申请号：US13532454

申请日：2012-06-25

申请人： Seung Hyun Ra ,  Jin Uk Lee

发明人： Seung Hyun Ra ,  Jin Uk Lee

IPC分类号： H05K1/00 ,  H05K3/06 ,  H05K3/10

CPC分类号： H05K3/0014 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  H05K3/06 ,  H05K3/1275 ,  H05K2201/0108

摘要： Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel includes a transparent substrate, an insulating layer that is formed on the transparent substrate and has an intaglio portion formed thereon, an electrode layer that is embedded in the intaglio portion, and a light absorbing layer that is formed in an inner wall of the intaglio portion to be interposed between the inner wall of the intaglio portion and the electrode layer. In the touch panel, the electrode layer is formed to be embedded, and the light absorbing layer is further included, thereby durability and visibility of the touch panel.

摘要翻译： 这里公开了触摸面板及其制造方法。 触摸面板包括透明基板，形成在透明基板上并具有凹版部分的绝缘层，嵌入凹版部分中的电极层和形成在凹版部分的内壁中的光吸收层 凹版部分被插入在凹版部分的内壁和电极层之间。 在触摸面板中，电极层被形成为嵌入，并且还包括光吸收层，从而使触摸面板的耐久性和可视性。

公开(公告)号：US20120050946A1

公开(公告)日：2012-03-01

申请号：US13137546

申请日：2011-08-24

申请人： Seung Hyun Ra ,  Bae Kyun Kim ,  Young Hak Jeong

发明人： Seung Hyun Ra ,  Bae Kyun Kim ,  Young Hak Jeong

IPC分类号： H01G9/155

CPC分类号： H01G11/12 ,  H01G9/016 ,  H01G9/155 ,  H01G11/74 ,  H01G11/76 ,  H01G11/80 ,  H01G11/82 ,  Y02E60/13 ,  Y02T10/7022

摘要： Provided is a supercapacitor. The supercapacitor includes an electrode cell including a first electrode and a second electrode stacked alternately with inserting a separator therebetween, a first terminal extended from a first surface and a second surface opposing to each other at the electrode cell, a second terminal extended from a third surface and a fourth surface opposing to each other at the electrode cell and a housing to seal the electrode cell.

摘要翻译： 提供超级电容器。 超级电容器包括：电极单元，包括交替堆叠的第一电极和第二电极，在第一电极和第二电极之间插入隔板，第一端子从电极单元的第一表面和彼此相对的第二表面延伸;第二端子， 表面和在电极单元处彼此相对的第四表面和用于密封电极单元的壳体。

公开(公告)号：US20110058307A1

公开(公告)日：2011-03-10

申请号：US12591410

申请日：2009-11-18

申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

IPC分类号： H01G9/155

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/52 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13

摘要： The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.

摘要翻译： 芯片型双电层电容器及其制造方法技术领域本发明涉及芯片式双电层电容器及其制造方法。 芯片式双电层电容器包括双电层元件，其包括两个电极，其包括两个不同的极性，并且在彼此相反的一侧突出的电极端子，防止两个电极短路的第一隔板，以及第二隔离件 分离器，其基于两个电极的一个电极设置在与第一分离器相对的位置处; 以及包括安装在两个电极的突出电极端子上的封装端子的封装，它们形成在其底部并容纳双电层元件，其中基于与第二电极相对的突出电极端子缠绕双电层元件 作为参考轴的两个电极和电极端子分别附接到封装端子。

公开(公告)号：US20110058306A1

公开(公告)日：2011-03-10

申请号：US12591010

申请日：2009-11-04

申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

IPC分类号： H01G9/155 ,  H01G9/08

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  Y02E60/13

摘要： Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon.

摘要翻译： 公开了芯片型双电层电容器的封装结构，其包括下封装，其容纳双电层元件并且具有形成在其上的封装端子以电连接到双电层元件，以及上封装 设置在下封装的顶部，并将双电层元件从外部密封，其中封装端子形成为从下封装的内底表面和外底表面突出，外表面 的下部封装具有形成在其上的至少两对突起。