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24 条记录 (耗时 0.035 秒)

    Image sensing apparatus with artificial ommatidia and manufacturing method for artificial ommatidia unit
    1.
    发明授权
    Image sensing apparatus with artificial ommatidia and manufacturing method for artificial ommatidia unit 有权
    具有人造眼药水的图像感测装置和人造眼药水单元的制造方法

    公开(公告)号：US08173949B2

    公开(公告)日：2012-05-08

    申请号：US12138530

    申请日：2008-06-13

    申请人： Seung-tae Choi ,  Min-seog Choi ,  Jeong-yub Lee ,  Woon-bae Kim

    发明人： Seung-tae Choi ,  Min-seog Choi ,  Jeong-yub Lee ,  Woon-bae Kim

    IPC分类号： G02B6/06

    CPC分类号： G02B6/08 ,  H01L27/14627 ,  H01L27/14685 ,  H04N5/2254

    摘要： An image sensing apparatus with artificial ommatidia includes an imaging optical lens group forming a concave focal surface, an artificial ommatidia unit having a curved top surface corresponding to the concave focal surface and a flat bottom surface, and an image sensor disposed under the artificial ommatidia unit. The artificial ommatidia unit is disposed under the imaging optical lens group so that the curved top surface is coincided with the concave focal surface of the imaging optical lens group. The artificial ommatidia unit having a plurality of artificial ommatidia collects light emitting from the imaging optical lens group, and guides the light to the bottom surface thereof.

    摘要翻译： 具有人造眼病的摄像装置包括形成凹焦点的成像光学透镜组，具有对应于凹焦面的弯曲顶面和平底面的人造眼病单元，以及设置在人造眼部单元下方的图像传感器 。 成像光学透镜组下方设有人造眼镜组，使得弯曲的顶表面与成像光学透镜组的凹形焦面一致。 具有多个人造眼药水的人造眼睑单元收集从成像光学透镜组发出的光，并将光引导到其底面。

    Electroactive polymer actuator and manufacturing method thereof
    2.
    发明授权
    Electroactive polymer actuator and manufacturing method thereof 有权
    电动聚合物致动器及其制造方法

    公开(公告)号：US07719167B2

    公开(公告)日：2010-05-18

    申请号：US11927827

    申请日：2007-10-30

    申请人： Jong-oh Kwon ,  Seung-tae Choi ,  Seung-wan Lee ,  Woon-bae Kim ,  Min-seog Choi

    发明人： Jong-oh Kwon ,  Seung-tae Choi ,  Seung-wan Lee ,  Woon-bae Kim ,  Min-seog Choi

    IPC分类号： H01L41/08

    CPC分类号： H01L41/45 ,  H01L41/0471 ,  H01L41/0478 ,  H01L41/193 ,  H01L41/27 ,  Y10T29/49226

    摘要： An electroactive polymer actuator and a method for manufacturing the electroactive polymer actuator are provided. The electroactive polymer actuator includes an actuator unit which is a laminate of a plurality of deformation layers; and a support layer which supports the actuator unit so that the actuator unit provides displacement corresponding to a voltage if the voltage is applied to the actuator unit. Therefore, it is possible to provide an electroactive polymer actuator suitable for a compact mobile device with a low driving voltage.

    摘要翻译： 提供电活性聚合物致动器和制造电活性聚合物致动器的方法。 电活性聚合物致动器包括作为多个变形层的层压体的致动器单元; 以及支撑层，其支撑致动器单元，使得如果将电压施加到致动器单元，致动器单元提供对应于电压的位移。 因此，可以提供适合于具有低驱动电压的紧凑型移动设备的电活性聚合物致动器。

    Packaging chip having interconnection electrodes directly connected to plural wafers
    3.
    发明授权
    Packaging chip having interconnection electrodes directly connected to plural wafers 有权
    具有直接连接到多个晶片的互连电极的封装芯片

    公开(公告)号：US07786573B2

    公开(公告)日：2010-08-31

    申请号：US11481012

    申请日：2006-07-06

    申请人： Min-seog Choi ,  Kae-dong Back ,  In-sang Song ,  Woon-bae Kim ,  Byung-gil Jeong ,  Kyu-dong Jung

    发明人： Min-seog Choi ,  Kae-dong Back ,  In-sang Song ,  Woon-bae Kim ,  Byung-gil Jeong ,  Kyu-dong Jung

    IPC分类号： H01L23/34 ,  H01R12/16 ,  H05K1/11

    CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06541 ,  H03H9/0547

    摘要： A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.

    摘要翻译： 形成有多个晶片的封装芯片。 封装芯片包括依次堆叠的多个晶片和从多个晶片的最上面的晶片的上表面直接连接多个晶片到另一个晶片的多个互连电极。 多个晶片中的至少一个或多个在其上安装预定的电路装置。 此外，多个晶片的至少一个或多个晶片具有预定尺寸的空腔。 同时，封装芯片还包括独立地布置在最上面的晶片的上表面上并分别电连接到多个互连电极的多个焊盘。 因此，本发明可以提高封装芯片的性能和可靠性，并提高制造成品率。

    Method for manufacturing micro electro-mechanical systems using solder balls
    5.
    发明申请
    Method for manufacturing micro electro-mechanical systems using solder balls 有权
    使用焊球制造微机电系统的方法

    公开(公告)号：US20050009315A1

    公开(公告)日：2005-01-13

    申请号：US10784144

    申请日：2004-02-23

    申请人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    发明人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    IPC分类号： B81C1/00 ,  B81B3/00 ,  B81B7/00 ,  H01L21/00 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/60 ,  H01L23/10 ,  H01L23/12

    CPC分类号： B81B7/0006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.

    摘要翻译： 一种制造微电子机械系统的方法，包括在半导体衬底的上表面上形成绝缘层，在绝缘层的上表面上形成结构层并蚀刻结构层，在预定位置上形成凹凸金属 所述结构层的上表面在对应于所述凸块下金属的位置的玻璃基板中形成通孔，并且所述通孔在所述玻璃基板的上表面处的直径比在 玻璃基板的下表面，其中玻璃基板结合到结构层的上表面，并且形成保护结构层的结构的真空室，并且在通孔中布置焊球并将焊球接合到 下凸块金属。

    Wafer level incapsulation chip and encapsulation chip manufacturing method
    6.
    发明授权
    Wafer level incapsulation chip and encapsulation chip manufacturing method 有权
    晶圆级封装芯片和封装芯片制造方法

    公开(公告)号：US07906841B2

    公开(公告)日：2011-03-15

    申请号：US11447971

    申请日：2006-06-07

    申请人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    发明人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/04 ,  H01L21/00

    CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16235

    摘要： A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

    摘要翻译： 晶圆级封装芯片和封装芯片制造方法。 封装芯片包括器件衬底，安装在器件衬底上的电路模块，沉积在器件衬底的预定区域上的结合层，在电路模块上形成空腔的保护帽，并通过结合层结合到器件衬底 以及形成在接合层和保护盖的预定区域上的封装部。 因此，本发明可以最大限度地减少芯片处理时对芯片的损害，并防止水分引入芯片内部。

    Wafer level incapsulation chip and encapsulation chip manufacturing method
    7.
    发明申请
    Wafer level incapsulation chip and encapsulation chip manufacturing method 有权
    晶圆级封装芯片和封装芯片制造方法

    公开(公告)号：US20070020817A1

    公开(公告)日：2007-01-25

    申请号：US11447971

    申请日：2006-06-07

    申请人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    发明人： Byung-gil Jeong ,  In-sang Song ,  Woon-bae Kim ,  Min-seog Choi ,  Suk-jin Ham ,  Ji-hyuk Lim

    IPC分类号： H01L21/00

    CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L2924/01079 ,  H01L2924/16235

    摘要： A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.

    摘要翻译： 晶圆级封装芯片和封装芯片制造方法。 封装芯片包括器件衬底，安装在器件衬底上的电路模块，沉积在器件衬底的预定区域上的结合层，在电路模块上形成空腔的保护帽，并通过结合层结合到器件衬底 以及形成在接合层和保护盖的预定区域上的封装部。 因此，本发明可以最大限度地减少在芯片处理时对芯片的损害，并防止水分引入芯片内部。

    Method for manufacturing micro electro-mechanical systems using solder balls
    8.
    发明授权
    Method for manufacturing micro electro-mechanical systems using solder balls 有权
    使用焊球制造微机电系统的方法

    公开(公告)号：US07008817B2

    公开(公告)日：2006-03-07

    申请号：US10784144

    申请日：2004-02-23

    申请人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    发明人： Woon-bae Kim ,  Sung-hoon Choa ,  Min-seog Choi

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： B81B7/0006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.

    摘要翻译： 一种制造微电子机械系统的方法，包括在半导体衬底的上表面上形成绝缘层，在绝缘层的上表面上形成结构层并蚀刻结构层，在预定位置上形成凹凸金属 所述结构层的上表面在对应于所述凸块下金属的位置的玻璃基板中形成通孔，并且所述通孔在所述玻璃基板的上表面处的直径比在 玻璃基板的下表面，其中玻璃基板结合到结构层的上表面，并且形成保护结构层的结构的真空室，并且在通孔中布置焊球并将焊球接合到 下凸块金属。