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1.发明申请SWITCH FOR TRANSMIT/RECEIVE MODE SELECTION AND ANTENNA POLARIZATION DIVERSITY 有权用于发射/接收模式选择和天线极化多样性的开关公开(公告)号：US20130072125A1
公开(公告)日：2013-03-21
申请号：US13236279
申请日：2011-09-19
CPC分类号： H01P1/10 , H01P1/127 , H01Q9/0435 , H04B1/40 , H04B1/44
摘要： A transceiver circuit includes a transmitter to send communication signals and a receiver to receive communication signals sent by other transmitters. The transceiver circuit also includes a switch to connect the transmitter and the receiver to at least one antenna. The switch controls at least two directions of polarization of the at least one antenna.
摘要翻译： 收发器电路包括发送通信信号的发射机和用于接收由其它发射机发送的通信信号的接收机。 收发器电路还包括将发射器和接收器连接到至少一个天线的开关。 开关控制至少一个天线的至少两个极化方向。
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2.发明授权公开(公告)号：US08838036B2
公开(公告)日：2014-09-16
申请号：US13236279
申请日：2011-09-19
CPC分类号： H01P1/10 , H01P1/127 , H01Q9/0435 , H04B1/40 , H04B1/44
摘要： A transceiver circuit includes a transmitter to send communication signals and a receiver to receive communication signals sent by other transmitters. The transceiver circuit also includes a switch to connect the transmitter and the receiver to at least one antenna. The switch controls at least two directions of polarization of the at least one antenna.
摘要翻译： 收发器电路包括发送通信信号的发射机和用于接收由其它发射机发送的通信信号的接收机。 收发器电路还包括将发射器和接收器连接到至少一个天线的开关。 开关控制至少一个天线的至少两个极化方向。
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公开(公告)号：US07750787B2
公开(公告)日：2010-07-06
申请号：US11473810
申请日：2006-06-22
IPC分类号： H01F27/28
CPC分类号： H01F17/0013 , H01F19/04 , H01F29/02 , H01F2021/125 , H01P5/02 , H03F1/565 , H03F3/189 , H03F3/68 , H03H7/42
摘要： An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components.
摘要翻译： 阻抗变换器包括第一绕组和第二绕组。 第一绕组包括第一多个绕组部件，其中第一多个绕组部件中的每一个在支撑衬底的第一组层的相应层上。 第二绕组包括第二多个绕组部件，其中第二多个绕组部件中的每一个位于支撑衬底的第二组层的相应层上，并且第一和第二组层被交错。 第一绕组具有期望频率范围内的第一阻抗，并且第二绕组在期望频率范围内具有第二阻抗，其中第一和第二阻抗基于第一和第二阻抗的间隔，迹线宽度和迹线长度中的至少一个 和第二组绕组部件。
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公开(公告)号：US07973636B2
公开(公告)日：2011-07-05
申请号：US12789677
申请日：2010-05-28
IPC分类号： H01F27/28
CPC分类号： H01F17/0013 , H01F19/04 , H01F29/02 , H01F2021/125 , H01P5/02 , H03F1/565 , H03F3/189 , H03F3/68 , H03H7/42
摘要： An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components.
摘要翻译： 阻抗变换器包括第一绕组和第二绕组。 第一绕组包括第一多个绕组部件，其中第一多个绕组部件中的每一个在支撑衬底的第一组层的相应层上。 第二绕组包括第二多个绕组部件，其中第二多个绕组部件中的每一个位于支撑衬底的第二组层的相应层上，并且第一和第二组层被交错。 第一绕组具有期望频率范围内的第一阻抗，并且第二绕组在期望频率范围内具有第二阻抗，其中第一和第二阻抗基于第一和第二阻抗的间隔，迹线宽度和迹线长度中的至少一个 和第二组绕组部件。
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公开(公告)号：US20100237974A1
公开(公告)日：2010-09-23
申请号：US12789677
申请日：2010-05-28
IPC分类号： H01F27/28
CPC分类号： H01F17/0013 , H01F19/04 , H01F29/02 , H01F2021/125 , H01P5/02 , H03F1/565 , H03F3/189 , H03F3/68 , H03H7/42
摘要： An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components.
摘要翻译： 阻抗变换器包括第一绕组和第二绕组。 第一绕组包括第一多个绕组部件，其中第一多个绕组部件中的每一个在支撑衬底的第一组层的相应层上。 第二绕组包括第二多个绕组部件，其中第二多个绕组部件中的每一个位于支撑衬底的第二组层的相应层上，并且第一和第二组层被交错。 第一绕组具有期望频率范围内的第一阻抗，并且第二绕组在期望频率范围内具有第二阻抗，其中第一和第二阻抗基于第一和第二阻抗的间隔，迹线宽度和迹线长度中的至少一个 和第二组绕组部件。
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公开(公告)号：US08995931B2
公开(公告)日：2015-03-31
申请号：US12877938
申请日：2010-09-08
申请人： Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Sam Ziqun Zhao
发明人： Ahmadreza (Reza) Rofougaran , Arya Reza Behzad , Michael Boers , Jesus Alfonso Castaneda , Sam Ziqun Zhao
IPC分类号： H04B7/00 , G06F13/42 , H04B7/10 , G06F13/364 , H04W84/18
CPC分类号： G06F9/50 , H04B5/0037 , H04B7/10 , H04B7/26 , H04W4/80 , H04W84/18 , Y10T307/492
摘要： Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.
摘要翻译： 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能组件（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。
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公开(公告)号：US08952712B2
公开(公告)日：2015-02-10
申请号：US13025665
申请日：2011-02-11
申请人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： G01R31/36 , G01R31/319 , G01R31/302 , G01R31/311 , H01L23/544 , G01R31/28
CPC分类号： G01R31/319 , G01R31/2834 , G01R31/3025 , G01R31/311 , H01L23/544 , H01L2223/54433 , H01L2924/0002 , Y10T29/49121 , H01L2924/00
摘要： Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.
摘要翻译： 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。
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公开(公告)号：US20130082800A1
公开(公告)日：2013-04-04
申请号：US13248787
申请日：2011-09-29
申请人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
发明人： Ahmadreza Rofougaran , Arya Reza Behzad , Sam Ziqun Zhao , Jesus Alfonso Castaneda , Michael Boers
IPC分类号： H01P3/00
CPC分类号： H01P3/00 , B81B7/008 , B81B2201/018 , B81B2203/0118 , B81B2207/03 , H01H59/0009 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L41/0986 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2924/1461 , H01P1/06 , H01P1/18 , H01P1/182 , H01P3/121 , H01Q13/20 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。
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9.发明申请Wirelessly Communicating Among Vertically Arranged Integrated Circuits (ICs) in a Semiconductor Package 有权在半导体封装中的垂直布置集成电路（IC）之间无线通信公开(公告)号：US20130082403A1
公开(公告)日：2013-04-04
申请号：US13248745
申请日：2011-09-29
申请人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
发明人： Jesus Alfonso Castaneda , Arya Reza Behzad , Ahmadreza Rofougaran , Sam Ziqun Zhao , Michael Boers
IPC分类号： H01L23/522
CPC分类号： H01L25/0657 , G02B6/12002 , G02B6/43 , H01L23/5222 , H01L23/66 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2225/06517 , H01L2225/06531 , H01L2225/06572 , H01L2225/1005 , H01L2924/1461 , H01P3/00 , H01P3/12 , H01P3/121 , H04L7/0091 , H01L2924/00
摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要翻译： 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。
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公开(公告)号：US08351855B2
公开(公告)日：2013-01-08
申请号：US12877942
申请日：2010-09-08
申请人： Jesus Alfonso Castaneda , Arya Reza Behzad , Michael Boers , Ahmadreza Reza Rofougaran , Sam Ziqun Zhao
发明人： Jesus Alfonso Castaneda , Arya Reza Behzad , Michael Boers , Ahmadreza Reza Rofougaran , Sam Ziqun Zhao
IPC分类号： H04B5/00
CPC分类号： G06F9/50 , H04B5/0037 , H04B7/10 , H04B7/26 , H04W4/80 , H04W84/18 , Y10T307/492
摘要： Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.
摘要翻译： 本文公开了用于在没有欧姆接触的情况下提供接近耦合的系统，装置和方法。 这样的系统包括彼此无线耦合的多个无线功能组件（WEC）。 每个WEC包括金属基元件，衬底和将金属基元件与衬底分离的半导体层。 信号被配置为通过金属基元件和衬底之间的邻近耦合（例如，磁耦合，电耦合和/或电磁耦合）传输，而在金属基元件和衬底之间没有欧姆接触 基质。 在一个示例中，多个WEC的第一子集共同位于第一芯片上，并且多个WEC的第二子集共同位于第二芯片上。 第一芯片和第二芯片可以位于单个设备中或者位于单独的设备中。
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