Printed Circuit Board and Electronic Device
    5.
    发明申请
    Printed Circuit Board and Electronic Device 有权
    印刷电路板和电子设备

    公开(公告)号:US20100053921A1

    公开(公告)日:2010-03-04

    申请号:US12404213

    申请日:2009-03-13

    IPC分类号: H05K1/18

    摘要: According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.

    摘要翻译: 根据一个实施例,提供了一种印刷电路板,其包括设置在其上将要安装半导体部件的部件安装面上的多个电极焊盘,设置在部件安装面上的多个孔端子,以对应于 所述电极焊盘和连接所述多个电极焊盘和与所述多个电极焊盘对应的所述多个孔端子的多个布线图案层,所述多个布线图案层在所述部件安装面的弹性变形方向上布线。

    Printed wiring board and information processing device incorporating the board
    6.
    发明授权
    Printed wiring board and information processing device incorporating the board 有权
    印刷电路板和包含板的信息处理设备

    公开(公告)号:US07659481B2

    公开(公告)日:2010-02-09

    申请号:US11241925

    申请日:2005-10-04

    IPC分类号: H01R12/04 H05K1/11

    摘要: A printed wiring board mounted with a BGA package including pads, through holes and leads. The leads are linearly formed with almost the same width as the diameter of each of the pads and through holes and thus have high bonding strength against their peeling against an external force. The pads are provided at an angle of approximately 45 degrees outwardly relative to the through holes and along almost in the direction of application of thermal stress, and thus have high durability against their peeling due to an external force.

    摘要翻译: 安装有包括垫,通孔和引线的BGA封装的印刷线路板。 引线线性地形成有与每个焊盘和通孔的直径几乎相同的宽度,因此具有高的抵抗外力的剥离力的结合强度。 焊盘相对于通孔以大致45度的角度设置,并且几乎沿着施加热应力的方向设置,因此由于外力而对其剥离具有高耐久性。

    Printed-wiring board, printed-circuit board and electronic apparatus
    7.
    发明授权
    Printed-wiring board, printed-circuit board and electronic apparatus 有权
    印刷电路板,印刷电路板和电子设备

    公开(公告)号:US07301103B2

    公开(公告)日:2007-11-27

    申请号:US11352293

    申请日:2006-02-13

    IPC分类号: H05K1/00

    摘要: A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

    摘要翻译: 具有包括多个绝缘层和多个导电层的多玩家结构的印刷电路板包括设置在导电层的最外层中的至少一个中的信号图案,该信号图案包括多个焊盘部分,该多个焊盘部分设置在相对的位置 连接部件的多个信号端子以预定的形式布置并且进行电连接,所述加强部分分别设置成沿长度方向从所述焊盘部分延伸,并且将所述接地部分电连接到所述另一层 导电层,以及设置在导电层的最外层上的阻焊剂,以覆盖加强部分并具有露出焊盘部分的开口部分。

    Printed circuit board and electronic device
    8.
    发明授权
    Printed circuit board and electronic device 有权
    印刷电路板和电子设备

    公开(公告)号:US07863525B2

    公开(公告)日:2011-01-04

    申请号:US12404213

    申请日:2009-03-13

    IPC分类号: H05K1/16 H05K1/11 H01R12/04

    摘要: According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.

    摘要翻译: 根据一个实施例,提供了一种印刷电路板,其包括设置在其上将要安装半导体部件的部件安装面上的多个电极焊盘,设置在部件安装面上的多个孔端子,以对应于 所述电极焊盘和连接所述多个电极焊盘和与所述多个电极焊盘对应的所述多个孔端子的多个布线图案层,所述多个布线图案层在所述部件安装面的弹性变形方向上布线。

    Circuit board unit
    9.
    发明申请
    Circuit board unit 审中-公开
    电路板单元

    公开(公告)号:US20080003846A1

    公开(公告)日:2008-01-03

    申请号:US11715151

    申请日:2007-03-06

    IPC分类号: H01R12/02

    摘要: According to one embodiment, a circuit board unit includes: a circuit board; and an electronic component that is surface-mounted on the circuit board. The electronic component includes a first electrode at one end and a second electrode at another end of the electronic component. The circuit board includes a plurality of penetrating holes penetrating through the circuit board at a position close to the first electrode and at a position close to the second electrode. The penetrating holes are arranged substantially symmetrically with respect to the electronic component.

    摘要翻译: 根据一个实施例,电路板单元包括:电路板; 以及表面安装在电路板上的电子部件。 电子部件包括一端的第一电极和电子部件的另一端的第二电极。 电路板包括穿过电路板的多个穿透孔,靠近第一电极的位置和靠近第二电极的位置。 贯通孔相对于电子部件大致对称地配置。

    Printed-wiring board, printed-circuit board and electronic apparatus
    10.
    发明申请
    Printed-wiring board, printed-circuit board and electronic apparatus 有权
    印刷电路板,印刷电路板和电子设备

    公开(公告)号:US20060180340A1

    公开(公告)日:2006-08-17

    申请号:US11352293

    申请日:2006-02-13

    IPC分类号: H05K7/06

    摘要: A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

    摘要翻译: 具有包括多个绝缘层和多个导电层的多玩家结构的印刷电路板包括设置在导电层的最外层中的至少一个中的信号图案,该信号图案包括多个垫部分,该多个垫部分设置在相对的位置 连接部件的多个信号端子以预定的形式布置并且进行电连接,所述加强部分分别设置成沿长度方向从所述焊盘部分延伸,并且将所述接地部分电连接到所述另一层 导电层,以及设置在导电层的最外层上的阻焊剂,以覆盖加强部分并具有露出焊盘部分的开口部分。