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公开(公告)号：US6103976A
公开(公告)日：2000-08-15
申请号：US19057
申请日：1998-02-05
CPC分类号： H01B7/0009 , H01B7/041
摘要： A wire for use in robot including a conductor of metallic fiber-reinforced copper matrix composite whose plastic strain to rupture is substantially less than 0.2%. A plurality of conductors form a twisted wire (2). An insulation member (4) is coated on the twisted wire (2) to form a coated wire (6). The conductivity of the conductor is greater than 70% IACS and the tensile strength of the conductor is greater than 100 Kg/mm.sup.2. The metallic fiber-reinforced copper matrix composite is in-situ metallic fiber-reinforced copper matrix composite drawn with a total reduction in sectional area of 99.99% or more.
摘要翻译： 一种用于机器人的电线，包括金属纤维增强铜基复合材料的导体，其塑性应变破裂明显小于0.2％。 多个导体形成绞线（2）。 绝缘构件（4）涂覆在扭绞线（2）上以形成涂覆线（6）。 导体的导电率大于70％IACS，导体的拉伸强度大于100Kg / mm2。 金属纤维增强铜基复合材料是原位金属纤维增强铜基复合材料，总截面积为99.99％以上。
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公开(公告)号：US5958333A
公开(公告)日：1999-09-28
申请号：US911673
申请日：1997-08-15
申请人： Junichi Matsunaga , Ryuji Ninomiya
发明人： Junichi Matsunaga , Ryuji Ninomiya
CPC分类号： B23K35/262 , C22C13/00
摘要： The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.
摘要翻译： 本发明提供一种焊接合金，其不包含有害的Pb或Cd，并且具有优异的拉伸强度，伸长率和熔点性能。 因此，根据本发明的焊接合金可以解决常规的环境问题，将焊接温度设定在低水平，从而限制对焊接部分的热损伤，并且防止由于热循环导致的焊接合金的断裂， 优异的拉伸强度和伸长率值。 根据本发明的锡 - 银基焊接合金基本上由3至4重量％的Ag，2至6重量％的Bi，2至6重量％的In和余量的Sn组成。
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公开(公告)号：US20050199679A1
公开(公告)日：2005-09-15
申请号：US10518153
申请日：2003-07-01
申请人： Yunosuke Nakahara , Ryuji Ninomiya
发明人： Yunosuke Nakahara , Ryuji Ninomiya
CPC分类号： B23K35/262 , B23K1/0016 , B23K1/20 , B23K2101/36
摘要： To provide a tin-silver based lead-free solder which can improve joint strength in the initial stage, and can curtail a decrease in joint strength after heat treatment, at a joined interface with an electroless plating, zinc (Zn) is added to a solder comprising a tin-silver system containing no lead.
摘要翻译： 为了提供能够提高初期的接合强度的锡 - 银基无铅焊料，并且可以减少热处理后的接合强度的降低，在与化学镀的接合界面处，将锌（Zn）添加到 包含不含铅的锡 - 银系统的焊料。
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公开(公告)号：US5658528A
公开(公告)日：1997-08-19
申请号：US712678
申请日：1996-09-13
申请人： Ryuji Ninomiya , Junichi Matsunaga
发明人： Ryuji Ninomiya , Junichi Matsunaga
CPC分类号： B23K35/262 , C22C13/00
摘要： A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:A=[Ag wt %]+1.23 [Bi wt %]+0.52 [In wt %] (1)B=[Ag wt %]+1.19 [Bi wt %]+0.50 [In wt %] (2)This solder has a tensile strength and an elongation as high as those of conventional Pb--Sn solder without containing neither lead nor cadmium, which can cause environmental contamination.
摘要翻译： 由1至4重量％的Ag组成的无铅焊料，Bi和In中的至少一个分别满足表达式（1）的值A等于或大于5.00的条件，并且值 （2）中，B等于或小于6.90，余量为Sn：A = [Ag wt％] + 1.23 [Biwt％] + 0.52 [Inwt％]（1）B = [Ag 重量％] + 1.19 [Bi重量％] + 0.50 [In％（重量）]（2）该焊料的拉伸强度和伸长率高于常规Pb-Sn焊料，不含铅或镉， 污染。
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5.发明授权Abrasion resistant copper alloy, copper alloy powder for build-up cladding, and engine cylinder head 失效耐磨铜合金，用于堆积包层的铜合金粉末和发动机气缸盖公开(公告)号：US06531003B2
公开(公告)日：2003-03-11
申请号：US09253798
申请日：1999-02-22
申请人： Ryuji Ninomiya , Takeshi Ojiro , Koichi Miyake , Makoto Kano , Kenji Tsushima , Hidenobu Matsuyama , Kenji Suzuki
发明人： Ryuji Ninomiya , Takeshi Ojiro , Koichi Miyake , Makoto Kano , Kenji Tsushima , Hidenobu Matsuyama , Kenji Suzuki
IPC分类号： C22C906
CPC分类号： B23K31/025 , B22F2998/10 , B23K26/32 , B23K26/342 , B23K35/0244 , B23K35/302 , B23K2103/08 , B23K2103/10 , C22C1/0425 , C22C9/05 , C22C9/06 , F01L3/04 , F02B77/02 , F02B2275/18 , F02F2001/248 , F05C2201/0475 , B22F9/082 , B22F1/0081
摘要： A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-5 wt % silicon (Si), and 1-5 wt % of one of molybdenum (Mo), tungsten (W), tantalum (Ta), niobium (Nb) and vanadium (V). Due to this composition, the valve seat (2) has few microcracks and excellent abrasion resistance.
摘要翻译： 通过在设置在形成在发动机气缸盖（1）中的端口（3）的边缘上的铜合金粉末（4）上照射激光束，通过积聚包层形成阀座（2）。 铜合金粉末（4）由铜（Cu），6-9重量％镍（Ni），1-5重量％硅（Si）和1-5重量％的钼（Mo），钨（Mo W），钽（Ta），铌（Nb）和钒（V）。 由于这种组成，阀座（2）几乎没有微裂纹和优异的耐磨性。
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公开(公告)号：US5993736A
公开(公告)日：1999-11-30
申请号：US84552
申请日：1998-05-26
CPC分类号： C22C13/02 , B23K35/262
摘要： The present invention provides a lead-free tin-silver-based soldering alloy which has a low melting point equal to alloy H without containing harmful lead, expensive In or the like, and has excellent mechanical characteristics, that is, a tensile strength, an elongation value and heat fatigue characteristic as compared with alloy H, and thus, is applicable to soldering work at a low temperature and can make products which have a high reliability and long useful life or durability. The lead-free tin-silver-based soldering alloy consists essentially of Ag: 2 to 4% by weight, Zn: 0.5 to 2% by weight, Bi: 2 to 6% by weight, and the balance being substantially Sn.
摘要翻译： 本发明提供一种无铅锡 - 银基焊接合金，其具有等于合金H的低熔点而不含有害铅，昂贵的In等，并且具有优异的机械特性，即拉伸强度， 伸长率和热疲劳特性，因此适用于低温下的焊接工作，可以制造具有高可靠性，长使用寿命或耐久性的产品。 无铅锡银基焊接合金主要由Ag：2〜4重量％，Zn：0.5〜2重量％，Bi：2〜6重量％，余量基本上为Sn。
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公开(公告)号：US5911949A
公开(公告)日：1999-06-15
申请号：US931498
申请日：1997-09-16
申请人： Ryuji Ninomiya , Takeshi Ojiro , Makoto Kano , Hidenobu Matsuyama
发明人： Ryuji Ninomiya , Takeshi Ojiro , Makoto Kano , Hidenobu Matsuyama
CPC分类号： C22C9/06 , B23K35/302 , F02B2275/18 , Y10T428/1275
摘要： An abrasion resistant copper alloy suitable for the material of an overlaid layer formed at the valve seat of an engine cylinder head formed of aluminum alloy. The copper alloy consists essentially of nickel in an amount ranging from 10 to 30% by weight; silicon in an amount ranging from 0.5 to 5.0% by weight; at least one element selected from the group consisting of molybdenum, tungsten, tantalum, niobium and vanadium, in an amount ranging from 2.0 to 15.0% by weight; and balance being copper and impurities.
摘要翻译： 适用于由铝合金形成的发动机气缸盖的阀座形成的重叠层材料的耐磨铜合金。 铜合金基本上由以重量计10％至30％的量的镍组成; 量为0.5至5.0重量％的硅; 选自钼，钨，钽，铌和钒的至少一种元素，其量为2.0至15.0重量％; 铜和杂质的平衡。
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公开(公告)号：US5718868A
公开(公告)日：1998-02-17
申请号：US688625
申请日：1996-07-30
申请人： Ryuji Ninomiya , Junichi Matsunaga
发明人： Ryuji Ninomiya , Junichi Matsunaga
CPC分类号： C22C13/00 , B23K35/262
摘要： Described is a lead-free tin-zinc-based soldering alloy made up of 7 to 9 wt. % of Zn and 0.1 to 0.5 wt. % of Cu or which further contains not more than 3 wt. % of Bi and, in either case, the balance being Sn except for inevitable impurities. The present invention has made it possible to provide a lead-free soldering alloy which has mechanical properties, such as tensile strength and elongation, comparable with those of conventional Pb--Sn soldering alloys without adding thereto lead which causes environmental pollution, has a melting point not higher than 200.degree. C., which is lower than the heat-resistant temperature of an IC package, and has a low cost.
摘要翻译： 描述了由7至9重量％的无铅锡 - 锌基焊料合金制成。 ％的Zn和0.1〜0.5wt。 ％的Cu，或者还含有不超过3wt。 Bi的百分比，在任一种情况下，余量为Sn，除了不可避免的杂质。 本发明使得可以提供具有拉伸强度和伸长率等机械性能的无铅焊接合金，与常规的Pb-Sn焊接合金相比，不添加引起环境污染的铅，具有熔点 不高于200℃，低于IC封装的耐热温度，成本低廉。
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公开(公告)号：US5093098A
公开(公告)日：1992-03-03
申请号：US531682
申请日：1990-06-01
CPC分类号： C01B5/02
摘要： A method of controlling a single temperature type water/hydrogen isotopic exchange reaction plant comprising an electrolytic system, an exchange reaction column and a recombining system for separating degraded heavy water into product and waste both of which have a stable concentration. The control method comprises controlling an extracting quantity of waste so that a heavy water concentration of water at an intermediate portion of the reaction column is kept constant, and controlling an extracting quantity of product so that a water quantity inside the exchange reaction plant is kept constant.
摘要翻译： 一种控制单一温度型水/氢同位素交换反应装置的方法，包括电解系统，交换反应塔和用于将降解的重水分离成具有稳定浓度的产物和废物的重组系统。 控制方法包括控制废物的提取量，使得反应塔中间部分的水的重水浓度保持恒定，并控制产物的提取量，使得交换反应装置内的水量保持恒定 。
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