Lead-free tin-silver-based soldering alloy
    1.
    发明授权
    Lead-free tin-silver-based soldering alloy 失效
    无铅锡银焊接合金

    公开(公告)号:US5993736A

    公开(公告)日:1999-11-30

    申请号:US84552

    申请日:1998-05-26

    IPC分类号: B23K35/26 C22C13/02 H05K3/34

    CPC分类号: C22C13/02 B23K35/262

    摘要: The present invention provides a lead-free tin-silver-based soldering alloy which has a low melting point equal to alloy H without containing harmful lead, expensive In or the like, and has excellent mechanical characteristics, that is, a tensile strength, an elongation value and heat fatigue characteristic as compared with alloy H, and thus, is applicable to soldering work at a low temperature and can make products which have a high reliability and long useful life or durability. The lead-free tin-silver-based soldering alloy consists essentially of Ag: 2 to 4% by weight, Zn: 0.5 to 2% by weight, Bi: 2 to 6% by weight, and the balance being substantially Sn.

    摘要翻译: 本发明提供一种无铅锡 - 银基焊接合金,其具有等于合金H的低熔点而不含有害铅,昂贵的In等,并且具有优异的机械特性,即拉伸强度, 伸长率和热疲劳特性,因此适用于低温下的焊接工作,可以制造具有高可靠性,长使用寿命或耐久性的产品。 无铅锡银基焊接合金主要由Ag:2〜4重量%,Zn:0.5〜2重量%,Bi:2〜6重量%,余量基本上为Sn。