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    Method for manufacturing semiconductor device isolation region
    4.
    发明授权
    Method for manufacturing semiconductor device isolation region 失效
    制造半导体器件隔离区域的方法

    公开(公告)号：US5677229A

    公开(公告)日：1997-10-14

    申请号：US430300

    申请日：1995-04-28

    申请人： Shigeru Morita ,  Fumitomo Matsuoka ,  Hisao Yoshimura ,  Takeo Maeda

    发明人： Shigeru Morita ,  Fumitomo Matsuoka ,  Hisao Yoshimura ,  Takeo Maeda

    IPC分类号： H01L21/302 ,  H01L21/3065 ,  H01L21/76 ,  H01L21/762

    CPC分类号： H01L21/76237 ,  Y10S438/978

    摘要： A method for manufacturing a semiconductor device of the present invention has the step of forming an insulation material on a main surface of a semiconductor substrate. A groove is formed to extend from the surface of the material film to the substrate. The groove is buried with a first insulation film. By use of the first insulation film as an etching mask, the material film is removed, so that a projecting portion projecting to the first insulation film from the main surface can be obtained. A second insulation film is formed on a side surface of the projecting portion in a sloped shape, which is from the top portion of the projecting portion to the main surface.

    摘要翻译： 本发明的半导体器件的制造方法具有在半导体基板的主面上形成绝缘材料的工序。 形成从材料膜的表面延伸到基底的凹槽。 凹槽用第一绝缘膜掩埋。 通过使用第一绝缘膜作为蚀刻掩模，去除材料膜，从而可以获得从主表面突出到第一绝缘膜的突出部分。 第二绝缘膜以从突出部分的顶部到主表面的倾斜形状形成在突出部分的侧表面上。

    Spiral gasket having a centering spring
    5.
    发明授权
    Spiral gasket having a centering spring 失效
    螺旋垫圈具有定心弹簧

    公开(公告)号：US5609344A

    公开(公告)日：1997-03-11

    申请号：US500678

    申请日：1995-07-11

    申请人： Kenji Tamaoki ,  Hideaki Shimamoto ,  Masaki Kawada ,  Shigeru Morita ,  Michio Fujino ,  Youzi Hamazaki

    发明人： Kenji Tamaoki ,  Hideaki Shimamoto ,  Masaki Kawada ,  Shigeru Morita ,  Michio Fujino ,  Youzi Hamazaki

    IPC分类号： F16J15/12

    CPC分类号： F16J15/125

    摘要： A spiral gasket apparatus, capable of being held on an inclined flue gas outflow pipe without falling off therefrom, is constructed by winding a metal hoop member and a filler member, superposed on each other. A part of the hoop member from the beginning extremity of the hoop member on the inner side, which is wound as many as several turns to a welded fixed portion thereof, is raised inward by using the welded fixed portion as a fulcrum. An extremity portion thereof is folded back to form a superposition part. Since the raised part of the hoop member acts as a spring and is brought elastically into contact with an inclined flue gas outflow pipe, the gasket is held on the flue gas outflow pipe.

    摘要翻译： 通过卷绕叠置在一起的金属箍构件和填充构件，可以构成能够保持在倾斜烟道气流出管上而不脱落的螺旋形垫片装置。 通过使用焊接固定部作为支点，从内侧的箍部件的起始端部的一部分被卷绕到其焊接固定部分上多达数匝。 其末端部折回以形成叠合部。 由于环形构件的隆起部分作为弹簧起作用并且与倾斜的烟道气流出管弹性地接触，所以垫圈被保持在烟气流出管上。

    Molding machine
    7.
    发明授权
    Molding machine 失效

    公开(公告)号：US5507634A

    公开(公告)日：1996-04-16

    申请号：US297530

    申请日：1994-09-26

    申请人： Takefumi Kato ,  Shigeru Morita ,  Kiminori Sato

    发明人： Takefumi Kato ,  Shigeru Morita ,  Kiminori Sato

    IPC分类号： B29C31/04 ,  B29C37/00 ,  B29C43/02 ,  B29C43/34 ,  B29C43/50 ,  B29C47/00 ,  B29C69/00

    CPC分类号： B29C43/02 ,  B29C31/04 ,  B29C37/0003 ,  B29C43/34 ,  B29C43/50 ,  B29C47/00 ,  B29C47/0009 ,  B29K2021/00 ,  B29L2031/26 ,  Y10S425/806

    摘要： A molding machine has a mold material supply device, a die setting device, a separating device and a deburring device. The supply device includes a mold material feeding device, an extruding device for receiving a mold material from the mold material feeding device and extruding the mold material so as to form an extruded mold material, a cutting device for cutting the extruded mold material, and a transfer device for receiving the extruded mold material from the cutting device and transferring the same. The die setting device includes a distribution plate, a first mold die, a second mold die, a third mold die, four shafts, a first mold guide fixed to one of the shafts for receiving and supporting the distribution plate, a second mold guide fixed to another shaft for receiving and supporting the first mold die, a third mold guide fixed to another shaft for receiving and supporting the second mold die, a fourth mold guide for receiving and supporting the third mold die, and means for rotating and vertically moving the four shafts together with the respective mold dies and the respective mold guides and the distribution plate, wherein the distribution plate, the first mold die, the second mold die and the third mold die are positioned in order. The separating device includes a nipping device having a plurality of fixed claws and movable claws in combination for nipping the molding products remaining in the second mold die when the fixed and movable claws are closed and releasing the molded products when the fixed and movable claws are opened.

    Semiconductor memory device having improved write characteristic
    8.
    发明授权
    Semiconductor memory device having improved write characteristic 失效
    具有改善的写入特性的半导体存储器件

    公开(公告)号：US5357133A

    公开(公告)日：1994-10-18

    申请号：US982844

    申请日：1992-11-30

    申请人： Shigeru Morita

    发明人： Shigeru Morita

    IPC分类号： H01L21/8247 ,  H01L21/336 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792 ,  H01L29/78 ,  H01L27/02

    CPC分类号： H01L29/66825 ,  H01L29/7881 ,  H01L29/7885

    摘要： The present invention comprises a groove formed in a semiconductor substrate, a buried element isolation region formed in the groove, source and drain diffusion regions formed inside the buried element isolation region, an electrode wiring layer connected the buried element isolation region across the diffusion regions and constituted by a two-layered structure consisting of a control gate and a floating gate, and a side-wall diffusion region which extends along the groove, is in contact with the source and drain diffusion regions, and is formed at a position corresponding to at least the electrode wiring layer. As a result, the write characteristic of a non-volatile memory can be improved, and at the same time, the non-volatile memory can be micropatterned.

    摘要翻译： 本发明包括形成在半导体衬底中的沟槽，形成在沟槽中的掩埋元件隔离区，形成在掩埋元件隔离区内部的源极和漏极扩散区，连接扩散区上的掩埋元件隔离区的电极布线层和 由由控制栅极和浮动栅极组成的两层结构和沿着沟槽延伸的侧壁扩散区域构成，与源极和漏极扩散区域接触，并形成在对应于 至少电极布线层。 结果，可以提高非易失性存储器的写入特性，同时非易失性存储器可以被微型化。

    Rear wheel steerable working vehicle
    9.
    发明授权
    Rear wheel steerable working vehicle 失效
    后轮可转向作业车

    公开(公告)号：US5295553A

    公开(公告)日：1994-03-22

    申请号：US596136

    申请日：1990-10-11

    申请人： Shigeru Morita ,  Yoshihiro Kawahara ,  Yoshikazu Togoshi ,  Terutaka Takei

    发明人： Shigeru Morita ,  Yoshihiro Kawahara ,  Yoshikazu Togoshi ,  Terutaka Takei

    IPC分类号： B62D1/02 ,  B62D5/18 ,  B62D7/04 ,  B60K17/30

    CPC分类号： B62D7/04

    摘要： A working vehicle comprises front wheels, steerable rear wheels steerable up to a minimum radius turning region lying in a transverse direction substantially perpendicular to a longitudinal direction of a vehicle body, and a rear wheel control device for steering the rear wheels. A restraining device is provided for preventing the rear wheels from being steered to the minimum radius turning region by the rear wheel control device.

    摘要翻译： 工作车辆包括前轮，可转向的后轮，直到位于基本上垂直于车身纵向的横向方向的最小半径转向区域，以及用于转向后轮的后轮控制装置。 提供一种限制装置，用于防止后轮通过后轮控制装置转向最小半径转向区域。

    Semiconductor device having junction structure of a plurality of element isolation regions
    10.
    发明授权
    Semiconductor device having junction structure of a plurality of element isolation regions 失效
    具有多个元件隔离区域的结结构的半导体器件

    公开(公告)号：US5148258A

    公开(公告)日：1992-09-15

    申请号：US633801

    申请日：1990-12-26

    申请人： Shigeru Morita

    发明人： Shigeru Morita

    IPC分类号： H01L21/76 ,  H01L21/31 ,  H01L21/762

    CPC分类号： H01L21/76232 ,  H01L21/76202

    摘要： This invention relates to a junction structure in which element isolation regions having different shapes (e.g., isolation regions respectively formed by a trench isolation method and a LOCOS method) for electrically isolating an element region formed on a semiconductor substrate are bonded to each other. A LOCOS isolation region made of an insulator for electrically isolating many circuit elements of an element region formed on a semiconductor substrate is formed. An end portion of the insulating trench isolation region bonded to the LOCOS isolation region is formed to have a sectorial shape. When a side serving as an end portion of the LOCOS isolation region is bonded to tapered sides of the sectorial portion of the trench isolation region to cause the tapered sides to cross and overlap each other, an included angle serving as an angle defined by these isolation regions on the element region is an obtuse angle.

    摘要翻译： 本发明涉及一种结构结构，其中用于电绝缘形成在半导体衬底上的元件区域的不同形状的元件隔离区域（例如，通过沟槽隔离方法和LOCOS方法分别形成的隔离区域）彼此结合。 形成由用于电绝缘形成在半导体衬底上的元件区的许多电路元件的绝缘体制成的LOCOS隔离区。 结合到LOCOS隔离区域的绝缘沟槽隔离区域的端部形成为具有扇形形状。 当用作LOCOS隔离区域的端部的一侧被结合到沟槽隔离区域的扇形部分的锥形侧面以使得锥形侧面彼此交叉和重叠时，用作由这些隔离限定的角度的夹角 元件区域上的区域是钝角。