Nitride semiconductor device comprising bonded substrate and fabrication method of the same
    1.
    发明授权
    Nitride semiconductor device comprising bonded substrate and fabrication method of the same 有权
    包含键合衬底的氮化物半导体器件及其制造方法

    公开(公告)号:US07378334B2

    公开(公告)日:2008-05-27

    申请号:US11344197

    申请日:2006-02-01

    IPC分类号: H01L21/20

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。 在p型氮化物半导体层8上形成包含多于一个金属层的第一结合层。 具有第一面和第二面的支撑衬底的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于用于生长氮化物半导体的衬底1的热膨胀系数。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Nitride semiconductor device comprising bonded substrate and fabrication method of the same
    2.
    发明授权
    Nitride semiconductor device comprising bonded substrate and fabrication method of the same 有权
    包含键合衬底的氮化物半导体器件及其制造方法

    公开(公告)号:US08030665B2

    公开(公告)日:2011-10-04

    申请号:US12113030

    申请日:2008-04-30

    IPC分类号: H01L29/26

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。第一接合层包括更多 在p型氮化物半导体层8上形成一层以上的金属层。具有第一面和第二面的支撑基板的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于基板1的热膨胀系数 用于生长氮化物半导体。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Nitride semiconductor device comprising bonded substrate and fabrication method of the same
    3.
    发明授权
    Nitride semiconductor device comprising bonded substrate and fabrication method of the same 有权
    包含键合衬底的氮化物半导体器件及其制造方法

    公开(公告)号:US07105857B2

    公开(公告)日:2006-09-12

    申请号:US10614342

    申请日:2003-07-08

    IPC分类号: H01L31/12

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。第一接合层包括更多 在p型氮化物半导体层8上形成一层以上的金属层。具有第一面和第二面的支撑基板的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于基板1的热膨胀系数 用于生长氮化物半导体。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Nitride Semiconductor Device Comprising Bonded Substrate and Fabrication Method of the Same
    4.
    发明申请
    Nitride Semiconductor Device Comprising Bonded Substrate and Fabrication Method of the Same 有权
    包含粘结基板的氮化物半导体器件及其制造方法

    公开(公告)号:US20080296609A1

    公开(公告)日:2008-12-04

    申请号:US12113030

    申请日:2008-04-30

    IPC分类号: H01L33/00

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。第一接合层包括更多 在p型氮化物半导体层8上形成一层以上的金属层。具有第一面和第二面的支撑基板的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于基板1的热膨胀系数 用于生长氮化物半导体。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Information providing system, information providing method and information providing record medium
    8.
    发明授权
    Information providing system, information providing method and information providing record medium 有权
    信息提供系统,信息提供方法和信息提供记录介质

    公开(公告)号:US08190603B2

    公开(公告)日:2012-05-29

    申请号:US12196816

    申请日:2008-08-22

    申请人: Daisuke Morita

    发明人: Daisuke Morita

    IPC分类号: G06F17/30

    CPC分类号: G06F17/30864

    摘要: An information providing system which provides accumulated information items in compliance with requests has an association unit which totals access logs to the information items in each predetermined access unit. The association unit associates the plurality of information items accessed in the predetermined access unit as relevant information items. The information providing system also has an information providing unit which provides a requested information item when any of the plurality of information items associated by the association unit has been requested and which simultaneously provides any other information associated with the requested information or an access portion to the other information.

    摘要翻译: 提供符合请求的累积信息项的信息提供系统具有将每个预定访问单元中的信息项总计访问日志的关联单元。 关联单元将在预定访问单元中访问的多个信息项关联为相关信息项。 信息提供系统还具有信息提供单元,该信息提供单元当已经请求了由关联单元关联的多个信息项中的任何一个时提供所请求的信息项,并且同时提供与所请求的信息相关联的任何其他信息或访问部分 其他信息。

    Light emitting device
    9.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US06738175B2

    公开(公告)日:2004-05-18

    申请号:US10149755

    申请日:2002-06-13

    IPC分类号: G02F103

    摘要: To enhance the emission output of the light emitting device including an active layer made of nitride semiconductor containing In, the light emitting device having an active layer between the n-type semiconductor layer and the p-type semiconductor layer, characterized in that the active layer comprises an well layer made of Inx1Ga1−x1N (x1>0) containing In and a first barrier layer made of Aly2Ga1−y2N (y2>0) containing Al formed on the well layer.

    摘要翻译: 为了增强发光器件的发射输出,其包括由包含In的氮化物半导体制成的有源层,发光器件在n型半导体层和p型半导体层之间具有有源层,其特征在于,所述有源层 包含由In构成的In x 1 Ga 1-x1 N(x1> 0)的阱层和在阱层上形成的含Al的AlI 2 Ga 1-y 2 N(y2> 0)的第一势垒层。