Nitride semiconductor device comprising bonded substrate and fabrication method of the same
    1.
    发明授权
    Nitride semiconductor device comprising bonded substrate and fabrication method of the same 有权
    包含键合衬底的氮化物半导体器件及其制造方法

    公开(公告)号:US07378334B2

    公开(公告)日:2008-05-27

    申请号:US11344197

    申请日:2006-02-01

    IPC分类号: H01L21/20

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。 在p型氮化物半导体层8上形成包含多于一个金属层的第一结合层。 具有第一面和第二面的支撑衬底的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于用于生长氮化物半导体的衬底1的热膨胀系数。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Semiconductor device
    2.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07358522B2

    公开(公告)日:2008-04-15

    申请号:US10250453

    申请日:2002-11-05

    申请人: Tomoya Yanamoto

    发明人: Tomoya Yanamoto

    IPC分类号: H01S5/00

    摘要: A semiconductor device comprises an active layer having a quantum well structure, the active layer including a well layer and a barrier layer and being sandwiched by a first conductivity type layer and a second conductivity type layer, wherein a first barrier layer is provided on side of the first conductivity type layer in the active layer and a second barrier layer is provided on the side of the second conductivity type layer in the active layer, at least one well layer is sandwiched thereby, and the second barrier layer has a band gap energy lower than that of the first barrier layer in the form of asymmetric barrier layer structure, where the second conductivity type layer preferably includes a carrier confinement layer having a band gap energy higher than that of the first barrier layer, resulting in a reverse structure in each of conductivity type layer in respect to the asymmetric structure of the active layer to provide a waveguide structure having excellent crystallinity and device characteristics in the nitride semiconductor light emitting device operating at a wavelength of 380 nm or shorter.

    摘要翻译: 半导体器件包括具有量子阱结构的有源层,所述有源层包括阱层和阻挡层,并被第一导电型层和第二导电型层夹在中间,其中第一势垒层设置在 有源层中的第一导电类型层和第二阻挡层设置在有源层中的第二导电类型层的一侧上,至少一个阱层被夹在其中,并且第二势垒层具有较低的带隙能量 其中第二导电类型层优选地包括具有比第一阻挡层的带隙能量高的带隙能量的载流子限制层,从而导致每个中的阻挡层的反向结构 相对于有源层的不对称结构的导电类型层,以提供具有优异结晶度的波导结构和d 氮化物半导体发光器件在380nm或更短波长下工作的器件特性。

    Nitride semiconductor device comprising bonded substrate and fabrication method of the same
    3.
    发明授权
    Nitride semiconductor device comprising bonded substrate and fabrication method of the same 有权
    包含键合衬底的氮化物半导体器件及其制造方法

    公开(公告)号:US08030665B2

    公开(公告)日:2011-10-04

    申请号:US12113030

    申请日:2008-04-30

    IPC分类号: H01L29/26

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。第一接合层包括更多 在p型氮化物半导体层8上形成一层以上的金属层。具有第一面和第二面的支撑基板的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于基板1的热膨胀系数 用于生长氮化物半导体。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Nitride Semiconductor Device Comprising Bonded Substrate and Fabrication Method of the Same
    5.
    发明申请
    Nitride Semiconductor Device Comprising Bonded Substrate and Fabrication Method of the Same 有权
    包含粘结基板的氮化物半导体器件及其制造方法

    公开(公告)号:US20080296609A1

    公开(公告)日:2008-12-04

    申请号:US12113030

    申请日:2008-04-30

    IPC分类号: H01L33/00

    摘要: A substrate 1 for growing nitride semiconductor has a first and second face and has a thermal expansion coefficient that is larger than that of the nitride semiconductor. At least n-type nitride semiconductor layers 3 to 5, an active layer 6 and p-type nitride semiconductor layers 7 to 8 are laminated to form a stack of nitride semiconductor on the first face of the substrate 1. A first bonding layer including more than one metal layer is formed on the p-type nitride semiconductor layer 8. A supporting substrate having a first and second face has a thermal expansion coefficient that is larger than that of the nitride semiconductor and is equal or smaller than that of the substrate 1 for growing nitride semiconductor. A second bonding layer including more than one metal layer is formed on the first face of the supporting substrate. The first bonding layer 9 and the second bonding layer 11 are faced with each other and, then, pressed with heat to bond together. After that, the substrate 1 for growing nitride semiconductor is removed from the stack of nitride semiconductor so that a nitride semiconductor device is provided.

    摘要翻译: 用于生长氮化物半导体的衬底1具有第一面和第二面,其热膨胀系数大于氮化物半导体的热膨胀系数。 至少n型氮化物半导体层3至5,有源层6和p型氮化物半导体层7至8层叠以在衬底1的第一面上形成氮化物半导体层。第一接合层包括更多 在p型氮化物半导体层8上形成一层以上的金属层。具有第一面和第二面的支撑基板的热膨胀系数大于氮化物半导体的热膨胀系数,并且等于或小于基板1的热膨胀系数 用于生长氮化物半导体。 在支撑基板的第一面上形成包括多于一个金属层的第二粘接层。 第一接合层9和第二接合层11彼此面对,然后被加热压合以结合在一起。 之后,从氮化物半导体堆叠中去除用于生长氮化物半导体的衬底1,从而提供氮化物半导体器件。

    Semiconductor Device
    6.
    发明申请
    Semiconductor Device 有权
    半导体器件

    公开(公告)号:US20080203418A1

    公开(公告)日:2008-08-28

    申请号:US12035324

    申请日:2008-02-21

    申请人: Tomoya Yanamoto

    发明人: Tomoya Yanamoto

    IPC分类号: H01L33/00

    摘要: A semiconductor device comprises an active layer having a quantum well structure, the active layer including a well layer and a barrier layer and being sandwiched by a first conductivity type layer and a second conductivity type layer, wherein a first barrier layer is provided on side of the first conductivity type layer in the active layer and a second barrier layer is provided on the side of the second conductivity type layer in the active layer, at least one well layer is sandwiched thereby, and the second barrier layer has a band gap energy lower than that of the first barrier layer in the form of asymmetric barrier layer structure, where the second conductivity type layer preferably includes a carrier confinement layer having a band gap energy higher than that of the first barrier layer, resulting in a reverse structure in each of conductivity type layer in respect to the asymmetric structure of the active layer to provide a waveguide structure having excellent crystallinity and device characteristics in the nitride semiconductor light emitting device operating at a wavelength of 380 nm or shorter.

    摘要翻译: 半导体器件包括具有量子阱结构的有源层,所述有源层包括阱层和阻挡层,并被第一导电型层和第二导电型层夹在中间,其中第一势垒层设置在 有源层中的第一导电类型层和第二阻挡层设置在有源层中的第二导电类型层的一侧上,至少一个阱层被夹在其中,并且第二势垒层具有较低的带隙能量 其中第二导电类型层优选地包括具有比第一阻挡层的带隙能量高的带隙能量的载流子限制层,从而导致每个中的阻挡层的反向结构 相对于有源层的不对称结构的导电类型层,以提供具有优异结晶度的波导结构和d 氮化物半导体发光器件在380nm或更短波长下工作的器件特性。

    Semiconductor device
    10.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07667226B2

    公开(公告)日:2010-02-23

    申请号:US12035324

    申请日:2008-02-21

    申请人: Tomoya Yanamoto

    发明人: Tomoya Yanamoto

    IPC分类号: H01S5/00

    摘要: A semiconductor device comprises an active layer having a quantum well structure, the active layer including a well layer and a barrier layer and being sandwiched by a first conductivity type layer and a second conductivity type layer, wherein a first barrier layer is provided on side of the first conductivity type layer in the active layer and a second barrier layer is provided on the side of the second conductivity type layer in the active layer, at least one well layer is sandwiched thereby, and the second barrier layer has a band gap energy lower than that of the first barrier layer in the form of asymmetric barrier layer structure, where the second conductivity type layer preferably includes a carrier confinement layer having a band gap energy higher than that of the first barrier layer, resulting in a reverse structure in each of conductivity type layer in respect to the asymmetric structure of the active layer to provide a waveguide structure having excellent crystallinity and device characteristics in the nitride semiconductor light emitting device operating at a wavelength of 380 nm or shorter.

    摘要翻译: 半导体器件包括具有量子阱结构的有源层,所述有源层包括阱层和阻挡层,并被第一导电型层和第二导电型层夹在中间,其中第一势垒层设置在 有源层中的第一导电类型层和第二阻挡层设置在有源层中的第二导电类型层的一侧上,至少一个阱层被夹在其中,并且第二势垒层具有较低的带隙能量 其中第二导电类型层优选地包括具有比第一阻挡层的带隙能量高的带隙能量的载流子限制层,从而导致每个中的阻挡层的反向结构 相对于有源层的不对称结构的导电类型层,以提供具有优异结晶度的波导结构和d 氮化物半导体发光器件在380nm或更短波长下工作的器件特性。