公开(公告)号：US06825249B1

公开(公告)日：2004-11-30

申请号：US09616943

申请日：2000-07-14

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： C08K300

CPC分类号： H01L24/27 ,  H01L21/4821 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.

摘要翻译： 提供了一种用于在引线框上依次加热和压接薄膜状有机芯片接合材料的层压方法和机器。将框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置B. 在位置B的压接元件压制薄膜后，将薄片状的有机芯片接合材料2安装在芯片上。因此，可以将薄膜状的有机模片接合材料压缩 引导框架，生产效率高，但没有空隙，并进一步避免了在安装芯片时的封装破裂。

公开(公告)号：US6099678A

公开(公告)日：2000-08-08

申请号：US875330

申请日：1997-06-25

申请人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

发明人： Akio Kotato ,  Yuusuke Miyamae ,  Tadaji Satou ,  Makoto Saitou ,  Tooru Kikuchi ,  Akira Kageyama ,  Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Yasuo Miyadera ,  Mituo Yamasaki ,  Iwao Maekawa ,  Aizou Kaneda

IPC分类号： H01L21/58 ,  H01L21/60 ,  B32B31/00 ,  B23P19/00 ,  B32B35/00 ,  H05K3/30

CPC分类号： H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/12 ,  Y10T156/1322 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/53178

摘要： A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

摘要翻译： PCT No.PCT / JP95 / 02691 Sec。 371日期：1997年6月25日 102（e）日期1997年6月25日PCT 1995年12月26日PCT PCT。 公开号WO96 / 29730 日期1996年9月26日提供层压方法和机器，用于在引线框上以良好的生产率连续加热和压接粘合材料，但没有空隙，并且进一步避免了在安装芯片时的封装破裂。 引线框架7放置在行进台8上并在那里被加热。 将膜状有机芯片接合材料2冲压出来，将所得的薄膜粘合到引线框架上的芯片焊盘上。 然后将其上粘贴有胶片的引线框架通过移动台移动到位置b。 在位置B的压接元件压制薄膜后，在薄膜状有机芯片接合材料2上安装芯片。

公开(公告)号：US4986869A

公开(公告)日：1991-01-22

申请号：US307937

申请日：1989-02-09

申请人： Yoshiaki Tomisawa ,  Tadaji Satou ,  Nobuyuki Hayashi ,  Yusuke Miyamae

发明人： Yoshiaki Tomisawa ,  Tadaji Satou ,  Nobuyuki Hayashi ,  Yusuke Miyamae

IPC分类号： H05K3/38 ,  B29C63/02 ,  B29L9/00 ,  B32B37/22 ,  G03F1/00 ,  G03F7/16 ,  H05K3/06 ,  H05K3/28

CPC分类号： B32B37/226 ,  B32B38/185 ,  H05K3/281 ,  B29C2791/006 ,  B29L2031/3425 ,  B32B2309/68 ,  H05K2203/068 ,  H05K2203/085 ,  Y10T156/1052 ,  Y10T156/1343

摘要： In this method for reduced pressure lamination of a light sensitive material in film form to a printed circuit base board, when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board under reduced pressure, a main container for carrying out the adhesion and an intake container and an exit container connected thereto are provided, the base board is supplied to the intake container set to atmospheric pressure, and thereafter the pressure in the intake container is reduced, next the base board is supplied into the main container at reduced pressure and the light sensitive material in film form is adhered to the base board, next the light sensitive material in film form is in the case that it is continuous to the dimensions of the base board, and after supplying the base board to which the light sensitive material in film form has been adhered to the exit container at reduced pressure, the exit container is set to atmospheric pressure and the base board to which the light sensitive material in film form has been ahdered is ejected from the exit container. A reduced pressure adhesion device is also described for performing the method.

摘要翻译： 在这种将薄膜形式的感光材料减压层压到印刷电路基板的方法中，当将感光材料粘合到膜形式中时，包括连续或切割到基板的尺寸的柔性支撑件和光敏感 在减压下向印刷电路基板施加层，设置用于进行粘合的主容器和与其连接的进气容器和出口容器，将基板供给到设定为大气压的进气容器，然后将压力 在进气容器内减少，接下来基板在减压下被供给到主容器中，并且将膜形式的感光材料粘附到基板上，接下来，薄膜形式的感光材料是在 在基板的尺寸连续，并且在供给已经粘附有膜形式的感光材料的基板之后 在出口容器的减压下将出口容器设定为大气压，将从膜形成的感光材料成形的基板从出口容器中排出。 还描述了用于执行该方法的减压粘合装置。