SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF 有权
    表面声波装置及其制造方法

    公开(公告)号:US20070057597A1

    公开(公告)日:2007-03-15

    申请号:US11470933

    申请日:2006-09-07

    申请人: Shinya AOKI

    发明人: Shinya AOKI

    IPC分类号: H03H9/25

    CPC分类号: H03H9/1092 H03H3/08

    摘要: A surface acoustic wave device includes: an IDT electrode formed at a main surface of a piezoelectric substrate, an extraction electrode extracted from the IDT electrode; a surface acoustic wave chip having a metal junction formed along a periphery of the main surface of the piezoelectric substrate; a contact electrode made of an insulating material, connecting to the extraction electrode formed at one main surface thereof; an external electrode formed at the other main surface of the contact electrode; and a cover substrate having a through-hole electrode for connecting the contact electrode to the external electrode. The IDT electrode and the extraction electrode are hermetically sealed in an interior of the space formed by bonding the surface acoustic wave chip to the cover substrate through the metal junction. The interior of the space contains an auxiliary section having enough height to prevent the cover substrate from coming in contact with the IDT electrode even in the case of distortion in the piezoelectric substrate or the cover substrate, the auxiliary section formed at the main surface of the piezoelectric substrate.

    摘要翻译: 表面声波装置包括:形成在压电基板的主表面上的IDT电极,从IDT电极提取的引出电极; 表面声波芯片,其具有沿着压电基板的主表面的周边形成的金属结; 由绝缘材料制成的接触电极,连接到在其一个主表面上形成的引出电极; 形成在所述接触电极的另一个主表面上的外部电极; 以及具有用于将接触电极连接到外部电极的通孔电极的盖基板。 IDT电极和引出电极通过金属接合部将表面声波芯片与覆盖基板接合而形成的空间的内部气密地密封。 空间的内部包含具有足够高度的辅助部分,以防止盖基板与IDT电极接触,即使在压电基板或盖基板的变形的情况下,辅助部分形成在 压电基片。

    METHOD FOR MANUFACTURING A PIEZOELECTRIC VIBRATION DEVICE
    7.
    发明申请
    METHOD FOR MANUFACTURING A PIEZOELECTRIC VIBRATION DEVICE 有权
    制造压电振动装置的方法

    公开(公告)号:US20070006434A1

    公开(公告)日:2007-01-11

    申请号:US11428097

    申请日:2006-06-30

    申请人: Shinya AOKI

    发明人: Shinya AOKI

    IPC分类号: H04R17/00 H05K3/20

    摘要: Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole to the cover so that a profile of an edge of an opening of the through hole at a first surface of the cover is positioned inside an outer shape of the taking out electrode in a plan view when the cover and the piezoelectric substrate are overlapped; forming a first glass film on the first surface of the cover; forming a second glass film on the first surface of the cover; bonding the first glass film to the taking out electrode as well as the second glass film to the bonding electrode by generating an electric field; and cutting an electrical coupling between the taking out electrode and the bonding electrode after step (e).

    摘要翻译: 制造压电振动装置包括:在与盖接触的压电基板的一部分上形成接合电极; 形成向所述盖形成通孔的部分,使得所述盖的第一表面处的所述通孔的开口的边缘的轮廓在所述盖和所述盖的平面图中位于所述取出电极的外部形状的内部 压电基板重叠; 在所述盖的第一表面上形成第一玻璃膜; 在所述盖的第一表面上形成第二玻璃膜; 通过产生电场将第一玻璃膜与取出电极以及第二玻璃膜接合到接合电极; 以及在步骤(e)之后切割取出电极和接合电极之间的电耦合。

    THROUGH-HOLE FORMING METHOD, AND PIEZOELECTRIC DEVICE MANUFACTURING METHOD AND PIEZOELECTRIC DEVICE MANUFACTURED THEREBY
    8.
    发明申请
    THROUGH-HOLE FORMING METHOD, AND PIEZOELECTRIC DEVICE MANUFACTURING METHOD AND PIEZOELECTRIC DEVICE MANUFACTURED THEREBY 失效
    通孔形成方法和压电器件制造方法及其制造的压电器件

    公开(公告)号:US20070058003A1

    公开(公告)日:2007-03-15

    申请号:US11470543

    申请日:2006-09-06

    申请人: Shinya AOKI

    发明人: Shinya AOKI

    IPC分类号: B41J2/045

    摘要: In a method of forming a part of a through-hole for a piezoelectric substrate having an excitation electrode and a leading electrode which are formed on a first surface of the piezoelectric substrate and are made of a thin metal film in order to establish a conductivity, the method includes: blasting a position on a second surface of the piezoelectric substrate corresponding to the leading electrode to form a preliminary hole by boring the piezoelectric substrate in its halfway; etching a bottom of the preliminary hole to form a part of a through-hole through which a part of the leading electrode is exposed; and placing a conductive material in the part of a through-hole, the conductive material contacting the leading electrode from a side of the second surface of the piezoelectric substrate.

    摘要翻译: 在形成具有激励电极和引出电极的压电基片的通孔的一部分的方法中,所述激励电极和引出电极形成在压电基片的第一表面上,并由金属薄膜制成以形成导电性, 该方法包括:在压电基板的与引出电极相对应的第二表面上的位置上,通过在其一半中镗压压基板来形成预备孔; 蚀刻预备孔的底部以形成引导电极的一部分暴露在其中的通孔的一部分; 并且将导电材料放置在通孔的一部分中,所述导电材料从所述压电基板的第二表面的一侧接触所述引导电极。