利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

80 条记录 (耗时 0.032 秒)

    Speaker edge, method of foam-molding the same, apparatus for foam-molding the same, speaker edge foam-molding system, and speaker employing the speaker edge
    1.
    发明授权
    Speaker edge, method of foam-molding the same, apparatus for foam-molding the same, speaker edge foam-molding system, and speaker employing the speaker edge 有权
    扬声器边缘，泡沫成型方法，发泡成型装置，扬声器边缘发泡成型系统和使用扬声器边缘的扬声器

    公开(公告)号：US06680430B2

    公开(公告)日：2004-01-20

    申请号：US10149621

    申请日：2002-07-01

    申请人： Shinya Tabata ,  Shinya Mizone ,  Yoshiyuki Takahashi ,  Kiyoshi Ikeda ,  Hiroko Yamazaki ,  Shinji Okuda ,  Masaharu Takada

    发明人： Shinya Tabata ,  Shinya Mizone ,  Yoshiyuki Takahashi ,  Kiyoshi Ikeda ,  Hiroko Yamazaki ,  Shinji Okuda ,  Masaharu Takada

    IPC分类号： G10D1500

    CPC分类号： H04R31/006 ,  B29C44/1271 ,  B29C44/3415 ,  B29C2035/0811 ,  H04R7/20 ,  H04R2231/003 ,  H04R2307/204

    摘要： A speaker edge is made of a thermosetting composition consisting of a polyurethane prepolymer and an inactivated solid polyamine as a latent hardener. A gas is dispersed in the thermosetting composition, prior to feed into a mold, so that it can foam and solidify to give the speaker edge. In a method of making the speaker edge, the composition will be injected into a female mold segment heated below the critical thermosetting temperature, foaming the composition. Then placed in the female segment is a male segment heated above the critical temperature, causing the ingredients to react with each other to solidify in the mold. An apparatus for making the speaker edge from the composition has: a device for intake of a gas, another device for injecting the composition into the gas, another device for mechanically dispersing the gas throughout the composition, still another device for injection of this gas-containing composition into a female mold segment, a further device for placing a male segment in the female segment, and a still further device for solidifying the composition, while foaming it.

    摘要翻译： 扬声器边缘由由聚氨酯预聚物和灭活的固体多胺作为潜在硬化剂组成的热固性组合物制成。 在进入模具之前，将气体分散在热固性组合物中，使得其可以发泡和固化以产生扬声器边缘。 在制造扬声器边缘的方法中，组合物将被注入加热到临界热固化温度以下的母模段中，使组合物发泡。 然后放置在女性节段中是加热到临界温度以上的雄性节段，导致成分彼此反应以在模具中固化。 用于从组合物制造扬声器边缘的装置具有：用于吸入气体的装置，用于将组合物注入到气体中的另一装置，用于将气体机械分散在整个组合物中的另一装置， 含有母体的组合物，用于将雌性片段放置在雌性片段中的另一种装置，以及用于固化组合物而使其发泡的另一种装置。

    Elastic strip material and process and apparatus for producing the same
    5.
    发明申请
    Elastic strip material and process and apparatus for producing the same 审中-公开
    弹性带材及其制造方法和装置

    公开(公告)号：US20070116924A1

    公开(公告)日：2007-05-24

    申请号：US10582220

    申请日：2004-12-13

    申请人： Shinya Mizone ,  Yoshiyuki Takahashi ,  Satoshi Tanaka ,  Toshiyuki Toumura

    发明人： Shinya Mizone ,  Yoshiyuki Takahashi ,  Satoshi Tanaka ,  Toshiyuki Toumura

    IPC分类号： B32B3/04 ,  B29C44/20

    CPC分类号： B29C39/38 ,  B29C39/14 ,  B29C44/20 ,  B29C44/302 ,  B29C48/06 ,  B29C48/12 ,  B29C48/30 ,  B29C48/303 ,  B29K2105/04 ,  Y10T428/24198 ,  Y10T428/2902

    摘要： [OBJECTS] To provide an elastic strip material that has a cross-sectional shape suited to intended uses such as seals or cushions, as well as a method of and an apparatus for mass-producing the strip material efficiently and inexpensively. [MEANS FOR ACHIEVING THE OBJECTS] A heat setting composition is used whose main ingredients are a polyurethane prepolymer and a latent solidifier obtained by deactivating a solid polyamine. A compressed gas is dispersed throughout the composition to give a fluid mixture ‘a’, that is then foamed and heated to or above a critical temperature to solidify as the strip material. The fluid mixture ‘a’ is extruded from an extruder (1), guided into a liquid or gaseous heating zone (2), caused to solidify during travel within the zone, and shaped at the same time into a desired configuration before discharged from the zone (2).

    摘要翻译： 本发明提供一种弹性带状材料，其具有适合于诸如密封件或垫子的预期用途的横截面形状，以及用于高效且低成本地批量生产条带材料的方法和装置。 [实现对象的手段]使用热定型组合物，其主要成分是聚氨酯预聚物和通过使固体多胺失活获得的潜在固化剂。 将压缩气体分散在整个组合物中，得到流体混合物“a”，然后将其发泡并加热至临界温度或高于临界温度以固化成条状材料。 将流体混合物'a'从挤出机（1）挤出，引导到液体或气体加热区（2）中，在区内行进期间固化，同时成形为期望的形状，然后从 区（2）。

    Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
    7.
    发明授权
    Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material 失效
    可固化树脂组合物，其固化产物，酚醛树脂，环氧树脂和半导体密封材料

    公开(公告)号：US08703845B2

    公开(公告)日：2014-04-22

    申请号：US13822453

    申请日：2011-09-27

    申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

    发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

    IPC分类号： C08G59/32 ,  C08G59/62 ,  C08G59/06 ,  C08G61/02 ,  C08L63/00 ,  H01L21/56

    CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

    摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

    摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。

    Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin
    8.
    发明授权
    Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin 有权
    环氧树脂组合物及其固化制品，半导体封装材料，新型酚醛树脂和新型环氧树脂

    公开(公告)号：US08440781B2

    公开(公告)日：2013-05-14

    申请号：US12634259

    申请日：2009-12-09

    申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

    发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

    IPC分类号： C08G65/48 ,  C08G65/38 ,  C08L61/00 ,  C08L61/06 ,  C08L63/00

    CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

    摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂 材料。

    Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin
    9.
    发明授权
    Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin 有权
    环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法

    公开(公告)号：US07985822B2

    公开(公告)日：2011-07-26

    申请号：US11661095

    申请日：2005-08-31

    申请人： Ichiro Ogura ,  Yoshiyuki Takahashi ,  Kazuo Arita ,  Kunihiro Morinaga ,  Yutaka Satou

    发明人： Ichiro Ogura ,  Yoshiyuki Takahashi ,  Kazuo Arita ,  Kunihiro Morinaga ,  Yutaka Satou

    IPC分类号： C08G59/00

    CPC分类号： C08G8/10 ,  C08G59/621 ,  C08L61/06

    摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

    摘要翻译： 包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族 烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。