公开(公告)号：US20170094799A1

公开(公告)日：2017-03-30

申请号：US14866648

申请日：2015-09-25

申请人： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

发明人： Shipeng Qiu ,  Shawna Liff ,  Kayleen L. Helms ,  Joshua D. Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC分类号： H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/22 ,  H05K3/30 ,  H05K1/02 ,  H05K3/36

CPC分类号： H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

摘要： An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

公开(公告)号：US20150171017A1

公开(公告)日：2015-06-18

申请号：US14104210

申请日：2013-12-12

申请人： Frank Evans ,  Shipeng Qiu ,  Dhruv Bhate ,  Sergei Voronov ,  Tao Wang

发明人： Frank Evans ,  Shipeng Qiu ,  Dhruv Bhate ,  Sergei Voronov ,  Tao Wang

IPC分类号： H01L23/544 ,  B23K26/36 ,  B23K26/08 ,  B23K26/06 ,  H01L21/3105 ,  H01L21/67

CPC分类号： H01L23/544 ,  B23K26/0626 ,  B23K26/082 ,  B23K26/362 ,  H01L21/3105 ,  H01L21/67282 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.

摘要翻译： 提供了设备，系统和方法以在管芯或衬底的表面上产生标记。 标记代表信息。 标记可以使用激光退火到模具或衬底的表面上。 另一个实施例可以使用离焦激光束来标记阻焊材料。