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公开(公告)号：US20170094799A1
公开(公告)日：2017-03-30
申请号：US14866648
申请日：2015-09-25
申请人： Shipeng Qiu , Shawna Liff , Kayleen L. Helms , Joshua D. Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
发明人： Shipeng Qiu , Shawna Liff , Kayleen L. Helms , Joshua D. Heppner , Adel Elsherbini , Johanna Swan , Gary M. Barnes
CPC分类号： H05K1/189 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/144 , H05K3/0014 , H05K3/22 , H05K3/303 , H05K3/326 , H05K3/361 , H05K2201/0133 , H05K2201/0308 , H05K2201/041 , H05K2201/047 , H05K2201/057 , H05K2201/10007 , H05K2201/10128 , H05K2203/10 , H05K2203/104 , H05K2203/105 , H05K2203/1105 , H05K2203/1194
摘要： An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
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公开(公告)号：US20150163921A1
公开(公告)日：2015-06-11
申请号：US14102676
申请日：2013-12-11
申请人： Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
发明人： Sasha Oster , Robert L. Sankman , Charles Gealer , Omkar Karhade , John S. Guzek , Ravi V. Mahajan , James C. Matayabas, JR. , Johanna Swan , Feras Eid , Shawna Liff , Timothy McIntosh , Telesphor Teles Kamgaing , Adel Elsherbini , Kemal Aygun
CPC分类号： H05K1/189 , G06F1/163 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/181 , H01L2924/18162 , H05K1/0393 , H05K1/181 , H05K1/185 , H05K13/0469 , H05K2201/0137 , H05K2203/1469 , Y10T29/49146 , H01L2924/00
摘要： This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.
摘要翻译： 本公开一般涉及用于制造柔性微电子组件的装置，系统和方法。 在一个实例中，聚合物模制在微电子部件上，聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层，布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具，聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。
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公开(公告)号：US20190200451A1
公开(公告)日：2019-06-27
申请号：US16328532
申请日：2016-09-29
申请人： SASHA OSTER , Georgios Dogiamis , TELESPHOR KAMGAING , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN
发明人： SASHA OSTER , Georgios Dogiamis , TELESPHOR KAMGAING , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN
CPC分类号： H05K1/0243 , H01L23/66 , H01L25/0655 , H01L25/117 , H01L25/16 , H01L25/165 , H05K1/141 , H05K3/366 , H05K2201/10545
摘要： A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.
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公开(公告)号：US20190190106A1
公开(公告)日：2019-06-20
申请号：US16328524
申请日：2016-09-30
申请人： TELESPHOR KAMGAING , SASHA OSTER , Georgios Dogiamis , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN , Brandon Rawlings
发明人： TELESPHOR KAMGAING , SASHA OSTER , Georgios Dogiamis , Adel Elsherbini , Shawna Liff , Aleksandar Aleksov , JOHANNA SWAN , Brandon Rawlings
摘要： Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.
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公开(公告)号：US20170094774A1
公开(公告)日：2017-03-30
申请号：US14866614
申请日：2015-09-25
申请人： Adel Elsherbini , Aleksandar Aleksov , Shawna Liff
发明人： Adel Elsherbini , Aleksandar Aleksov , Shawna Liff
CPC分类号： H05K1/028 , H05K1/0283 , H05K1/0393 , H05K1/115 , H05K1/118 , H05K1/181 , H05K3/22 , H05K3/284 , H05K3/301 , H05K3/4691 , H05K2201/05 , H05K2201/057 , H05K2201/09263 , H05K2201/095 , H05K2203/1316
摘要： Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.
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公开(公告)号：US20220415854A1
公开(公告)日：2022-12-29
申请号：US17359481
申请日：2021-06-25
申请人： Georgios Dogiamis , Adel Elsherbini , Qiang Yu , Shawna Liff , Beomseok Choi
发明人： Georgios Dogiamis , Adel Elsherbini , Qiang Yu , Shawna Liff , Beomseok Choi
IPC分类号： H01L25/065 , H01L27/06 , H01L49/02 , H01L23/66
摘要： Apparatus and methods are disclosed. In one example, a semiconductor package includes a first die that has a first surface and a first electrical lead at or near the first surface. The semiconductor package also includes a substrate that has a second surface and is coupled to the first die at a first interface. The substrate also includes a first electrode at or near the second surface and at least a first portion of an integrated passive device that is coupled to the first electrode. The first electrode is aligned with and coupled to the first electrical lead across the first interface.
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公开(公告)号：US20150171523A1
公开(公告)日：2015-06-18
申请号：US14104296
申请日：2013-12-12
CPC分类号： H01Q21/22 , G06K19/077 , H01L24/20 , H01L24/82 , H01L2223/6677 , H01L2224/16227 , H01L2924/15153 , H01L2924/15321 , H01Q21/0025 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , H01Q23/00
摘要： Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.
摘要翻译： 本文描述的实施例通常涉及相控阵天线系统或封装以及制造和使用系统和封装的技术。 相控阵天线封装可以包括分布式相控阵天线，其包括（1）多个天线子阵列，每个天线子阵列可以包括多个天线，（2）多个射频模块（RFD），每个RFD 位于通过多条迹线的迹线靠近并电耦合到多个天线子阵列中的对应天线子阵列，以及（3）其中多条迹线中的每条迹线被配置为电耦合多个天线子阵列中的天线 的天线连接到位于天线附近的RFD，其中多个迹线的每个迹线被配置为传输毫米波（mm-波）无线电信号，并且其中多个迹线各自具有基本均匀的长度。
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公开(公告)号：US20170094749A1
公开(公告)日：2017-03-30
申请号：US14866625
申请日：2015-09-25
申请人： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
发明人： Adel Elsherbini , Sasha Oster , Nadine L. Dabby , Aleksandar Aleksov , Braxton Lathrop , Feras Eid
CPC分类号： H05B33/28 , A41B1/08 , A41D1/002 , A42B1/004 , A42B1/242 , F21V33/0008 , H05B33/04 , H05B33/06
摘要： Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.
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公开(公告)号：US20220413237A1
公开(公告)日：2022-12-29
申请号：US17359447
申请日：2021-06-25
申请人： Henning Braunisch , Adel Elsherbini
发明人： Henning Braunisch , Adel Elsherbini
IPC分类号： G02B6/42
摘要： Apparatus and methods of manufacture are disclosed. In one example the apparatus includes a first substrate that has a first surface, a first optical waveguide that is at or near the first surface of the first substrate, a second substrate that has a second surface. The second substrate is coupled to the first substrate at an interface. The apparatus also has a photonic integrated circuit (PIC) with a portion at or near the second surface. The PIC is in alignment with and optically coupled to the first optical waveguide across the interface.
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公开(公告)号：US20170083051A1
公开(公告)日：2017-03-23
申请号：US14859894
申请日：2015-09-21
申请人： Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
发明人： Nadine L. Dabby , Lakshman Krishnamurthy , Braxton Lathrop , Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Tom L. Simmons
IPC分类号： G06F1/16
CPC分类号： G06F1/1633 , H01L23/5385 , H01L23/5387 , H01L25/105 , H01L2225/1017 , H01L2225/1047 , H01L2924/00
摘要： Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.
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