Printed circuit board and method of manufacturing the same
    2.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号:US08822834B2

    公开(公告)日:2014-09-02

    申请号:US13187830

    申请日:2011-07-21

    IPC分类号: H05K1/00

    摘要: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

    摘要翻译: 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50%的反射率。

    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
    3.
    发明授权
    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display 有权
    用于光学膜,压敏粘合剂光学膜和图像显示器的压敏粘合剂组合物

    公开(公告)号:US08709597B2

    公开(公告)日:2014-04-29

    申请号:US12916959

    申请日:2010-11-01

    IPC分类号: B32B15/04

    摘要: There is provided a pressure-sensitive adhesive composition for optical films. The composition can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, which include the pressure-sensitive adhesive layer that has reworkability such that it can be easily peeled from a component, and that has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout, after it is formed on an optical film. A pressure-sensitive adhesive optical film produced using the composition is also provided. The pressure-sensitive adhesive composition includes a (meth)acrylic polymer including (a) 34 to 94% by weight of an alkyl (meth)acrylate monomer unit, (b) 5 to 35% by weight of an aromatic ring-containing (meth)acrylate monomer unit, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate monomer unit and further including (d) 0.05 to 3% by weight of a carboxyl group-containing (meth)acrylate monomer unit and/or (e) 0.05 to 2% by weight of a hydroxyl group-containing (meth)acrylate monomer unit and having a weight average molecular weight of 1,600,000 to 3,000,000 as determined by gel permeation chromatography; crosslinking agents including 0.01 to 5 parts by weight of an isocyanate crosslinking agent and 0.01 to 2 parts by weight of a silane coupling agent based on 100 parts by weight of the (meth)acrylic polymer.

    摘要翻译: 提供了一种用于光学膜的压敏粘合剂组合物。 该组合物可以形成一种压敏粘合剂层,其可以防止由与诸如光学膜的组分的尺寸变化相关的应力引起的光泄漏,其包括具有可再加工性的压敏粘合剂层,使得其可以容易地从 并且具有令人满意的加工性,使得其可以在形成在光学膜上之后可以被加工而没有压敏粘合剂污渍或脱落。 还提供了使用该组合物制备的压敏粘合剂光学膜。 压敏粘合剂组合物包括(甲基)丙烯酸类聚合物,其包含(a)34-94重量%的(甲基)丙烯酸烷基酯单体单元,(b)5-35重量%的含芳环的(甲基) )丙烯酸酯单体单元,(c)0.01〜0.5重量%的含氨基(甲基)丙烯酸酯单体单元,进一步含有(d)0.05〜3重量%的含羧基的(甲基)丙烯酸酯单体 单元和/或(e)0.05〜2重量%的含羟基的(甲基)丙烯酸酯单体单元,通过凝胶渗透色谱法测定的重均分子量为1,600,000至3,000,000; 交联剂,其包含0.01至5重量份的异氰酸酯交联剂和基于100重量份的(甲基)丙烯酸类聚合物)的0.01至2重量份的硅烷偶联剂。

    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
    8.
    发明授权
    Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display 有权
    用于光学膜,压敏粘合剂光学膜和图像显示器的压敏粘合剂组合物

    公开(公告)号:US07846542B2

    公开(公告)日:2010-12-07

    申请号:US12370967

    申请日:2009-02-13

    IPC分类号: C08F8/30 C08F8/00

    摘要: There is provided a pressure-sensitive adhesive composition for optical films. The composition can form a pressure-sensitive adhesive layer that can prevent light leakage caused by stress associated with dimensional change of a component such as an optical film, which include the pressure-sensitive adhesive layer that has reworkability such that it can be easily peeled from a component, and that has satisfactory processability such that it can be processed without pressure-sensitive adhesive stain or dropout, after it is formed on an optical film. A pressure-sensitive adhesive optical film produced using the composition is also provided. The pressure-sensitive adhesive composition includes a (meth)acrylic polymer including (a) 34 to 94% by weight of an alkyl(meth)acrylate monomer unit, (b) 5 to 35% by weight of an aromatic ring-containing (meth)acrylate monomer unit, and (c) 0.01 to 0.5% by weight of an amino group-containing (meth)acrylate monomer unit and further including (d) 0.05 to 3% by weight of a carboxyl group-containing (meth)acrylate monomer unit and/or (e) 0.05 to 2% by weight of a hydroxyl group-containing (meth)acrylate monomer unit and having a weight average molecular weight of 1,600,000 to 3,000,000 as determined by gel permeation chromatography; crosslinking agents including 0.01 to 5 parts by weight of an isocyanate crosslinking agent and 0.01 to 2 parts by weight of a silane coupling agent based on 100 parts by weight of the (meth)acrylic polymer.

    摘要翻译: 提供了一种用于光学膜的压敏粘合剂组合物。 该组合物可以形成一种压敏粘合剂层,其可以防止由与诸如光学膜的组分的尺寸变化相关的应力引起的光泄漏,其包括具有可再加工性的压敏粘合剂层,使得其可以容易地从 并且具有令人满意的加工性,使得其可以在形成在光学膜上之后可以被加工而没有压敏粘合剂污渍或脱落。 还提供了使用该组合物制备的压敏粘合剂光学膜。 压敏粘合剂组合物包括(甲基)丙烯酸类聚合物,其包含(a)34-94重量%的(甲基)丙烯酸烷基酯单体单元,(b)5-35重量%的含芳环的(甲基) )丙烯酸酯单体单元,(c)0.01〜0.5重量%的含氨基(甲基)丙烯酸酯单体单元,进一步含有(d)0.05〜3重量%的含羧基的(甲基)丙烯酸酯单体 单元和/或(e)0.05〜2重量%的含羟基的(甲基)丙烯酸酯单体单元,通过凝胶渗透色谱法测定的重均分子量为1,600,000至3,000,000; 交联剂,其包含0.01至5重量份的异氰酸酯交联剂和基于100重量份的(甲基)丙烯酸类聚合物)的0.01至2重量份的硅烷偶联剂。

    POLYIMIDE RESIN
    10.
    发明申请
    POLYIMIDE RESIN 审中-公开
    聚酰胺树脂

    公开(公告)号:US20100063239A1

    公开(公告)日:2010-03-11

    申请号:US12445532

    申请日:2007-10-11

    IPC分类号: C08G18/00

    摘要: A polyimide resin represented by the following general formula (I): wherein, R1 represents a divalent organic group having an aromatic ring or an aliphatic ring; R2 represents a divalent organic group having a weight average molecular weight of 100 to 10,000; R3 represents a divalent organic group having an aromatic ring, an aliphatic ring or an aliphatic chain; R4 represents a tetravalent organic group having 4 or more carbon atoms; n represents an integer of 1 to 100; m represents an integer of 2 to 100; and x represents an integer of 1 to 50. The polyimide resin has excellent pliability and flexibility while retaining strength and thermal resistance.

    摘要翻译: 由以下通式(I)表示的聚酰亚胺树脂:其中,R1表示具有芳香环或脂肪族环的二价有机基团; R2表示重均分子量为100〜10000的二价有机基团; R3表示具有芳环,脂族环或脂肪链的二价有机基团; R4代表具有4个或更多个碳原子的四价有机基团; n表示1〜100的整数, m表示2〜100的整数, x表示1〜50的整数。聚酰亚胺树脂具有优异的柔软性和柔软性,同时保持强度和耐热性。