公开(公告)号：US20050227429A1

公开(公告)日：2005-10-13

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K20/10 ,  H01L21/00 ,  H01L21/8238

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US07861908B2

公开(公告)日：2011-01-04

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US20070187457A1

公开(公告)日：2007-08-16

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US07229854B2

公开(公告)日：2007-06-12

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US06568580B2

公开(公告)日：2003-05-27

申请号：US09911802

申请日：2001-07-25

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

IPC分类号： B23K3704

CPC分类号： H01L24/78 ,  H01L21/67138 ,  H01L21/681 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

公开(公告)号：US06329640B1

公开(公告)日：2001-12-11

申请号：US09690746

申请日：2000-10-18

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

IPC分类号： F27B514

CPC分类号： H01L21/67103 ,  H01L21/68

摘要： An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.

摘要翻译： 本发明的目的是提供一种不涉及大型装置结构并易于处理的凸块焊接加热装置，凸块接合方法和凸块形成装置以及形成凸块的半导体晶片 通过使用凸块接合方法。 凸点焊接加热装置具有晶片转动部件，转动部件和晶片加热部件。 转动构件在不转动晶片加热单元的情况下由转动单元转动，从而转动安装在转动构件上的半导体晶片。 像这样，由于晶片加热单元没有转动，所以可以使装置结构紧凑。 由于转动构件直接由转动单元转动，与常规气浮式转动方法相比，可以以更高的精度实现半导体晶片的转动角度。

公开(公告)号：US06494358B2

公开(公告)日：2002-12-17

申请号：US09911801

申请日：2001-07-25

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

IPC分类号： B23Q1514

CPC分类号： H01L24/78 ,  H01L21/67138 ,  H01L21/681 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

摘要翻译： 预先定位晶片，使得晶片取向平面朝向特定的方向。 然后，传送装置移动并将先前定位的晶片放置在通过结合头在晶片上形成凸起的接合台上。 传送装置具有用于从接合台上方的位置检测接合台上的晶片的取向平面的位置的传感器，从而避免在定向平面检测期间来自接合台的热的不利影响。

公开(公告)号：US06302317B1

公开(公告)日：2001-10-16

申请号：US09335779

申请日：1999-06-18

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Shinji Kanayama ,  Nobuhisa Watanabe

IPC分类号： B23K3512

CPC分类号： H01L24/78 ,  H01L21/67138 ,  H01L21/681 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

摘要翻译： 预先定位晶片，使得晶片取向平面朝向特定的方向。 然后，传送装置移动并将先前定位的晶片放置在通过结合头在晶片上形成凸起的接合台上。 传送装置具有用于从接合台上方的位置检测接合台上的晶片的取向平面的位置的传感器，从而避免在定向平面检测期间来自接合台的热的不利影响。

公开(公告)号：US06392202B2

公开(公告)日：2002-05-21

申请号：US09955110

申请日：2001-09-19

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

IPC分类号： F27B506

CPC分类号： H01L21/67103 ,  H01L21/68

摘要： An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.

公开(公告)号：US5854745A

公开(公告)日：1998-12-29

申请号：US413441

申请日：1995-03-30

申请人： Nobuhiko Muraoka ,  Shinji Kanayama ,  Shinzo Eguchi ,  Masaru Ichihara ,  Shuichi Hirata ,  Nobuhisa Watanabe

发明人： Nobuhiko Muraoka ,  Shinji Kanayama ,  Shinzo Eguchi ,  Masaru Ichihara ,  Shuichi Hirata ,  Nobuhisa Watanabe

IPC分类号： H01L21/00 ,  G06F19/00

CPC分类号： H01L21/67144 ,  Y10T29/53087 ,  Y10T29/53191

摘要： When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

摘要翻译： 当在电子部件供给部拾取电子部件，然后定位并安装在透明板上的预定安装位置时，形成在透明板上的安装位置的安装位置标记与形成在电子部件上的定位标记对准 ，从而从与要安装电子部件的透明面板的与表面相反的表面相对位置识别，从而基于在安装电子部件之前的识别结果来校正电子部件的位置 在透明面板上的预定安装位置。