摘要:
A double effect absorption system having improved thermal efficiency is provided wherein a part of a weak solution fed from an absorber to a high pressure or first generator is bypassed to a second generator and the bypassed solution is transferred with the heat energy from refrigerant passed through a tube within a low pressure or second generator.
摘要:
An absorption refrigerating system is provided wherein the total circulation flow rate of a diluted solution (absorbing liquid) by pumps is adjustable according to the measured change in the refrigerating load so that the flow rate of the diluted solution is kept at desirable levels to balance with changing refrigerating load.
摘要:
A double effect absorption refrigerating system having improved thermal efficiency is provided wherein a solution concentrated by a high pressure generator is, after being used to raise the temperature of a weak solution fed to the high pressure generator and before being fed into a low pressure generator, heated with heat energy transferred thereto from a refrigerant passed through a tube within the low pressure generator.
摘要:
A semiconductor memory device comprises a memory cell group comprising a plurality of memory cells arranged in matrix; a specification circuit for specifying sequentially memory cells addressed by consecutive addresses in the memory cells, and for entering them in an active state; a data input/output (I/O) circuit for performing a data read-out/write-in operation (data I/O operation) for the consecutive memory cells specified by the specification circuit under a control based on a read-out/write-in signal provided from an external section; a counter circuit for counting the number of cycles of a basic clock signal provided from an external section; and a controller for receiving at least one or more specification signals provided from an external section, for outputting a control signal per specification signal for specifying a particular cycle as a starting cycle to count the number of the cycles of the basic clock signal, and for instructing the counter circuit to count the number of counts of the basic clock signal based on the control signal and for controlling a specification operation executed by the specification circuit and the data I/O operation of the data I/O circuit, so that the memory access operations for the memory cell group are controlled.
摘要:
A semiconductor memory device, including a memory cell array having a plurality of memory cells arranged in rows and columns, the memory cells storing data and being selected according to address signals. The device includes a control unit which receives a clock signal and a first control, or trigger, signal for outputting a plurality of the data in synchronism with the clock signal after the first control signal is asserted. The output of the data beginning after a number of clock cycles (N) of the clock signal (N being a positive integer .gtoreq.2) after the first control signal is asserted, a different one of the data being output at each of the clock cycles after the output begins until the plurality of data is output.
摘要:
A method for accessing a clock-synchronous semiconductor memory device including memory cells arranged in matrix. The cells are divided into at least two blocks, access to the cells in these blocks is designated from address data provided from an external device, and access to the memory cell is executed synchronously with an externally-supplied clock signal, which comprises setting the other blocks in an access preparation state or in an access operation standby state while one block is in an access operating state, setting a certain block in the access operating state via the access preparation state when the certain block is designated for the access operation by the address data and if the certain block is in the access operating state, and setting a certain block in the access operating state immediately when the certain block is designated for the access operation by the address data and if the certain block is in the access preparation state or in the access operation standby state. In the device, the designation of the cell in the block to be accessed is set using address data designating a block externally-provided from outside of the device.
摘要:
A semiconductor memory device such as dynamic random access memories comprises a work line drive circuit provided with two MOS transistors and a word line to which a word line drive signal is supplied, a substrate bias generation circuit for applying a bias voltage to a semiconductor substrate for MOS transistors, a burn-in mode detection circuit for detecting a burn-in test mode signal, and a substrate bias control circuit for controlling the substrate bias generation circuit. When the semiconductor memory device is subjected to a burn-in test, the power supply level Vcc is increased to raise the voltage of the word line drive signal as compared to that at a normal operation. Accordingly, a high level word line drive signal will be applied to cell transistors, thereby performing correct screening thereof.
摘要:
A semiconductor memory device has a memory cell array including many memory cells, a first data I/O section for implementing random input and output of data for the memory cells based on an externally-supplied random I/O signal, a second data I/O section for implementing serial input and output of data for the memory cells, a counter for counting the number of externally-supplied basic clock signal cycles, a controller for controlling the I/O of data for the memory cells in accordance with the number of the cycles of basic clock signals. The counter is capable of inputting at least one kind of externally-supplied designation signals, generating a designation control signal for designating a specified cycle which is a count starting cycle for the basic clock signal at each designation signals, generating instructions for commencement of count for the number of cycles of the basic clock signal in the counter based on the designated control signal, and synchronously controlling designation of addresses based on the number of cycles counted by the counter and the I/O operations of the first data I/O means and the second data I/O means from the specified cycle of the designated basic clock signal.
摘要:
A semiconductor memory device including a memory cell group comprising a plurality of memory cells arranged in matrix; a specification circuit for specifying a plurality of memory cells addressed by sequential addresses in the memory cells, and for entering them in an active state; a data input/output (I/O) circuit for performing a data read-out/write-in operation (data I/O operation) for the memory cells specified by the specification circuit under a control based on a read-out/write-in signal provided from an external section; a counter circuit for counting the number in response to cycles of a basic clock signal provided from an external section; and a controller for receiving at least one or more specification signals provided from an external section, for outputting a control signal per specification signal for specifying a particular cycle as a starting cycle to count the number of the cycles in response to the basic clock signal, and for instructing the counter circuit to count the number of cycles in response to the basic clock signal based on the control signal, and for controlling a specification operation executed by the specification circuit and the data I/O operation of the data I/O circuit in accordance with the number of cycles in response to the basic clock.
摘要:
First to third N.sup.+ -type impurity regions are formed separately from one another by a preset distance in the surface area of a P-type semiconductor substrate or a P-well region formed in an N-type semiconductor substrate. The first impurity region is connected to a power source and the second impurity region is connected to a ground terminal. The third impurity region formed between the first and second impurity regions is connected to one end of an input protection resistor which is connected at the other end to a signal input pad. The first impurity region, the third impurity region and that portion of the P-type semiconductor substrate or P-well region which lies between the first and third impurity regions constitute a first bipolar transistor for input protection and the second impurity region, the third impurity region and that portion of the P-type semiconductor substrate or P-well region which lies between the second and third impurity regions constitute a second bipolar transistor for input protection. The resistor and the first and second bipolar transistors constitute an input protection circuit.