公开(公告)号：US5803363A

公开(公告)日：1998-09-08

申请号：US329578

申请日：1994-10-25

申请人： Shunji Matsumura ,  Keiichi Fujimoto ,  Hiroshi Ota

发明人： Shunji Matsumura ,  Keiichi Fujimoto ,  Hiroshi Ota

IPC分类号： B05B1/14 ,  B05B1/18

CPC分类号： B05B1/185 ,  B05B1/14

摘要： A liquid sprinkler having a substantially hemispherical shaped head at the upper end of a vertical rise pipe. The head is spaced above an area to be watered and has a plurality of nozzles on the hemispherical surface which are sized and positioned to afford even water distribution over the watered area.

摘要翻译： 一种液体喷洒器，在垂直上升管的上端具有大致半球形的头部。 头部在要浇水的区域上方间隔开，并且在半球形表面上具有多个喷嘴，其大小和定位成在浇水区域上提供均匀的水分布。

公开(公告)号：US20050167783A1

公开(公告)日：2005-08-04

申请号：US11033390

申请日：2005-01-12

申请人： Keiichi Fujimoto

发明人： Keiichi Fujimoto

IPC分类号： G01R31/28 ,  H01L21/66 ,  H01L23/58

CPC分类号： G01R31/2856 ,  G01R31/2863 ,  G01R31/2875 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2224/05599

摘要： A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.

摘要翻译： 晶片集体可靠性评估装置包括设置成面对可靠性评估晶片并且包括布线基板的晶片集合探针，设置在面向可靠性评估晶片的布线基板的表面上的导电性弹性片和设置有多个金属端子 在导电性弹性片的表面中，与可靠性评价用晶片电连接。 可靠性评估晶片包括形成在半导体晶片的主体上的多个可靠性评估元件，用于经由各个金属端子向各个可靠性评估元件施加电压或电流的多个电极以及形成在所述半导体晶片中的多个加热元件 各可靠性评价要素的附近，并且用于控制各可靠性评价要素的温度。

公开(公告)号：US20050045533A1

公开(公告)日：2005-03-03

申请号：US10920440

申请日：2004-08-18

申请人： Keiichi Fujimoto ,  Nobuyuki Torisawa

发明人： Keiichi Fujimoto ,  Nobuyuki Torisawa

IPC分类号： G01N1/34 ,  G01N1/40 ,  G01N35/02 ,  B01D11/00

CPC分类号： G01N1/34 ,  G01N1/405 ,  G01N35/026

摘要： A mechanism for introducing pressurized air into an extracting cartridge comprises an air pump, an on-off valve, and a pressure sensor for detecting an internal pressure within the extracting cartridge. The on-off valve is turned on in order to introduce the pressurized air into the extracting cartridge. When the internal pressure detected by the pressure sensor has become equal to a predetermined pressure range for a pressurization upper limit, the on-off valve is turned off in order to confine the area within the extracting cartridge in the pressurized state, the pressure being thereby exerted upon a sample liquid, a washing liquid, or a recovery liquid having been injected into the extracting cartridge.

摘要翻译： 用于将加压空气引入提取筒中的机构包括一个气泵，一个开关阀和一个用于检测提取筒内的内部压力的压力传感器。 打开开关阀以将加压空气引入提取筒。 当由压力传感器检测到的内部压力已经变得等于加压上限的预定压力范围时，开关阀被关闭以便将提取筒中的区域限制在加压状态，因此压力 施加到已经注入到提取筒中的样品液体，洗涤液体或回收液体。

公开(公告)号：US06784681B2

公开(公告)日：2004-08-31

申请号：US09964480

申请日：2001-09-28

申请人： Keiichi Fujimoto ,  Yoshiro Nakata

发明人： Keiichi Fujimoto ,  Yoshiro Nakata

IPC分类号： G01R3126

CPC分类号： G01R1/0735

摘要： A semiconductor integrated circuit testing system for testing electric characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer in the lump includes a wafer tray for holding the semiconductor wafer and an interconnect substrate facing the semiconductor wafer held on the wafer tray and having interconnect layers to which a testing voltage is externally input. A ring-shaped sealing member is provided between the wafer tray and the interconnect substrate so as to form a sealed space together with the wafer tray and the interconnect substrate. An elastic sheet is held on the interconnect substrate at the periphery thereof. A plurality of probe terminals electrically connected to the interconnect layers are provided on the elastic sheet in positions respectively corresponding to external electrodes of the plural semiconductor integrated circuit devices. A plurality of protrusions protruding toward the wafer tray are provided on the elastic sheet for preventing the interconnect substrate from deforming toward the wafer tray when the internal pressure of the sealed space is reduced.

摘要翻译： 用于测量形成在半导体晶片上的多个半导体集成电路器件的电特性的半导体集成电路测试系统包括用于保持半导体晶片的晶片托盘和面向保持在晶片托盘上的半导体晶片的互连基板，并且具有 外部输入测试电压的互连层。 在晶片托盘和互连基板之间设置环形密封件，以便与晶片托盘和互连基板一起形成密封空间。 弹性片在其周边上保持在互连基板上。 电连接到互连层的多个探针端子分别设置在弹性片上，分别对应于多个半导体集成电路器件的外部电极。 在弹性片上设置有朝向晶片托盘突出的多个突起，用于防止当密封空间的内部压力降低时互连基板朝向晶片托盘变形。

公开(公告)号：US20110090015A1

公开(公告)日：2011-04-21

申请号：US12979976

申请日：2010-12-28

申请人： Masaya Sumita ,  Keiichi Fujimoto

发明人： Masaya Sumita ,  Keiichi Fujimoto

IPC分类号： H03K3/354

CPC分类号： H03K3/0315

摘要： A semiconductor integrated circuit includes a first ring oscillator to which a stress voltage is applied; a second ring oscillator to which the stress voltage is not applied; and a phase comparator configured to receive an output of the first ring oscillator and an output of the second ring oscillator, and to compare phases of the outputs. The first ring oscillator includes a switch circuit configured to switch between a first connection state in which ring connection of the first ring oscillator is disconnected to connect a predetermined node of the second ring oscillator to a predetermined node of the first ring oscillator, and a second connection state in which connection between the first ring oscillator and the second ring oscillator is disconnected to connect the first ring oscillator in a ring.

摘要翻译： 半导体集成电路包括施加有应力电压的第一环形振荡器; 不施加应力电压的第二环形振荡器; 以及相位比较器，被配置为接收第一环形振荡器的输出和第二环形振荡器的输出，并且比较输出的相位。 第一环形振荡器包括开关电路，其被配置为在其中第一环形振荡器的环形连接断开以将第二环形振荡器的预定节点连接到第一环形振荡器的预定节点的第一连接状态之间切换， 第一环形振荡器和第二环形振荡器之间的连接被断开以连接环中的第一环形振荡器的连接状态。

公开(公告)号：US07354510B2

公开(公告)日：2008-04-08

申请号：US10920440

申请日：2004-08-18

申请人： Keiichi Fujimoto ,  Nobuyuki Torisawa

发明人： Keiichi Fujimoto ,  Nobuyuki Torisawa

IPC分类号： B01D17/12 ,  G01N30/00

CPC分类号： G01N1/34 ,  G01N1/405 ,  G01N35/026

摘要： A mechanism for introducing pressurized air into an extracting cartridge comprises an air pump, an on-off valve, and a pressure sensor for detecting an internal pressure within the extracting cartridge. The on-off valve is turned on in order to introduce the pressurized air into the extracting cartridge. When the internal pressure detected by the pressure sensor has become equal to a predetermined pressure range for a pressurization upper limit, the on-off valve is turned off in order to confine the area within the extracting cartridge in the pressurized state, the pressure being thereby exerted upon a sample liquid, a washing liquid, or a recovery liquid having been injected into the extracting cartridge.

摘要翻译： 用于将加压空气引入提取筒中的机构包括一个气泵，一个开关阀和一个用于检测提取筒内的内部压力的压力传感器。 打开开关阀以将加压空气引入提取筒。 当由压力传感器检测到的内部压力已经变得等于加压上限的预定压力范围时，开关阀被关闭以便将提取筒中的区域限制在加压状态，因此压力 施加到已经注入到提取筒中的样品液体，洗涤液体或回收液体。

公开(公告)号：US07187002B2

公开(公告)日：2007-03-06

申请号：US11033390

申请日：2005-01-12

申请人： Keiichi Fujimoto

发明人： Keiichi Fujimoto

IPC分类号： H01L23/58

CPC分类号： G01R31/2856 ,  G01R31/2863 ,  G01R31/2875 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2224/05599

摘要： A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.

摘要翻译： 晶片集体可靠性评估装置包括设置成面对可靠性评估晶片并且包括布线基板的晶片集合探针，设置在面向可靠性评估晶片的布线基板的表面上的导电性弹性片和设置有多个金属端子 在导电性弹性片的表面中，与可靠性评价用晶片电连接。 可靠性评估晶片包括形成在半导体晶片的主体上的多个可靠性评估元件，用于经由各个金属端子向各个可靠性评估元件施加电压或电流的多个电极以及形成在所述半导体晶片中的多个加热元件 各可靠性评价要素的附近，并且用于控制各可靠性评价要素的温度。

公开(公告)号：US07429356B2

公开(公告)日：2008-09-30

申请号：US10920447

申请日：2004-08-18

申请人： Yoshihiro Seto ,  Takahiro Miyato ,  Keiichi Fujimoto

发明人： Yoshihiro Seto ,  Takahiro Miyato ,  Keiichi Fujimoto

IPC分类号： G01N35/10

CPC分类号： B01L3/50255 ,  B01L9/06 ,  B01L2400/0487 ,  G01N1/405 ,  G01N35/026

摘要： A loading mechanism holds at least one extracting cartridge provided with a filter member, at least one waste liquid vessel for accommodating a discharged liquid of a sample liquid and a discharged liquid of a washing liquid, which discharged liquids have been discharged from the extracting cartridge, and at least one recovery vessel for accommodating a recovery liquid, which contains a recovered nucleic acid and has been discharged from the extracting cartridge. A pressurized air supplying mechanism introduces pressurized air into the extracting cartridge. A liquid injecting mechanism injects each of the washing liquid and the recovery liquid into the extracting cartridge.

摘要翻译： 装载机构保持至少一个提供有过滤构件的提取筒，至少一个用于容纳样品液体的排出液体和排出液体已经从提取筒排出的洗涤液的排出液体的废液容器， 以及至少一个用于容纳回收液体的回收容器，所述回收液体含有回收的核酸并已从提取筒中排出。 加压空气供给机构将加压空气引入提取筒。 液体注入机构将每个洗涤液和回收液注入提取筒。

公开(公告)号：US20050161377A1

公开(公告)日：2005-07-28

申请号：US11039941

申请日：2005-01-24

申请人： Keiichi Fujimoto ,  Nobuyuki Torisawa

发明人： Keiichi Fujimoto ,  Nobuyuki Torisawa

IPC分类号： B01D15/08 ,  B01J47/00 ,  B01L3/00 ,  B01L9/06 ,  C12N15/10 ,  G01N1/34 ,  G01N30/02 ,  G01N35/02 ,  B01D11/00

CPC分类号： G01N1/405 ,  B01L3/50255 ,  B01L9/06 ,  B01L2200/146 ,  B01L2400/0487 ,  C12M47/06 ,  C12N15/1017 ,  G01N2001/4016

摘要： An extraction cartridge having a filter member extracts a specific material such as a nucleic acid. The specific material is caused to be adsorbed to the filter member by pressurizing a sample liquid containing a specific material. A pressurized-air supply mechanism for introducing pressurized air into a plurality of the extraction cartridges includes an air pump, opening and closing valves for individually starting or stopping supply of the pressurized air to the plurality of extraction cartridges, and pressure relief valves for individually relieving the pressures in the extraction cartridges to the atmosphere. These valves are disposed partway along a feed passage to the extraction cartridges. The extraction cartridges are supplied with pressurized air, and then sealed. Upon completion of the drainage of any one of the extraction cartridges, the pressure relief valve associated with the completely drained extraction cartridge is independently opened to relieve the pressurized air remaining therein.

摘要翻译： 具有过滤器构件的提取筒提取诸如核酸的特定材料。 通过对包含特定材料的样品液体进行加压，使具体材料被吸附到过滤构件。 用于将加压空气引入多个提取筒的加压空气供给机构包括：空气泵，用于单独启动或停止向多个提取筒供应加压空气的开闭阀，以及用于单独减轻的压力释放阀 提取盒中的压力大气。 这些阀沿着一个供给通道被提供到提取盒。 提取筒用加压空气供给，然后密封。 在任何一个提取盒的排水完成后，与完全排出的提取盒相关联的减压阀被独立地打开以减轻残留在其中的加压空气。

公开(公告)号：US5708293A

公开(公告)日：1998-01-13

申请号：US777495

申请日：1996-12-30

申请人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

发明人： Takao Ochi ,  Hisashi Funakoshi ,  Ichiro Okumura ,  Hajime Honma ,  Keiji Okuma ,  Keiichi Fujimoto

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49551 ,  H01L23/49503 ,  H01L23/4951 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079

摘要： In a unit part of a lead frame for mounting a semiconductor chip, connecting leads and supporting leads extending from a lead frame main body toward a semiconductor chip mounting region are formed. Between each supporting lead and the lead frame main body, a movable part and a spring part for elastically supporting the movable part are disposed. The tip portion of the supporting lead connected with the movable part extends to the inside of the semiconductor chip mounting region in the natural state of the movable part, so that the tip portion butts against the side face of a semiconductor chip when the semiconductor chip is mounted. Thus, the semiconductor chip can be supported and fixed by using a bias force applied by the spring part. The base portions of the supporting leads, the movable part and the spring part do not remain in a package, and hence do not cause a stress in the package and do not increase the volume of the package. Thus, the invention provides a lead frame for forming a LOC package with high reliability which can contain a semiconductor chip having a large area within a regulated volume.

摘要翻译： 在用于安装半导体芯片的引线框架的单位部分中，形成从引线框架主体朝向半导体芯片安装区域延伸的连接引线和支撑引线。 在每个支撑引线和引线框架主体之间设置有用于弹性地支撑可动部件的可动部件和弹簧部件。 与可动部连接的支撑引线的前端部在可动部的自然状态下延伸到半导体芯片安装区域的内部，使得当半导体芯片为半导体芯片时，前端部抵靠半导体芯片的侧面 安装。 因此，可以通过使用由弹簧部分施加的偏压力来支撑和固定半导体芯片。 支撑引线，可动部分和弹簧部分的基部不保持在包装中，因此不会在包装中引起应力，并且不增加包装的体积。 因此，本发明提供了一种用于形成具有高可靠性的LOC封装的引线框架，其可以包含在调节体积内具有大面积的半导体芯片。