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    Method for manufacturing SOI substrate and semiconductor device
    3.
    发明授权
    Method for manufacturing SOI substrate and semiconductor device 有权
    制造SOI衬底和半导体器件的方法

    公开(公告)号：US08598013B2

    公开(公告)日：2013-12-03

    申请号：US12247470

    申请日：2008-10-08

    申请人： Shunpei Yamazaki ,  Hideto Ohnuma ,  Yoichi Iikubo ,  Yoshiaki Yamamoto ,  Kenichiro Makino

    发明人： Shunpei Yamazaki ,  Hideto Ohnuma ,  Yoichi Iikubo ,  Yoshiaki Yamamoto ,  Kenichiro Makino

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： H01L27/1266 ,  H01L21/76254 ,  H01L27/1214 ,  H01L29/66772

    摘要： To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.

    摘要翻译： 为了提供一种制造具有半导体层的SOI衬底的方法，即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。 通过以下步骤将半导体层转移到支撑衬底：从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层，并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。 通过湿蚀刻除去半导体层上部分残留的损伤层，并用激光束照射半导体层的表面。

    Manufacturing method of SOI substrate and manufacturing method of semiconductor device
    4.
    发明申请
    Manufacturing method of SOI substrate and manufacturing method of semiconductor device 有权
    SOI衬底的制造方法和半导体器件的制造方法

    公开(公告)号：US20090011575A1

    公开(公告)日：2009-01-08

    申请号：US12213271

    申请日：2008-06-17

    申请人： Akihisa Shimomura ,  Hideto Ohnuma ,  Tetsuya Kakehata ,  Kenichiro Makino

    发明人： Akihisa Shimomura ,  Hideto Ohnuma ,  Tetsuya Kakehata ,  Kenichiro Makino

    IPC分类号： H01L21/36 ,  H01L21/425 ,  H01L21/00

    CPC分类号： H01L21/76254

    摘要： It is object to provide a manufacturing method of an SOI substrate provided with a single-crystal semiconductor layer, even in the case where a substrate having a low allowable temperature limit, such as a glass substrate, is used and to manufacture a high-performance semiconductor device using such an SOI substrate. Light irradiation is performed on a semiconductor layer which is separated from a semiconductor substrate and bonded to a support substrate having an insulating surface, using light having a wavelength of 365 nm or more and 700 nm or less, and a film thickness d (nm) of the semiconductor layer which is irradiated with the light is made to satisfy d=λ/2n×m±α (nm), when a light wavelength is λ (nm), a refractive index of the semiconductor layer is n, m is a natural number greater than or equal to 1 (m=1, 2, 3, 4, . . . ), and 0≦α≦10 is satisfied.

    摘要翻译： 目的在于提供一种具有单晶半导体层的SOI衬底的制造方法，即使使用诸如玻璃衬底等具有低允许温度极限的衬底并制造高性能 使用这种SOI衬底的半导体器件。 使用波长365nm以上且700nm以下的光和膜厚d（nm）在与半导体基板分离并与具有绝缘面的支撑基板接合的半导体层上进行光照射， 被照射到半导体层的半导体层的折射率为n时，满足d =λ/ 2n×m±α（nm），当光波长为λ（nm）时，m为自然数 大于或等于1（m = 1，2，3，4，...），并且0 <=α<= 10。

    SOI substrate and manufacturing method thereof
    6.
    发明授权
    SOI substrate and manufacturing method thereof 有权
    SOI衬底及其制造方法

    公开(公告)号：US08030169B2

    公开(公告)日：2011-10-04

    申请号：US12497720

    申请日：2009-07-06

    申请人： Tetsuya Kakehata ,  Hideto Ohnuma ,  Yoshiaki Yamamoto ,  Kenichiro Makino

    发明人： Tetsuya Kakehata ,  Hideto Ohnuma ,  Yoshiaki Yamamoto ,  Kenichiro Makino

    IPC分类号： H01L21/762

    CPC分类号： H01L27/1218 ,  H01L21/76254 ,  H01L27/1214 ,  H01L27/1266 ,  H01L29/0649 ,  H01L29/66772 ,  H01L29/78 ,  H01L29/78603 ,  H01L31/0352

    摘要： An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.

    摘要翻译： 本发明的目的是提供一种具有半导体层的SOI衬底，即使在使用玻璃衬底作为基底衬底时也可以实际使用。 另一个目的是提供一种使用这种SOI衬底具有高可靠性的半导体器件。 在用作SOI衬底的基底衬底的玻璃衬底的至少一个表面上形成改变的层，以形成SOI衬底。 通过用包括盐酸，硫酸或硝酸的溶液清洗玻璃基板，在玻璃基板的至少一个表面上形成改变的层。 改变的层在其组成中具有较高比例的氧化硅，并且具有比玻璃基底更低的密度。

    Method for manufacturing SOI substrate
    7.
    发明授权
    Method for manufacturing SOI substrate 有权
    制造SOI衬底的方法

    公开(公告)号：US08198173B2

    公开(公告)日：2012-06-12

    申请号：US12910320

    申请日：2010-10-22

    申请人： Hideto Ohnuma ,  Kenichiro Makino ,  Yoichi Iikubo ,  Masaharu Nagai ,  Aiko Shiga

    发明人： Hideto Ohnuma ,  Kenichiro Makino ,  Yoichi Iikubo ,  Masaharu Nagai ,  Aiko Shiga

    IPC分类号： H01L21/46

    CPC分类号： H01L21/84 ,  H01L21/76254 ,  H01L29/66772 ,  H01L29/78621

    摘要： To improve bonding strength and improve reliability of an SOI substrate in bonding a semiconductor substrate and a base substrate to each other even when an insulating film containing nitrogen is used as a bonding layer, an oxide film is provided on the semiconductor substrate side, a nitrogen-containing layer is provided on the base substrate side, and the oxide film formed on the semiconductor substrate and the nitrogen-containing layer formed over the base substrate are bonded to each other. Further, plasma treatment is performed on at least one of the oxide film and the nitrogen-containing layer before bonding the oxide film formed on the semiconductor substrate and the nitrogen-containing layer formed over the base substrate to each other. Plasma treatment can be performed in a state in which a bias voltage is applied.

    摘要翻译： 即使使用含有氮的绝缘膜作为接合层，为了提高接合强度并提高SOI基板的接合半导体基板和基板的可靠性，在半导体基板侧设置氧化膜，氮 在基底基板侧设置含氧层，并且形成在半导体基板上的氧化膜和形成在基底基板上的含氮层彼此结合。 此外，在将形成在半导体衬底上的氧化膜和形成在基底衬底上的含氮层彼此粘合之前，对氧化物膜和含氮层中的至少一种进行等离子体处理。 可以在施加偏置电压的状态下进行等离子体处理。

    Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device
    8.
    发明授权
    Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device 失效
    制造SOI衬底的方法和制造半导体器件的方法

    公开(公告)号：US07727846B2

    公开(公告)日：2010-06-01

    申请号：US12213137

    申请日：2008-06-16

    申请人： Hideto Ohnuma ,  Ryota Imahayashi ,  Yoichi Iikubo ,  Kenichiro Makino ,  Sho Nagamatsu

    发明人： Hideto Ohnuma ,  Ryota Imahayashi ,  Yoichi Iikubo ,  Kenichiro Makino ,  Sho Nagamatsu

    IPC分类号： H01L21/331 ,  H01L21/8222

    CPC分类号： H01L27/1266 ,  H01L21/76254 ,  H01L27/1214 ,  H01L29/78654

    摘要： It is an object of the present invention is to provide a method of manufacturing an SOI substrate provided with a single-crystal semiconductor layer which can be practically used even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like, is used, and further, to manufacture a semiconductor device with high reliability by using such an SOI substrate. A semiconductor layer which is separated from a semiconductor substrate and bonded to a supporting substrate having an insulating surface is irradiated with electromagnetic waves, and the surface of the semiconductor layer is subjected to polishing treatment. At least part of a region of the semiconductor layer is melted by irradiation with electromagnetic waves, and a crystal defect in the semiconductor layer can be reduced. Further, the surface of the semiconductor layer can be polished and planarized by polishing treatment.

    摘要翻译： 本发明的一个目的是提供一种制造具有单晶半导体层的SOI衬底的方法，即使当具有低耐热温度的衬底如玻璃衬底或 并且进一步通过使用这种SOI衬底制造具有高可靠性的半导体器件。 将与半导体基板分离并与具有绝缘面的支撑基板接合的半导体层用电磁波照射，对半导体层的表面进行抛光处理。 半导体层的区域的至少一部分通过电磁波的照射而熔融，能够降低半导体层的晶体缺陷。 此外，半导体层的表面可以通过抛光处理被抛光和平坦化。

    Manufacturing method of SOI substrate and manufacturing method of semiconductor device
    9.
    发明授权
    Manufacturing method of SOI substrate and manufacturing method of semiconductor device 有权
    SOI衬底的制造方法和半导体器件的制造方法

    公开(公告)号：US07678668B2

    公开(公告)日：2010-03-16

    申请号：US12213271

    申请日：2008-06-17

    申请人： Akihisa Shimomura ,  Hideto Ohnuma ,  Tetsuya Kakehata ,  Kenichiro Makino

    发明人： Akihisa Shimomura ,  Hideto Ohnuma ,  Tetsuya Kakehata ,  Kenichiro Makino

    IPC分类号： H01L21/30

    CPC分类号： H01L21/76254

    摘要： It is object to provide a manufacturing method of an SOI substrate provided with a single-crystal semiconductor layer, even in the case where a substrate having a low allowable temperature limit, such as a glass substrate, is used and to manufacture a high-performance semiconductor device using such an SOI substrate. Light irradiation is performed on a semiconductor layer which is separated from a semiconductor substrate and bonded to a support substrate having an insulating surface, using light having a wavelength of 365 nm or more and 700 nm or less, and a film thickness d (nm) of the semiconductor layer which is irradiated with the light is made to satisfy d=λ/2n×m±α (nm), when a light wavelength is λ (nm), a refractive index of the semiconductor layer is n, m is a natural number greater than or equal to 1 (m=1, 2, 3, 4, . . . ), and 0≦α≦10 is satisfied.

    摘要翻译： 目的在于提供一种具有单晶半导体层的SOI衬底的制造方法，即使使用诸如玻璃衬底等具有低允许温度极限的衬底并制造高性能 使用这种SOI衬底的半导体器件。 使用波长365nm以上且700nm以下的光和膜厚d（nm）在与半导体基板分离并与具有绝缘面的支撑基板接合的半导体层上进行光照射， 被照射到半导体层的半导体层的折射率为n时，满足d =λ/ 2n×m±α（nm），当光波长为λ（nm）时，m为 大于或等于1（m = 1,2,3,4，...），0＆nlE;α＆nlE; 10的自然数。