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公开(公告)号：US5243320A
公开(公告)日：1993-09-07
申请号：US750070
申请日：1991-08-26
IPC分类号： C23F1/18 , C23F1/40 , H01C7/00 , H01C17/06 , H01C17/16 , H05K1/16 , H05K3/02 , H05K3/06 , H05K3/38
CPC分类号： H01C7/006 , H01C17/06 , H01C17/16 , H05K1/167 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723 , H05K3/022 , H05K3/06 , Y10T428/12438 , Y10T428/12535
摘要： Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 .OMEGA. per square.
摘要翻译： 公开了电沉积的平面电阻层，其可以与导电层和绝缘层组合以产生用于制备印刷电路板的层压体。 电阻层由含有常导电金属成分源和非金属电阻增加添加剂源的电镀浴电镀制备。 可以制造平面电阻器，其具有在约15至约1000欧米加/平方的范围内的薄层电阻。
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2.发明授权Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer 失效具有气相沉积处理层和粘附促进层的金属体
公开(公告)号：US5709957A
公开(公告)日：1998-01-20
申请号：US713100
申请日：1996-09-16
CPC分类号： C23C14/5806 , C23C14/024 , C23C14/16 , C23C14/58 , C23C28/00 , H05K1/09 , H05K3/388 , H05K3/389 , H05K2201/0317 , H05K2201/0355 , H05K2203/0278 , H05K3/022 , H05K3/386 , Y10T428/12431 , Y10T428/12493 , Y10T428/12569 , Y10T428/12611
摘要： A metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material overlying and adhered to at least one treatment layer, provided that when two treatment layers are deposited on one side of the body and the first layer is vapor-deposited zinc, the second layer is not vapor-deposited silica or alumina, the adhesion-promoting material being suitable for enhancing adhesion between the body and a substrate. Laminates comprising metal foils and at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal foil; a layer of adhesion-promoting material overlying and adhered to at least one vapor-deposited treatment layer; and a layer of an electrically non-conductive material overlying and adhered to the adhesion-promoting layer.
摘要翻译： 金属体，其具有覆盖并粘附到金属体的至少一侧的至少一个气相沉积处理层，以及一层粘附促进材料层，其覆盖并粘附至至少一个处理层，条件是当两个处理层为 沉积在体的一侧，第一层是蒸镀锌，第二层不是气相沉积的二氧化硅或氧化铝，所以粘合促进材料适于增强本体和基底之间的粘合性。 包括金属箔和至少一个气相沉积处理层的叠层体，覆盖并粘附到金属箔的至少一侧; 一层粘附促进材料，覆盖并粘附在至少一个气相沉积处理层上; 以及覆盖并粘合到粘附促进层上的非导电材料层。
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3.发明授权公开(公告)号：US06248401B1
公开(公告)日：2001-06-19
申请号：US08846080
申请日：1997-04-25
IPC分类号： C23C1606
CPC分类号： C23C14/5806 , C23C14/024 , C23C14/16 , C23C14/58 , C23C28/00 , H05K1/09 , H05K3/022 , H05K3/386 , H05K3/388 , H05K3/389 , H05K2201/0317 , H05K2201/0355 , H05K2203/0278 , Y10T428/12431 , Y10T428/12493 , Y10T428/12569 , Y10T428/12611
摘要： This invention relates to a metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material overlying and adhered to at least one treatment layer, provided that when two treatment layers are deposited on one side of the body and the first layer is vapor-deposited zinc, the second layer is not vapor-deposited silica or alumina, said adhesion-promoting material being suitable for enhancing adhesion between said body and another substrate. The invention also relates to laminates comprising metal foils and at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal foil; a layer of adhesion-promoting material overlying and adhered to at least one vapor-deposited treatment layer; and a layer of an electrically non-conductive material overlying and adhered to the adhesion-promoting layer.
摘要翻译： 本发明涉及一种具有至少一个气相沉积处理层的金属体，该处理层覆盖并粘附到金属体的至少一侧，以及一层粘附促进材料层，其覆盖并粘附至至少一个处理层，条件是当 两个处理层沉积在主体的一侧上，第一层是气相沉积的锌，第二层不是气相沉积的二氧化硅或氧化铝，所述粘附促进材料适于增强所述主体和另一基板之间的粘附。 本发明还涉及包含金属箔和覆盖并粘附在金属箔的至少一侧上的至少一个气相沉积处理层的层压体; 一层粘附促进材料，覆盖并粘附在至少一个气相沉积处理层上; 以及覆盖并粘合到粘附促进层上的非导电材料层。
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4.发明授权Adhesiveless flexible laminate and process for making adhesiveless flexible laminate 失效无粘性柔性层压板和无粘性柔性层压板的制造方法公开(公告)号：US06171714B2
公开(公告)日：2001-01-09
申请号：US08832097
申请日：1997-04-03
申请人： Nicholas E. Bergkessel , Tad Bergstresser , Shiuh-Kao Chiang , Mary K. Prokop , David B. Russell
发明人： Nicholas E. Bergkessel , Tad Bergstresser , Shiuh-Kao Chiang , Mary K. Prokop , David B. Russell
IPC分类号： B32B1508
CPC分类号： C23C14/205 , C23C14/022 , C23C14/562 , H05K1/0346 , H05K3/381 , H05K3/388 , Y10T428/12514 , Y10T428/12569 , Y10T428/12639 , Y10T428/1291
摘要： This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).
摘要翻译： 本发明涉及一种改进的无粘合柔性层压材料，其包括：具有等离子体处理表面的聚合物膜; 包含镍或镍合金的镍连接涂层粘附到所述等离子体处理的表面上; 以及附着在镍层上的铜种皮涂层。 在一个实施例中，另一层铜层附着在铜种皮涂层上。 本发明还涉及一种制备上述无粘合柔性层压材料的方法，该方法包括以下步骤：（A）使聚合物膜的至少一侧与包含由非金属化阴极产生的电离氧的等离子体接触，以提供 等离子体处理表面; （B）在所述等离子体处理的表面上沉积镍或镍合金的粘结层; 和（C）在所述镍连接涂层上沉积铜的种皮层。 该方法还包括（D）从步骤（C）在铜种皮涂层上沉积另一层铜的任选步骤。
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