公开(公告)号：US20150187741A1

公开(公告)日：2015-07-02

申请号：US14211244

申请日：2014-03-14

申请人： Siliconware Precision Industries Co., Ltd

发明人： Shih-Hao Tung ,  Chang-Yi Lan ,  Lung-Yuan Wang ,  Cheng-Chia Chiang ,  Chu-Huei Huang

IPC分类号： H01L25/10 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

摘要： A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

摘要翻译： 提供了一种用于制造封装（PoP）封装结构的方法，其包括：提供具有至少第一电子元件和多个第一支撑部分的第一封装基板，其中第一电子元件电连接到第一封装 基质; 在所述第一包装基板上形成密封剂，以密封所述第一电子元件和所述第一支撑部分; 在所述密封剂中形成多个开口以暴露所述第一支撑部分的表面的部分; 以及提供具有多个第二支撑部分的第二包装基板，并且将第二包装基板堆叠在第一包装基板上，其中第二支撑部分位于密封剂的开口中并与第一支撑部分结合。 因此，密封剂有效地将第一支撑部分或第二支撑部分彼此分离，以防止在它们之间发生桥接。

公开(公告)号：US10224243B2

公开(公告)日：2019-03-05

申请号：US15704388

申请日：2017-09-14

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shao-Tzu Tang ,  Chang-Yi Lan ,  Ying-Chou Tsai

IPC分类号： H01L21/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56

摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.

公开(公告)号：US20180138158A1

公开(公告)日：2018-05-17

申请号：US15867910

申请日：2018-01-11

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shih-Hao Tung ,  Chang-Yi Lan ,  Lung-Yuan Wang ,  Cheng-Chia Chiang ,  Shu-Huei Huang

IPC分类号： H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

摘要： A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

公开(公告)号：US20160133593A1

公开(公告)日：2016-05-12

申请号：US14624642

申请日：2015-02-18

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shao-Tzu Tang ,  Chang-Yi Lan ,  Ying-Chou Tsai

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/66 ,  H01L23/31

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/568 ,  H01L22/12 ,  H01L23/3114 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/1148 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00015 ,  H01L2924/1816 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/20 ,  H01L21/56 ,  H01L21/304 ,  H01L2224/81

摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element;and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.

摘要翻译： 提供一种电子封装，其包括：具有多个电极焊盘的活性表面的电子元件，与该有源表面相对的非活性表面以及与该活性表面和非活性表面相邻并连接的侧表面; 形成在电子元件的电极焊盘上的多个导电元件; 以及覆盖电子元件的有源和侧表面以及导电元件的侧表面的部分并且暴露电子元件的非活性表面的密封剂。 因此，本发明提高了电子元件的有效表面的结构强度，以防止电子元件的破裂，从而避免导电元件与电子元件分层。

公开(公告)号：US20180068896A1

公开(公告)日：2018-03-08

申请号：US15704388

申请日：2017-09-14

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shao-Tzu Tang ,  Chang-Yi Lan ,  Ying-Chou Tsai

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L21/66 ,  H01L21/56

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/568 ,  H01L22/12 ,  H01L23/3114 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/1148 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00015 ,  H01L2924/1816 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/20 ,  H01L21/56 ,  H01L21/304 ,  H01L2224/81

摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.

公开(公告)号：US09905546B2

公开(公告)日：2018-02-27

申请号：US14211244

申请日：2014-03-14

申请人： Siliconware Precision Industries Co., Ltd

发明人： Shih-Hao Tung ,  Chang-Yi Lan ,  Lung-Yuan Wang ,  Cheng-Chia Chiang ,  Chu-Huei Huang

IPC分类号： H01L21/56 ,  H01L23/28 ,  H01L25/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

摘要： A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

公开(公告)号：US09805979B2

公开(公告)日：2017-10-31

申请号：US14624642

申请日：2015-02-18

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shao-Tzu Tang ,  Chang-Yi Lan ,  Ying-Chou Tsai

IPC分类号： H01L23/28 ,  H01L21/78 ,  H01L23/31 ,  H01L21/66 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L21/568 ,  H01L22/12 ,  H01L23/3114 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/1148 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00015 ,  H01L2924/1816 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/20 ,  H01L21/56 ,  H01L21/304 ,  H01L2224/81

摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.