公开(公告)号：US08878356B2

公开(公告)日：2014-11-04

申请号：US13660200

申请日：2012-10-25

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hong-Da Chang ,  Cheng-Hsiang Liu ,  Kuang-Wei Huang ,  Chun-Hung Lin ,  Hsin-Yi Liao

IPC: H01L23/48 ,  H01L23/22 ,  H01L23/24 ,  H01L23/051 ,  H01L23/053 ,  H01L23/043

CPC classification number: H01L23/051 ,  B81B7/0064 ,  B81B2207/092 ,  B81C2203/0154 ,  H01L23/043 ,  H01L23/053 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections.

Abstract translation: 提供一种封装结构，包括：具有接地焊盘和MEMS元件的衬底; 设置在所述基板上用于覆盖所述MEMS元件的盖; 电连接到接地垫的线段; 封装盖和线段的密封剂; 以及形成在密封剂上并电连接到线段和盖子上的电路层，以便共同接地衬底和盖子，从而释放盖上的积累的电荷，从而提高MEMS系统的可靠性并减少 I / O连接数。

公开(公告)号：US20140217605A1

公开(公告)日：2014-08-07

申请号：US13894687

申请日：2013-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-Hung Lin ,  Chun-Hung Lu ,  Guang-Hwa Ma ,  Hsiao-Chun Huang ,  Kuang-Hsin Chen

IPC: H01L23/532 ,  H01L21/768

CPC classification number: H01L23/53295 ,  H01L21/76802 ,  H01L21/76808 ,  H01L23/49894 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnection structure for a package is disclosed. The interconnection structure includes a substrate body having a conductive portion formed on a surface thereof; a first photosensitive dielectric layer formed on the surface of the substrate body and having a via for exposing the conductive potion; a conductive via formed in the via; a second photosensitive dielectric layer formed on the first photosensitive dielectric layer and having a opening for exposing the conductive via and a portion of the first photosensitive dielectric layer; and a conductive trace layer formed in the opening of the second photosensitive dielectric layer so as to be electrically connected to the conductive portion through the conductive via, thereby simplifying the fabrication process and reducing the fabrication cost and time.

Abstract translation: 公开了一种用于封装的互连结构。 互连结构包括在其表面上形成有导电部分的基板主体; 形成在所述基板主体的表面上并且具有用于使所述导电部暴露的通孔的第一光敏介电层; 在通孔中形成的导电通孔; 形成在所述第一光敏介电层上并具有用于使所述导电通孔和所述第一光敏介电层的一部分暴露的开口的第二光敏介电层; 以及形成在第二感光介电层的开口中的导电迹线层，以便通过导电通孔电连接到导电部分，从而简化制造工艺并降低制造成本和时间。

公开(公告)号：US09076796B2

公开(公告)日：2015-07-07

申请号：US13894687

申请日：2013-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-Hung Lin ,  Chun-Hung Lu ,  Guang-Hwa Ma ,  Hsiao-Chun Huang ,  Kuang-Hsin Chen

IPC: H01L23/532 ,  H01L21/768 ,  H01L23/498

CPC classification number: H01L23/53295 ,  H01L21/76802 ,  H01L21/76808 ,  H01L23/49894 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2221/1031 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnection structure for a package is disclosed. The interconnection structure includes a substrate body having a conductive portion formed on a surface thereof; a first photosensitive dielectric layer formed on the surface of the substrate body and having a via for exposing the conductive potion; a conductive via formed in the via; a second photosensitive dielectric layer formed on the first photosensitive dielectric layer and having a opening for exposing the conductive via and a portion of the first photosensitive dielectric layer; and a conductive trace layer formed in the opening of the second photosensitive dielectric layer so as to be electrically connected to the conductive portion through the conductive via, thereby simplifying the fabrication process and reducing the fabrication cost and time.

Abstract translation: 公开了一种用于封装的互连结构。 互连结构包括在其表面上形成有导电部分的基板主体; 形成在所述基板主体的表面上并且具有用于使所述导电部暴露的通孔的第一光敏介电层; 在通孔中形成的导电通孔; 形成在所述第一光敏介电层上并具有用于使所述导电通孔和所述第一光敏介电层的一部分暴露的开口的第二光敏介电层; 以及形成在第二感光介电层的开口中的导电迹线层，以便通过导电通孔电连接到导电部分，从而简化制造工艺并降低制造成本和时间。