公开(公告)号：US3967484A

公开(公告)日：1976-07-06

申请号：US536474

申请日：1974-12-26

申请人： Soji Takahashi ,  Hiroshi Okada

发明人： Soji Takahashi ,  Hiroshi Okada

IPC分类号： B21C23/20 ,  B21C23/22 ,  H01P11/00 ,  B21C23/18

CPC分类号： H01P11/00 ,  B21C23/20 ,  B21C23/22 ,  Y10S29/047 ,  Y10S72/70 ,  Y10T29/49016

摘要： A method of manufacturing low energy-loss waveguide circuit elements in which a film of metal with a low resistivity is joined to a base metal by thermal pressing or electric plating, and a hard male die of a desired shape is pressed into the base metal from above the metal film, whereby a plastic strain is caused in the base metal thereby to form a recessed portion in the base metal having an internal surface covered with the low resistivity metal.

摘要翻译： 一种制造低能耗波导电路元件的方法，其中通过热压或电镀将具有低电阻率的金属膜接合到贱金属，并且将具有所需形状的硬雄模压入基底金属中 在金属膜的上方，由此在母材金属中引起塑性变形，从而在具有被低电阻率金属覆盖的内表面的基底金属中形成凹部。

公开(公告)号：US08476894B2

公开(公告)日：2013-07-02

申请号：US12801051

申请日：2010-05-19

申请人： Hiroshi Okada

发明人： Hiroshi Okada

IPC分类号： G01R31/00

CPC分类号： G01R19/0092

摘要： A monitoring circuit of the present invention provides a monitor signal with which a magnitude of a current flowing across a photodetector, such as a photodiode, can be calculated accurately over a wide temperature range on the basis of a value of the monitor signal. The monitoring circuit of the present invention includes: a current mirror circuit for outputting a monitor current proportional to an input current, the current mirror circuit having an input point for receiving the input current, the input point being connected to a photodetector and a load resistor, which are connected thereto in parallel; and an output circuit for outputting a monitor signal indicating a difference between a monitor electric potential proportional to the monitor current, and an offset electric potential proportional to an offset current which flows across the load resistor concurrently with the monitor current.

摘要翻译： 本发明的监视电路提供一种监视信号，通过该监视信号，可以根据监视信号的值，在宽的温度范围内精确地计算流过光电探测器（例如光电二极管）的电流大小。 本发明的监视电路包括：电流镜电路，用于输出与输入电流成比例的监视电流，电流镜电路具有用于接收输入电流的输入点，输入点连接到光电检测器和负载电阻器 ，其并联连接; 以及输出电路，用于输出指示与监视电流成比例的监视电位之间的差异的监视信号和与监视电流同时流过负载电阻的偏移电流成比例的偏移电位。

公开(公告)号：US08367033B2

公开(公告)日：2013-02-05

申请号：US12297728

申请日：2007-04-20

申请人： Hiroshi Okada ,  Yoshinori Sibata ,  Kuniyoshi Yokoo ,  Yuzo Mizobuchi ,  Kenji Omote ,  Yasuhiko Kasama

发明人： Hiroshi Okada ,  Yoshinori Sibata ,  Kuniyoshi Yokoo ,  Yuzo Mizobuchi ,  Kenji Omote ,  Yasuhiko Kasama

IPC分类号： C01B31/02

CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/15 ,  C01B32/152

摘要： In order to isolate and purify an endohedral fullerene, a solvent washing was performed using toluene to concentrate the endohedral fullerene in a residual, but endohedral fullerene could not be efficiently purified because impurities other than the endohedral fullerene could not be sufficiently removed. Thus, the endohedral fullerene is isolated and purified by using a solvent such as chloronaphthalene or tetralin having a high solubility for the endohedral fullerene and concentrating the endohedral fullerene in the solvent. The endohedral fullerene isolated and purified by solvent extraction has a cluster structure where the endohedral fullerene is surrounded with empty fullerenes. Thus, this endohedral fullerene is highly stable and is a useful material applicable to various fields such as medical care and electronics.

摘要翻译： 为了分离和纯化内生的富勒烯，使用甲苯进行溶剂洗涤，以将内嵌的富勒烯浓缩在残留物中，但是由于内部富勒烯以外的杂质不能被充分除去，因此不能有效地纯化内生的富勒烯。 因此，内嵌式富勒烯通过使用对内嵌式富勒烯具有高溶解度的溶剂如氯萘或四氢化萘并将内面富勒烯浓缩在溶剂中来分离和纯化。 通过溶剂萃取分离和纯化的内嵌富勒烯具有簇结构，其中内部富勒烯被空的富勒烯包围。 因此，该内嵌式富勒烯是高度稳定的，并且是适用于医疗和电子等各个领域的有用材料。

公开(公告)号：US08058642B2

公开(公告)日：2011-11-15

申请号：US12443575

申请日：2008-07-18

申请人： Yasuhiro Iguchi ,  Hiroshi Okada ,  Yuichi Kawamura

发明人： Yasuhiro Iguchi ,  Hiroshi Okada ,  Yuichi Kawamura

IPC分类号： H01L31/0352

CPC分类号： H01L31/035236 ,  B82Y20/00 ,  H01L27/14649 ,  H01L31/03046 ,  Y02E10/544

摘要： A light-receiving element device capable of receiving near infrared to mid-infrared light of 1.7 μm-3.5 μm is provided. A substrate is formed of InP, and a superlattice light-receiving layer is formed of a superlattice of a type 2 junction formed by alternately being stacked a falling layer of a Group III-V compound semiconductor including In, Ga, As, N and a rising layer of a Group III-V compound semiconductor including Ga, As, Sb. The film thickness of the falling layer and the rising layer is each 3 nm-10 nm. The entire thickness of the superlattice light-receiving layer is 2 μm-7 μm. The lattice mismatch of the constituent film of the superlattice light-receiving layer to InP is ±0.2% or less.

摘要翻译： 提供能够接收1.7μm〜3.5μm的近红外到中红外光的受光元件装置。 基板由InP形成，超晶格光接收层由通过交替堆叠包括In，Ga，As，N的III-V族化合物半导体的下降层形成的2型结的超晶格形成，并且 包含Ga，As，Sb的III-V族化合物半导体的上升层。 下降层和上升层的膜厚分别为3nm〜10nm。 超晶格光接收层的整个厚度为2μm-7μm。 超晶格光接收层的构成膜与InP的晶格失配为±0.2％以下。

公开(公告)号：US08008948B2

公开(公告)日：2011-08-30

申请号：US12000304

申请日：2007-12-11

申请人： Yasuaki Makino ,  Hiroshi Okada ,  Reiji Iwamoto ,  Nobukazu Oba ,  Shinji Nakatani ,  Norikazu Ohta ,  Hideki Hosokawa

发明人： Yasuaki Makino ,  Hiroshi Okada ,  Reiji Iwamoto ,  Nobukazu Oba ,  Shinji Nakatani ,  Norikazu Ohta ,  Hideki Hosokawa

IPC分类号： G01R19/00 ,  G06M1/10

CPC分类号： G01R19/04

摘要： A peak voltage detector circuit detects a peak voltage of an input voltage. The input voltage is input into a first input terminal of a comparator. A counter circuit counts up a counter value in synchronization with a first clock signal, when a signal output from the comparator is in a first state. The counter circuit counts down the counter value in synchronization with a second clock signal. A digital-analog conversion circuit outputs an output voltage corresponding to the counter value, and the output voltage is input into a second input terminal of the comparator. The first clock signal has a wave period shorter than that of the second clock signal.

摘要翻译： 峰值电压检测电路检测输入电压的峰值电压。 输入电压被输入到比较器的第一输入端。 当从比较器输出的信号处于第一状态时，计数器电路与第一时钟信号同步地计数计数器值。 计数器电路与第二个时钟信号同步地计数计数器值。 数字模拟转换电路输出对应于计数器值的输出电压，输出电压被输入到比较器的第二输入端。 第一时钟信号具有比第二时钟信号短的波周期。

公开(公告)号：US20110037893A1

公开(公告)日：2011-02-17

申请号：US12988493

申请日：2009-04-10

申请人： Hiroshi Okada

发明人： Hiroshi Okada

IPC分类号： H04N5/225

CPC分类号： H04N5/2252 ,  G02B7/021 ,  G02B13/001 ,  G03B17/02 ,  H04N5/2257

摘要： An imaging module includes an imaging substrate mounting an imaging device thereon, a resin holder including a substrate securing portion to which the imaging substrate is secured, a lens support barrel supporting a lens at an inside thereof, and a holding portion which protrudes toward a subject from the substrate securing portion and includes a through hole configured to permit retention of the holder in an external structure, a metal securing member disposed at a side of the substrate securing portion of the holder facing a subject, and a metal holding plate including a securing region which is secured to and electrically connected to the securing member, and a holding portion adjacent region which overlaps a part around the through hole of the holding portion and includes a through hole configured to communicate with the through hole.

摘要翻译： 成像模块包括在其上安装成像装置的成像基板，包括固定有成像基板的基板固定部分的树脂保持器，在其内侧支撑透镜的透镜支撑筒以及向主体突出的保持部 并且包括通孔，该通孔被配置为允许保持器保持在外部结构中;金属固定构件，其设置在所述保持器的面向被检体的基板固定部分的一侧;金属保持板，其包括固定 固定到电连接到固定构件的区域和与保持部分的通孔周围的部分重叠的保持部​​分相邻区域，并且包括与通孔相连通的通孔。

公开(公告)号：US20100322286A1

公开(公告)日：2010-12-23

申请号：US12666105

申请日：2008-10-24

申请人： Kozo Toyama ,  Mitsuaki Mochizuki ,  Hiroshi Okada ,  Shinichi Fukushima ,  Junichi Sano

发明人： Kozo Toyama ,  Mitsuaki Mochizuki ,  Hiroshi Okada ,  Shinichi Fukushima ,  Junichi Sano

IPC分类号： G01K7/02

CPC分类号： G01K13/02 ,  G01K1/08 ,  G01K1/18 ,  G01K7/02

摘要： An object of the invention is to provide a thermocouple having a high response speed without receiving mechanical damages such as bending and curving even when it is used in a high-speed fluid. The invention provides a quick-response thermocouple for high-speed fluid in which a sheathed thermocouple having a small outer diameter that is formed by housing, in a metal sheath, a positive-side thermocouple filament and a negative-side thermocouple filament embedded within a powder of an inorganic insulating material, and by forming a temperature sensing point at a tip portion thereof by bonding the tips of the positive-side thermocouple filament and the negative-side thermocouple filament together at the tip portion thereof, is inserted in a protective tube having a large outer diameter so that the tip portion is exposed, in which a portion of the sheathed thermocouple that is exposed from the protective tube is inserted in a protective cylinder having a bottom cover with a hole on a tip side through which the sheathed thermocouple is inserted and having a plurality of through windows, the tip of the sheathed thermocouple is slightly exposed from the bottom cover of the protective cylinder, and the bottom cover of the protective cylinder and the sheathed thermocouple as well as the protective cylinder and a lower portion of the protective tube are welded.

摘要翻译： 本发明的目的是提供一种具有高响应速度的热电偶，即使在高速流体中使用时也不会受到弯曲和弯曲等机械损伤。 本发明提供了一种用于高速流体的快速响应热电偶，其中具有小外径的铠装热电偶通过在金属外壳中容纳正嵌入的热电偶丝和负侧热电偶丝而形成 无机绝缘材料的粉末，并且通过在顶端部分处将正侧热电偶丝和负侧热电偶丝的末端接合在一起的顶端处形成温度感测点，插入保护管中 具有大的外径，使得尖端部分露出，其中从保护管暴露的一部分铠装热电偶被插入到具有底盖的保护筒中，该保护筒具有在顶端侧的孔，护套热电偶 插入并具有多个通孔，该护套热电偶的尖端稍微暴露于保护层的底盖 e气缸，保护筒的底盖和护套热电偶以及保护筒和保护管的下部焊接。

公开(公告)号：US20100072457A1

公开(公告)日：2010-03-25

申请号：US12443575

申请日：2008-07-18

申请人： Yasuhiro Iguchi ,  Hiroshi Okada ,  Yuichi Kawamura

发明人： Yasuhiro Iguchi ,  Hiroshi Okada ,  Yuichi Kawamura

IPC分类号： H01L31/0352

CPC分类号： H01L31/035236 ,  B82Y20/00 ,  H01L27/14649 ,  H01L31/03046 ,  Y02E10/544

摘要： A light-receiving element device capable of receiving near infrared to mid-infrared light of 1.7 μm-3.5 μm is provided. A substrate is formed of InP, and a superlattice light-receiving layer is formed of a superlattice of a type 2 junction formed by alternately being stacked a falling layer of a Group III-V compound semiconductor including In, Ga, As, N and a rising layer of a Group III-V compound semiconductor including Ga, As, Sb. The film thickness of the falling layer and the rising layer is each 3 nm-10 nm. The entire thickness of the superlattice light-receiving layer is 2 μm-7 μm. The lattice mismatch of the constituent film of the superlattice light-receiving layer to InP is ±0.2% or less.

摘要翻译： 提供能够接收1.7μm〜3.5μm的近红外到中红外光的受光元件装置。 衬底由InP形成，并且超晶格光接收层由通过交替堆叠包括In，Ga，As，N的III-V族化合物半导体的下降层形成的2型结的超晶格形成，以及 包含Ga，As，Sb的III-V族化合物半导体的上升层。 下降层和上升层的膜厚分别为3nm〜10nm。 超晶格光接收层的整个厚度为2μm-7μm。 超晶格光接收层的构成膜与InP的晶格失配为±0.2％以下。

公开(公告)号：USD605680S1

公开(公告)日：2009-12-08

申请号：US29322961

申请日：2008-08-14

申请人： Hiroshi Okada

设计人： Hiroshi Okada

公开(公告)号：US07600993B2

公开(公告)日：2009-10-13

申请号：US11840280

申请日：2007-08-17

申请人： Hideaki Kataho ,  Hiroshi Okada ,  Kenya Wada ,  Hisayoshi Ichikawa

发明人： Hideaki Kataho ,  Hiroshi Okada ,  Kenya Wada ,  Hisayoshi Ichikawa

IPC分类号： B29C59/00 ,  B29D17/00

CPC分类号： G11B7/263 ,  B29C59/022 ,  B29C2059/023 ,  B29L2017/005 ,  Y10S425/81

摘要： An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold. A chuck mechanism is provided inside of the lower press member, the chuck mechanism having at least three chuck pawls located in uniformly spaced positions along inner periphery of the substrate plate. The chuck pawls are radially displaceable to take either an operative position or a receded position, and are adapted to grip the inner periphery of the substrate together the small-diameter segments of the center hole of the mold at the time of setting the substrate plate in alignment with the mold, and to grip the inner periphery of said substrate plate alone, at spaced positions from the large-diameter segments of the center hole of the mold, at the time of separating the substrate plate from said mold.

摘要翻译： 一种用于转印微小表面结构图案的装置，使用一对相对于彼此相对移动并相对移动的按压构件。 一个按压构件适于在其上支撑具有在转印表面上具有要转印的微小结构的主图案的模具，而另一个压力构件适于在其上支撑具有涂覆在其上的可固化树脂层的环形基板，并且将 树脂层抵靠模具的转移表面，以将所述微小结构转移到树脂层。 模具设置有圆形中心孔，沿着模具的内周边交替地且以均匀的角度间隔限定至少三个小直径段和三个大直径段。 环形基板具有与模具内周边的小直径段精确匹配的内径。 夹紧机构设置在下压件的内部，卡盘机构具有至少三个卡盘爪，位于沿着基板的内周均匀间隔的位置。 卡盘棘爪可径向移动以采取操作位置或后退位置，并且适于在将基板设置在模具中时将模具的中心孔的小直径段夹持在基板的内周 与模具对准，并且在将基板与模具分离时，在与模具的中心孔的大直径段的间隔位置处单独地夹持所述基板的内周。