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    Packaging substrate having pattern-matched metal layers
    1.
    发明授权
    Packaging substrate having pattern-matched metal layers 失效
    具有图案匹配金属层的包装基板

    公开(公告)号：US07759787B2

    公开(公告)日：2010-07-20

    申请号：US11935834

    申请日：2007-11-06

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H01L23/053 ,  H01L23/12

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。

    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS
    2.
    发明申请
    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS 失效
    包装与图案匹配的金属层的衬底

    公开(公告)号：US20090114429A1

    公开(公告)日：2009-05-07

    申请号：US11935834

    申请日：2007-11-06

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H05K1/03 ,  G06F17/50 ,  H05K3/00

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。

    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS
    3.
    发明申请
    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS 有权
    包装与图案匹配的金属层的衬底

    公开(公告)号：US20100218364A1

    公开(公告)日：2010-09-02

    申请号：US12775970

    申请日：2010-05-07

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H05K3/22

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。

    Packaging substrate having pattern-matched metal layers
    4.
    发明授权
    Packaging substrate having pattern-matched metal layers 有权
    具有图案匹配金属层的包装基板

    公开(公告)号：US07901998B2

    公开(公告)日：2011-03-08

    申请号：US12775970

    申请日：2010-05-07

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H01L21/44 ,  H01L21/48

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。