专利检索 ap:("Stanley A. Cejka" OR "Steven A. Atherton" OR "William J. Downey" OR "James C. Gobab" OR "Brian D. Young") AND inv:"Steven A. Atherton" 第 1 页

1.

发明申请
INTEGRATED CIRCUIT INTERCONNECT CRACK MONITOR CIRCUIT 有权
标题翻译：集成电路互连断路监测电路

公开(公告)号：US20150276854A1

公开(公告)日：2015-10-01

申请号：US14227225

申请日：2014-03-27

申请人： Stanley A. Cejka , Steven A. Atherton , William J. Downey , James C. Gobab , Brian D. Young

发明人： Stanley A. Cejka , Steven A. Atherton , William J. Downey , James C. Gobab , Brian D. Young

IPC分类号： G01R31/28 , H01L23/00 , H01L23/50 , H01L23/538

CPC分类号： G01R31/2818 , G01R31/2812 , G01R31/2882 , G01R31/2896 , H01L22/34 , H01L23/49816 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/1319 , H01L2224/14179 , H01L2224/16227 , H01L2224/45014 , H01L2224/48227 , H01L2224/4847 , H01L2224/852 , H01L2224/85205 , H01L2924/00014 , H01L2924/30101 , H01L2924/351 , H05K1/141 , H05K3/3436 , H01L2924/014 , H01L2224/45099 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0781 , H01L2924/00012

摘要： A circuit device mounted on a substrate includes a detection circuit that monitors a characteristic of a return signal to determine an integrity of various interconnects of the device.

摘要翻译： 安装在基板上的电路装置包括检测电路，其检测返回信号的特性，以确定装置的各种互连的完整性。

2.

发明授权
Integrated circuit interconnect crack monitor circuit 有权
标题翻译：集成电路互连裂纹监测电路

公开(公告)号：US09377504B2

公开(公告)日：2016-06-28

申请号：US14227225

申请日：2014-03-27

申请人： Stanley A. Cejka , Steven A. Atherton , William J. Downey , James C. Golab , Brian D. Young

发明人： Stanley A. Cejka , Steven A. Atherton , William J. Downey , James C. Golab , Brian D. Young

IPC分类号： H01L23/52 , G01R31/28 , H01L23/00 , H01L23/498

CPC分类号： G01R31/2818 , G01R31/2812 , G01R31/2882 , G01R31/2896 , H01L22/34 , H01L23/49816 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/1319 , H01L2224/14179 , H01L2224/16227 , H01L2224/45014 , H01L2224/48227 , H01L2224/4847 , H01L2224/852 , H01L2224/85205 , H01L2924/00014 , H01L2924/30101 , H01L2924/351 , H05K1/141 , H05K3/3436 , H01L2924/014 , H01L2224/45099 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0781 , H01L2924/00012

摘要： A circuit device mounted on a substrate includes a detection circuit that monitors a characteristic of a return signal to determine an integrity of various interconnects of the device.

摘要翻译： 安装在基板上的电路装置包括检测电路，其检测返回信号的特性，以确定装置的各种互连的完整性。