摘要:
A latch includes a memory unit, a transfer unit, an inversion unit, and an output unit. The Memory unit includes a number of storage nodes. The transfer unit transfers a data from a data input node to the storage nodes via a plurality of data paths. Each of the data paths includes a pass element controlled by a pulse. The inversion unit inverts the data before the data is transferred from the data input node to at least one of the storage nodes. The output unit outputs the data from the memory unit to a latch output node. The memory unit, the transfer unit, the inversion unit, and the output unit of the latch form a soft-error rate hardened latch structure with a reduced number of elements and reduced power consumption.
摘要:
A latch includes a memory unit, a transfer unit, an inversion unit, and an output unit. The Memory unit includes a number of storage nodes. The transfer unit transfers a data from a data input node to the storage nodes via a plurality of data paths. Each of the data paths includes a pass element controlled by a pulse. The inversion unit inverts the data before the data is transferred from the data input node to at least one of the storage nodes. The output unit outputs the data from the memory unit to a latch output node. The memory unit, the transfer unit, the inversion unit, and the output unit of the latch form a soft-error rate hardened latch structure with a reduced number of elements and reduced power consumption.
摘要:
Methods of manufacture of integrated circuit inductors having slotted magnetic material will be described. The methods may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers.
摘要:
An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
摘要:
An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.
摘要:
A method and apparatus for multi-phase transformers are described. In one embodiment, a coupled inductor topology for the multi-phase transformers comprising N primary inductors. In one embodiment, each primary inductor is coupled to one of N input nodes and a common output node. The transformer further includes N−1 secondary inductors coupled in series between one input node and the common output node. In one embodiment, the N−1 secondary inductors are arranged to couple energy from N−1 of the primary inductors to provide a common node voltage as an average of N input node voltages, wherein N is an integer greater than two. Other embodiments are described and claimed.
摘要:
A temperature-independent voltage reference containing two independent bias circuits powered by the reference voltage, each bias circuit containing components with an exponential dependence of current on voltage and one containing a resistive impedance, and further including voltage dividers and an active component.
摘要:
A device comprises an active-pull-up stage and an active-pull-down stage. The device receives at least one reference voltage and provides an regulated output voltage to at least one load. The active-pull-up and active-pull-down stages are adapted to source or sink a current delivered to or received from the at least one load to regulate the output voltage provided to the at least one load. Other embodiments and methods are also claimed and described.
摘要:
A method for designing and testing on-die power supply, power distribution, and noise suppression techniques for integrated circuits such as microprocessors is described. A network of time varying loads is distributed along the power supply grid to facilitate testing of new power supplies and grids and noise suppression techniques before design of the chip is completed. Several programmable current sinks are described for presenting loads according to a preferred test-waveform current. Transient, including droop detection, and static testing is easily performed using the described methods and circuitry.