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    Flow-formed chamber component having a textured surface
    1.
    发明申请
    Flow-formed chamber component having a textured surface 有权
    具有纹理表面的流动形成的室部件

    公开(公告)号：US20070059460A1

    公开(公告)日：2007-03-15

    申请号：US11234012

    申请日：2005-09-09

    申请人： Stephen Abney ,  Anthony Vesci ,  Joseph Sommers ,  Marc Schweitzer ,  Scott Dickerson ,  Jennifer Tiller

    发明人： Stephen Abney ,  Anthony Vesci ,  Joseph Sommers ,  Marc Schweitzer ,  Scott Dickerson ,  Jennifer Tiller

    IPC分类号： B31B45/00

    CPC分类号： C23C14/564 ,  B21D22/16 ,  B21J5/12 ,  C23C16/4404 ,  H01J37/32009 ,  Y10T428/13

    摘要： A method of fabricating a component for a substrate processing chamber involves providing a preform having internal and external surfaces, and providing a mandrel having a textured surface with a pattern of textured features comprising protrusions and depressions. The internal surface of the preform component is contacted with the textured surface of mandrel, and a pressure is applied to the external surface of the preform. The pressure is sufficiently high to plastically deform the preform over the textured surface of the mandrel to form a component having a textured internal surface comprising the pattern of textured feature that are shaped and sized to adhere process residues generated in the processing of substrates.

    摘要翻译： 制造用于衬底处理室的部件的方法包括提供具有内部和外部表面的预成型件，并且提供具有纹理表面的心轴，其具有包括凸起和凹陷的纹理特征图案。 预成型件部件的内表面与芯棒的纹理表面接触，并且将压力施加到预成型件的外表面。 压力足够高以使预成型件在心轴的纹理表面上塑性变形，以形成具有纹理化内表面的部件，该内表面包括纹理特征图案，其形状和尺寸适于粘附在基底加工中产生的工艺残留物。

    Cleaning of chamber components
    3.
    发明申请
    Cleaning of chamber components 有权
    清洁腔室部件

    公开(公告)号：US20050172984A1

    公开(公告)日：2005-08-11

    申请号：US10777866

    申请日：2004-02-11

    申请人： Marc Schweitzer ,  Jennifer Tiller ,  Brian West ,  Karl Brueckner

    发明人： Marc Schweitzer ,  Jennifer Tiller ,  Brian West ,  Karl Brueckner

    IPC分类号： B08B7/00 ,  B08B9/08 ,  C23C16/44

    CPC分类号： B08B7/0092 ,  B08B9/08 ,  C23C16/4407

    摘要： In a method of cleaning a surface of a substrate processing chamber component to remove process deposits, the component surface is cooled to a temperature below about −40° C. to fracture the process deposits on the surface. The surface can be cooled by immersing the surface in a low temperature fluid, such as liquid nitrogen. In another version, the component surface is heated to fracture and delaminate the deposits, and optionally, subsequently rapidly cooled to form more fractures. The component surface cleaning can also be performed by bead blasting followed by a chemical cleaning step.

    摘要翻译： 在清洗基板处理室部件的表面以去除工艺沉积物的方法中，将部件表面冷却至低于约-40℃的温度以破坏表面上的工艺沉积物。 表面可以通过将表面浸入诸如液氮的低温流体中来冷却。 在另一个版本中，组件表面被加热以使沉积物断裂并分层，并且任选地随后快速冷却以形成更多的裂缝。 组件表面清洁也可以通过喷丸处理，然后进行化学清洁步骤。

    Ring assembly for substrate processing chamber
    5.
    发明申请
    Ring assembly for substrate processing chamber 审中-公开
    基板处理室的环组件

    公开(公告)号：US20070283884A1

    公开(公告)日：2007-12-13

    申请号：US11444175

    申请日：2006-05-30

    申请人： Jennifer Tiller ,  Allen K. Lau ,  Marc O'Donnell Schweitzer ,  Steven V. Sansoni ,  Keith A. Miller ,  Christopher Boitnott

    发明人： Jennifer Tiller ,  Allen K. Lau ,  Marc O'Donnell Schweitzer ,  Steven V. Sansoni ,  Keith A. Miller ,  Christopher Boitnott

    IPC分类号： C23C16/00 ,  C23F1/00

    CPC分类号： C23C14/564 ,  H01J37/32623 ,  H01J37/32642 ,  H01L21/68735

    摘要： A ring assembly is provided for a substrate support used in a substrate processing chamber, the substrate support comprising an annular ledge and an inner perimeter sidewall. In one version, the ring assembly comprises (i) an L-shaped isolator ring comprising a horizontal leg resting on the annular ledge of the support, and a vertical leg abutting the inner perimeter sidewall of the support, and (ii) a deposition ring comprising an annular band having an overlap ledge that overlaps the horizontal leg of the isolator ring. In another version, the deposition ring comprises a dielectric annular band that surrounds and overlaps the annular ledge of the support, and a bracket and fastener.

    摘要翻译： 提供了用于衬底处理室中的衬底支撑件的环组件，衬底支撑件包括环形凸缘和内周边侧壁。 在一个版本中，环组件包括（i）包括搁置在支撑件的环形凸缘上的水平腿的L形隔离器环和邻接支撑件的内周侧壁的垂直腿，以及（ii）沉积环 包括具有与隔离环的水平支腿重叠的重叠壁架的环形带。 在另一个版本中，沉积环包括围绕和重叠支撑件的环形凸缘的电介质环形带，以及支架和紧固件。