摘要:
The invention provides an FPGA comprising an array of identical tiles. Each tile comprises a logic block that includes a Configurable Logic Element (CLE). In one embodiment, the CLE is implemented in two similar portions called "slices". Each slice has a separate carry chain. In a CLE with four function generators, each carry chain incorporates the outputs of two function generators.
摘要:
The invention provides an FPGA interconnect structure preferably included in an array of identical tiles. Each tile comprises a logic block that includes a Configurable Logic Element (CLE) and an output multiplexer. Fast feedback paths are provided within the logic block to connect the CLE outputs to the CLE inputs, either directly or through an input multiplexer. The fast feedback paths bypass the output multiplexer and therefore provide faster feedback than can be obtained in most conventional FPGA logic blocks. In one embodiment, the fast feedback paths provide the ability for all function generators in one CLE to drive each other through fast feedback paths, regardless of how logic is mapped into the function generators of the CLE.
摘要:
The invention allows the implementation of common wide logic functions using only two function generators of a field programmable gate array. One embodiment of the invention provides a structure for implementing a wide AND-gate in an FPGA configurable logic element (CLE) or portion thereof that includes no more than two function generators. First and second function generators are configured as AND-gates, the output signals (first and second AND signals) being combined in a 2-to-1 multiplexer controlled by the first AND signal, “0” selecting the first AND signal and “1” selecting the second AND signal. Therefore, a wide AND-gate is provided having a number of input signals equal to the total number of input signals for the two function generators. In another embodiment, a wide OR-gate is provided by configuring the function generators as OR-gates and controlling the multiplexer using the second OR signal.
摘要:
The invention allows the implementation of common wide logic functions using only two function generators of a field programmable gate array. One embodiment of the invention provides a structure for implementing a wide AND-gate in an FPGA configurable logic element (CLE) or portion thereof that includes no more than two function generators. First and second function generators are configured as AND-gates, the output signals (first and second AND signals) being combined in a 2-to-1 multiplexer controlled by the first AND signal, “0” selecting the first AND signal and “1” selecting the second AND signal. Therefore, a wide AND-gate is provided having a number of input signals equal to the total number of input signals for the two function generators. In another embodiment, a wide OR-gate is provided by configuring the function generators as OR-gates and controlling the multiplexer using the second OR signal.
摘要:
A clock distribution circuit and method for programmable ICs whereby the incoming clock frequency is optionally divided by two and distributed at the new, lower frequency. Programmable dual-edge/single-edge flip-flops are provided that optionally operate at twice the frequency of the distributed clock, being responsive to both rising and falling edges of the distributed clock. When the clock divider is enabled and the flip-flops are programmed as dual-edge, the operating frequency is the same as that of the incoming clock; however, the frequency of the distributed clock is reduced by one-half. This reduction halves the frequency at which the clock distribution circuits operate, and consequently approximately halves the power dissipated by the clock distribution circuit, thereby providing a programmable power-saving mode.
摘要:
In one embodiment an IC is disclosed which includes a plurality of cascaded digital signal processing slices, wherein each slice has a multiplier coupled to an adder via a multiplexer and each slice has a direct connection to an adjoining slice; and means for configuring the plurality of digital signal processing slices to perform one or more mathematical operations, via, for example, opmodes. This IC allows for the implementation of some basic math functions, such as add, subtract, multiply and divide. Many other applications may be implemented using the one or more DSP slices, for example, accumulate, multiply accumulate (MACC), a wide multiplexer, barrel shifter, counter, and folded, decimating, and interpolating FIRs to name a few.
摘要:
Described is a programmable logic device (PLD) with columns of DSP slices that can be cascaded to create DSP circuits of varying size and complexity. Each slice includes a mode port that receives mode control signals for dynamically altering the function and connectivity of related slices. Such alterations can occur with or without reconfiguring the PLD.
摘要:
An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.
摘要:
Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.
摘要:
Formation of a hybrid integrated circuit device (400) is described. A design for the integrated circuit (100) is obtained and separated into at least two portions responsive to component sizes. A first die (200) is formed for a first portion of the hybrid integrated circuit device (400) using at least in part a first minimum dimension lithography. A second die (300) is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die (300) has the second minimum dimension lithography as a smallest lithography used for the forming of the second die (300). The first die (200) and the second die (300) are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device (400).