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    On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
    2.
    发明申请
    On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device 有权
    将衬底上发光器和/或接收器与衬底上的光学器件耦合的衬底上微透镜

    公开(公告)号：US20060067606A1

    公开(公告)日：2006-03-30

    申请号：US10955553

    申请日：2004-09-30

    申请人： Steven Towle ,  Henning Braunisch ,  Daoqiang Lu ,  Gilroy Vandentop ,  Anna George

    发明人： Steven Towle ,  Henning Braunisch ,  Daoqiang Lu ,  Gilroy Vandentop ,  Anna George

    IPC分类号： G02B6/12

    CPC分类号： G02B6/42 ,  G02B6/4206

    摘要： Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus the light toward a focal point, and an on-substrate optical device coupled with the substrate proximate the focal point to receive the focused light. Communication of light in the reverse direction is also disclosed. Systems including the optical apparatus are also disclosed.

    摘要翻译： 本文公开了光学设备，形成设备的方法以及使用该设备的方法。 在一个方面，光学装置可以包括衬底，与衬底耦合的衬底上的微透镜以接收来自离衬底光发射器的光并将光聚焦到焦点，以及与衬底上的光学器件耦合的衬底上的光学器件 靠近焦点的基板以接收聚焦光。 还公开了相反方向的光的通信。 还公开了包括光学装置的系统。

    Optical package
    4.
    发明申请
    Optical package 失效
    光学包装

    公开(公告)号：US20060067609A1

    公开(公告)日：2006-03-30

    申请号：US10954903

    申请日：2004-09-30

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC分类号： G02B6/26 ,  G02B6/12 ,  G02B6/42

    CPC分类号： G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    摘要翻译： 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。

    Optical package
    5.
    发明授权
    Optical package 失效
    光学包装

    公开(公告)号：US07283699B2

    公开(公告)日：2007-10-16

    申请号：US10954903

    申请日：2004-09-30

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC分类号： G02B6/26 ,  G02B6/12

    CPC分类号： G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    摘要翻译： 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。

    Manufacturable connectorization process for optical chip-to-chip interconnects
    6.
    发明申请
    Manufacturable connectorization process for optical chip-to-chip interconnects 有权
    用于光芯片到芯片互连的可制造的连接器化过程

    公开(公告)号：US20060067624A1

    公开(公告)日：2006-03-30

    申请号：US10955897

    申请日：2004-09-30

    申请人： Steven Towle ,  Anne George ,  Daoqiang Lu ,  Henning Braunisch

    发明人： Steven Towle ,  Anne George ,  Daoqiang Lu ,  Henning Braunisch

    IPC分类号： G02B6/30

    CPC分类号： G02B6/241 ,  G02B6/30

    摘要： An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning a width of the waveguide array, the ferrule being directly in contact with a surface of the waveguide array. A process comprising positioning a waveguide in a trench on a substrate, the waveguide extending to an edge of the substrate, and attaching a ferrule at or near the edge of the substrate, the ferrule including a recess having a bottom, wherein the bottom is in direct contact with a surface of the waveguide.

    摘要翻译： 一种包括其中具有沟槽的衬底的器件，所述沟槽延伸到衬底的边缘，定位在沟槽中的波导阵列，延伸到衬底边缘的波导阵列以及附接在衬底的边缘处或附近的套圈 衬底并跨越波导阵列的宽度，套圈直接与波导阵列的表面接触。 一种方法，包括将波导定位在衬底上的沟槽中，波导延伸到衬底的边缘，以及在衬底的边缘处或附近附接套圈，套圈包括具有底部的凹部，其中底部处于 与波导的表面直接接触。

    Underfill integration for optical packages
    8.
    发明申请
    Underfill integration for optical packages 有权
    光学封装的底部填充集成

    公开(公告)号：US20050127528A1

    公开(公告)日：2005-06-16

    申请号：US11036302

    申请日：2005-01-14

    申请人： Daoqiang Lu ,  Steven Towle ,  Anna George

    发明人： Daoqiang Lu ,  Steven Towle ,  Anna George

    IPC分类号： G02B6/42 ,  H01L21/44 ,  H01L21/56 ,  H01L29/40

    CPC分类号： G02B6/4214 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

    摘要： The application discloses an apparatus comprising an optical die flip-chip bonded to a substrate and defining a volume between the optical die and the substrate, the optical die including an optically active area on a surface of the die facing the substrate, an optically transparent material occupying at least those portions of the volume substantially corresponding with the optically active area, and an underfill material occupying portions of the volume not occupied by the optically transparent material. Also disclosed is a process comprising flip-chip bonding an optical die to a substrate, the optical die including at least one optically active area on a surface thereof facing the substrate, dispensing an optically transparent material between the optical die and the substrate, wherein the optically transparent material covers the at least one optically active area, dispensing an underfill material in the volume between the optical die and the substrate not occupied by the optically transparent material, and curing the optically transparent material and the underfill material. Other embodiments are described and claimed.

    摘要翻译： 本申请公开了一种装置，其包括结合到基板并限定光学管芯和基板之间的体积的光学晶片倒装芯片，光学管芯包括在面向基板的管芯的表面上的光学有效区域，光学透明材料 占据至少基本对应于光学活性区域的那些部分，以及占据未被光学透明材料占据的部分体积的底部填充材料。 还公开了一种包括将光学裸片倒装芯片结合到衬底的工艺，该光学裸片在其面向衬底的表面上包括至少一个光学活性区域，在光学裸片和衬底之间分配光学透明材料，其中， 光学透明材料覆盖至少一个光学活性区域，在光学裸片和未被光学透明材料占据的基底之间的体积中分配底部填充材料，并固化光学透明材料和底部填充材料。 描述和要求保护其他实施例。

    Optical devices and methods to construct the same
    10.
    发明授权
    Optical devices and methods to construct the same 失效
    光学器件和方法构造相同

    公开(公告)号：US07195941B2

    公开(公告)日：2007-03-27

    申请号：US10397580

    申请日：2003-03-26

    申请人： Daoqiang Lu ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Gilroy Vandentop

    IPC分类号： H01L21/00 ,  H32B6/36

    CPC分类号： G02B6/423 ,  G02B6/4232

    摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.

    摘要翻译： 公开了用于构造它们的光学器件和方法。 一种示例性的光学器件包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。 其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。 第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。