Electrical component placing apparatus and placing method therefor
    4.
    发明授权
    Electrical component placing apparatus and placing method therefor 失效
    电气元件放置装置及其放置方法

    公开(公告)号:US5155903A

    公开(公告)日:1992-10-20

    申请号:US686460

    申请日:1991-04-17

    IPC分类号: H05K13/04

    摘要: There are irregularities in the thicknesses, longitudinal and lateral sizes of electrical components, which cause placement errors of the electrical components on substrates. Therefore, the thickness, longitudinal and lateral sizes of the electrical component is measured during feeding the electrical component to the substrate. The irregularity of the thicknesses of the electrical components can be corrected by regulating the vertical stroke of a nozzle. The temporary values of the longitudinal and lateral sizes of the electrical component are registered in advance in a computer. When the measured values fall within the allowable range of the temporary values, the correction value of the temporary value based on the measured value is corrected, and the correction value is registered as a new reference value in the computer.

    摘要翻译: 电气部件的厚度,纵向和横向尺寸存在不规则性,这导致基板上的电气部件的放置误差。 因此,在将电气部件馈送到基板期间测量电气部件的厚度,纵向和横向尺寸。 可以通过调节喷嘴的垂直行程来校正电气部件的厚度的不规则性。 电气部件的纵向和横向尺寸的临时值预先登记在计算机中。 当测量值在临时值的允许范围内时,校正基于测量值的临时值的校正值,并且将校正值作为新的参考值登记在计算机中。

    Electrical component placing apparatus
    5.
    发明授权
    Electrical component placing apparatus 失效
    电气元件放置装置

    公开(公告)号:US5131139A

    公开(公告)日:1992-07-21

    申请号:US642763

    申请日:1991-01-18

    IPC分类号: H05K13/04

    摘要: A tapered surface is formed on a nozzle for picking up an electrical component and placing it on a printed circuit as a light diffusing surface. When a light is radiated to the tapered surface, the light is scattered, and the tapered surface becomes bright. Therefore, the electrical component is clearly observed as a black contour in the bright tapered surface by an observing unit.

    摘要翻译: 锥形表面形成在用于拾取电气部件的喷嘴上并将其放置在作为光漫射表面的印刷电路上。 当光照射到锥形表面时,光被散射,并且锥形表面变亮。 因此,通过观察单元,明亮的锥形表面中的电气部件被清楚地观察为黑色轮廓。

    Method for mounting an electronic part by solder position detection
    10.
    发明授权
    Method for mounting an electronic part by solder position detection 有权
    通过焊接位置检测安装电子部件的方法

    公开(公告)号:US07059043B2

    公开(公告)日:2006-06-13

    申请号:US10998470

    申请日:2004-11-29

    IPC分类号: H05K3/30

    摘要: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

    摘要翻译: 一种用于通过转印头9从零件供应部分3中取出电子部件并将电子部件运输和安装到板2上的电子部件安装装置具有独立于转印头9移动并前进到 并且从位于传送通道1上的板2退回以拾取板2的图像以检测其位置。 同时执行由板识别摄像机15进行的板2的图像拾取步骤以及由转印头9在零件供给部中取出步骤的部分。 因此,可以缩短生产节拍时间,并且可以有效地将电子部件安装在板上。