公开(公告)号：US07067265B2

公开(公告)日：2006-06-27

申请号：US10640483

申请日：2003-08-14

申请人： Susumu Seino ,  Hideki Yano ,  Changzheng Wang

发明人： Susumu Seino ,  Hideki Yano ,  Changzheng Wang

IPC分类号： C12N15/12 ,  G01N33/566

CPC分类号： C07K14/705

摘要： The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl−/HCO3− exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl−/HCO3− exchanger, and cells in which the proteins exogenously expressed.

摘要翻译： 本发明公开了包含SEQ ID NO：1或NO：3编码Na +和/或NCO 3 / NCO 3的核苷酸序列的DNA 包含SEQ ID NO：2或NO：4所示的氨基酸序列的蛋白质及其同源蛋白质，其包含具有缺失，取代，添加或插入氨基酸的氨基酸序列，其中 当在细胞中表达时，蛋白质用作Na +和/或NCO 3交换剂， 以及蛋白质外源表达的细胞。

公开(公告)号：US06673899B2

公开(公告)日：2004-01-06

申请号：US09920804

申请日：2001-08-03

申请人： Susumu Seino ,  Hideki Yano ,  Changzheng Wang

发明人： Susumu Seino ,  Hideki Yano ,  Changzheng Wang

IPC分类号： C07K14705

CPC分类号： C07K14/705

摘要： The present invention discloses DNAs comprising nucleotide sequences set forth as SEQ ID NO:1 or NO:3 encoding Na+-driven Cl—/HCO3— exchanger, proteins comprising amino acid sequences set forth as SEQ ID NO:2 or NO:4, and their homologous proteins comprising an amino acid sequence having deletion, substitution, addition or insertion amino acids, which proteins, when expressed in a cell, functions as Na+-driven Cl—/HCO3— exchanger, and cells in which the proteins exogenously expressed.

摘要翻译： 本发明公开了包含编码Na +驱动的Cl- / HCO 3 - 交换体的SEQ ID NO：1或NO：3所示的核苷酸序列的DNA，包含SEQ ID NO：2或NO： 4及其包含具有缺失，取代，添加或插入氨基酸的氨基酸序列的同源蛋白质，当在细胞中表达时，这些蛋白质用作Na +驱动的Cl- / HCO 3 - 交换剂，以及其中 外源表达的蛋白质。

公开(公告)号：US08652519B2

公开(公告)日：2014-02-18

申请号：US13299221

申请日：2011-11-17

申请人： Shuichi Yada ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

发明人： Shuichi Yada ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

IPC分类号： A61K31/455 ,  A61K9/30 ,  A61K31/549 ,  A61K9/36

CPC分类号： A61K47/02 ,  A61K9/2009 ,  A61K9/2018 ,  A61K9/2054 ,  A61K9/2059 ,  A61K31/4178 ,  A61K31/44 ,  A61K31/4418 ,  A61K31/4422 ,  A61K31/54 ,  A61K31/549 ,  A61K2300/00

摘要： A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.

摘要翻译： 含有奥美沙坦酯和苯磺酸氨氯地平的药物片剂，其具有改善的溶解性。 所述组合物含有（A）奥美沙坦酯和（B）苯磺酸氨氯地平作为活性成分，（C）含钙添加剂。 还提供了通过使用所述组合物改进含有奥美沙坦酯和苯磺酸氨氯地平的药物组合物的溶解性质的方法。

公开(公告)号：US20120064158A1

公开(公告)日：2012-03-15

申请号：US13299221

申请日：2011-11-17

申请人： Shuichi YADA ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

发明人： Shuichi YADA ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

IPC分类号： A61K31/455 ,  A61K9/30 ,  A61K31/549 ,  A61K9/36 ,  A61K9/28 ,  A61P9/12

CPC分类号： A61K47/02 ,  A61K9/2009 ,  A61K9/2018 ,  A61K9/2054 ,  A61K9/2059 ,  A61K31/4178 ,  A61K31/44 ,  A61K31/4418 ,  A61K31/4422 ,  A61K31/54 ,  A61K31/549 ,  A61K2300/00

摘要： A pharmaceutical tablet containing olmesartan medoxomil and amlodipine besylate, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine besylate as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine besylate by using said composition is also provided.

摘要翻译： 含有奥美沙坦酯和苯磺酸氨氯地平的药物片剂，其具有改善的溶解性。 所述组合物含有（A）奥美沙坦酯和（B）苯磺酸氨氯地平作为活性成分，（C）含钙添加剂。 还提供了通过使用所述组合物改进含有奥美沙坦酯和苯磺酸氨氯地平的药物组合物的溶解性质的方法。

公开(公告)号：US06251502B1

公开(公告)日：2001-06-26

申请号：US09357659

申请日：1999-07-20

申请人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

发明人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

IPC分类号： B32B300

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/252

摘要： It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括上导体电路层，下导体电路层和电绝缘两个导体电路层的树脂绝缘层，其中树脂绝缘层是由由 耐热树脂难溶于作为下层的酸或氧化剂以及由耐热树脂作为上层制成的用于化学镀的粘合剂层，如果需要，树脂填充在导体绝缘 电路，以使表面进入与导体电路的表面相同的平面。

公开(公告)号：US06217988B1

公开(公告)日：2001-04-17

申请号：US09432080

申请日：1999-11-02

申请人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

发明人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

IPC分类号： B32B300

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/252

摘要： It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

公开(公告)号：US20110038898A1

公开(公告)日：2011-02-17

申请号：US12921627

申请日：2009-03-02

申请人： Shuichi Yada ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

发明人： Shuichi Yada ,  Hideki Yano ,  Tsuyoshi Nagaike ,  Misato Yokoi

IPC分类号： A61K9/00 ,  A61K31/4418 ,  A61K31/549 ,  A61P9/12

CPC分类号： A61K47/02 ,  A61K9/2009 ,  A61K9/2018 ,  A61K9/2054 ,  A61K9/2059 ,  A61K31/4178 ,  A61K31/44 ,  A61K31/4418 ,  A61K31/4422 ,  A61K31/54 ,  A61K31/549 ,  A61K2300/00

摘要： A pharmaceutical composition containing olmesartan medoxomil and amlodipine, which has improved dissolvability. Said composition contains (A) olmesartan medoxomil and (B) amlodipine as active ingredients and (C) a calcium-containing additive. A method of improving the dissolution properties of a pharmaceutical composition containing olmesartan medoxomil and amlodipine by using said composition is also provided.

摘要翻译： 含有奥美沙坦酯和氨氯地平的药物组合物具有改善的溶解性。 所述组合物含有（A）奥美沙坦酯和（B）氨氯地平作为活性成分和（C）含钙添加剂。 还提供了通过使用所述组合物改进含有奥美沙坦酯和氨氯地平的药物组合物的溶解性质的方法。

公开(公告)号：US6010768A

公开(公告)日：2000-01-04

申请号：US854683

申请日：1997-05-12

申请人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

发明人： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773 ,  H05K3/382 ,  H05K3/384 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/252

摘要： It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括上导体电路层，下导体电路层和电绝缘两个导体电路层的树脂绝缘层，其中树脂绝缘层是由由 耐热树脂难溶于作为下层的酸或氧化剂以及由耐热树脂作为上层制成的用于化学镀的粘合剂层，如果需要，树脂填充在导体绝缘 电路，以使表面进入与导体电路的表面相同的平面。

公开(公告)号：USD401260S

公开(公告)日：1998-11-17

申请号：US83392

申请日：1998-02-10

申请人： Ryo Kodama ,  Hideki Yano

设计人： Ryo Kodama ,  Hideki Yano

公开(公告)号：US5346952A

公开(公告)日：1994-09-13

申请号：US54838

申请日：1993-04-30

申请人： Masafumi Hongo ,  Hideki Yano ,  Hideyuki Shigemitsu

发明人： Masafumi Hongo ,  Hideki Yano ,  Hideyuki Shigemitsu

IPC分类号： C08L25/04 ,  C08L51/04 ,  C08L71/12 ,  C08L39/04

CPC分类号： C08L25/04 ,  C08L51/04 ,  C08L71/123 ,  C08L71/12 ,  Y10S525/905

摘要： Disclosed is a thermoplastic resin composition comprised of (A) 10-60 weight parts of a polyphenylene ether resin, (B) 20-70 weight parts of (b-1) an aromatic vinyl resin and/or (b-2) a copolymer of an aromatic vinyl monomer with a heterocyclic compound having a vinyl group and containing nitrogen as the hetero atom and (C) 10-60 weight parts of (c-1) a graft copolymer obtained by polymerizing an aromatic vinyl monomer, optionally with other vinyl monomer, in the presence of a butadiene type rubbery polymer or (c-2) a graft copolymer obtained by polymerizing an aromatic vinyl monomer and a heterocyclic compound having a vinyl group and containing nitrogen as the hereto atom, optionally with other ethylenically unsaturated compound, in the presence of a butadiene type rubbery polymer, wherein at least one of the components (B) and (C) is a polymer of the nitrogen-containing heterocyclic compound, and the total amount of the components (A), (B) and (C) is 100 parts by weight.

摘要翻译： 公开了一种热塑性树脂组合物，其包含（A）10-60重量份聚苯醚树脂，（B）20-70重量份（b-1）芳族乙烯基树脂和/或（b-2）共聚物 具有乙烯基并含有氮作为杂原子的杂环化合物的芳族乙烯基单体和（C）10-60重量份的（c-1）通过芳香族乙烯基单体聚合获得的接枝共聚物，任选地与其它乙烯基 单体，在丁二烯型橡胶状聚合物的存在下，或（c-2）通过使芳族乙烯基单体和具有乙烯基并含有氮作为本发明原子的杂环化合物任选地与其它烯属不饱和化合物聚合而获得的接枝共聚物， 在丁二烯型橡胶状聚合物的存在下，其中组分（B）和（C）中的至少一种是含氮杂环化合物的聚合物，以及组分（A），（B）和 （C）为100重量份。