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公开(公告)号：US11932534B2
公开(公告)日：2024-03-19
申请号：US17696299
申请日：2022-03-16
发明人： Hung-Hua Lin , Chang-Ming Wu , Chung-Yi Yu , Ping-Yin Liu , Jung-Huei Peng
CPC分类号： B81C1/00238 , B81B7/008 , B81C1/00333 , H01L24/09 , H01L24/89 , B81B2207/07 , B81C2201/0132 , B81C2203/0109 , B81C2203/0785 , B81C2203/0792 , H01L2224/091 , H01L2224/80013 , H01L2224/80895
摘要： A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
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2.发明申请公开(公告)号：US20220204340A1
公开(公告)日：2022-06-30
申请号：US17696299
申请日：2022-03-16
发明人： Hung-Hua Lin , Chang-Ming Wu , Chung-Yi Yu , Ping-Yin Liu , Jung-Huei Peng
摘要： A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.
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公开(公告)号：US20170077062A1
公开(公告)日：2017-03-16
申请号：US15345596
申请日：2016-11-08
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： H01L23/00 , H01L21/683
CPC分类号： H01L24/799 , G05B2219/45031 , H01L21/67092 , H01L21/6838 , H01L24/98 , H01L2924/35
摘要： An apparatus includes a bottom stage configured to hold a bottom surface of a substrate stack including at least two substrates, a top stage configured to hold a top surface of the substrate stack, and at least one blade configured to be inserted between two adjacent substrates of the substrate stack, wherein the at least one blade has a pointed tip in plan view and has a channel configured to inject air or fluid.
摘要翻译： 一种装置包括：底级，其被配置为保持包括至少两个基板的基板堆叠的底表面，顶部构造成保持基板叠层的顶表面;以及至少一个叶片，其构造成插入在两个相邻的基板之间 所述基板堆叠，其中所述至少一个叶片在平面图中具有尖端，并且具有被配置为喷射空气或流体的通道。
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公开(公告)号：US20160299068A1
公开(公告)日：2016-10-13
申请号：US15191144
申请日：2016-06-23
发明人： Hung-Hua Lin , Li-Cheng Chu , Ming-Tung Wu , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： G01N21/55 , G01N33/483 , G01N21/01
CPC分类号： G01N21/55 , G01N21/01 , G01N21/253 , G01N27/327 , G01N33/483 , G01N2021/0106 , G01N2201/0636
摘要： A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.
摘要翻译： 生物感测结构包括整体连接基底的一部分的台面，其中台面具有顶表面和与顶表面相邻的侧壁表面。 该生物感测结构包括在台面的上表面和侧壁表面上的第一光反射层。 生物感测结构包括围绕台面的填充材料，其中台面从填充材料突出。 生物感测结构包括在填充材料上的停止层和第一光反射层的一部分。 生物感测结构包括在停止层的一部分上的第二光反射层和台面的顶表面的一部分。 生物感测结构包括在第二光反射层中的开口以部分地暴露台面的顶表面。
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公开(公告)号：US20230371383A1
公开(公告)日：2023-11-16
申请号：US18355494
申请日：2023-07-20
发明人： Yi-Ren Wang , Hung-Hua Lin , Yuan-Chih Hsieh
CPC分类号： H10N30/06 , B81C1/00166 , B81B3/0021 , B81C1/00349 , H10N30/87
摘要： In some embodiments, the present disclosure relates to a piezomicroelectromechanical system (piezoMEMS) device that includes a second piezoelectric layer arranged over the first electrode layer. A second electrode layer is arranged over the second piezoelectric layer. A first contact is arranged over and extends through the second electrode layer and the second piezoelectric layer to contact the first electrode layer. A dielectric liner layer is arranged directly between the first contact and inner sidewalls of the second electrode layer and the second piezoelectric layer. A second contact is arranged over and electrically coupled to the second electrode layer, wherein the second contact is electrically isolated from the first contact.
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公开(公告)号：US20220219973A1
公开(公告)日：2022-07-14
申请号：US17706863
申请日：2022-03-29
发明人： Hung-Hua Lin , Chia-Ming Hung , Xin-Hua Huang , Yuan-Chih Hsieh
摘要： Various embodiments of the present disclosure are directed towards a method for forming an integrated chip, where the method includes forming an interconnect structure over a first substrate. A dielectric structure is formed over the interconnect structure. The dielectric structure comprises opposing sidewalls defining an opening. A conductive bonding structure is formed on a second substrate. A bonding process is performed to bond the conductive bonding structure to the interconnect structure. The conductive bonding structure is disposed in the opening. The bonding process defines a first cavity between inner opposing sidewalls of the conductive bonding structure and a second cavity between the conducive bonding structure and the opposing sidewalls of the dielectric structure.
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公开(公告)号：US20200006052A1
公开(公告)日：2020-01-02
申请号：US16569019
申请日：2019-09-12
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Hsun-Chung Kuang , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
摘要： A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
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公开(公告)号：US10266390B2
公开(公告)日：2019-04-23
申请号：US14925345
申请日：2015-10-28
发明人： Shang-Ying Tsai , Hsin-Ting Huang , Lung Yuan Pan , Jung-Huei Peng , Hung-Hua Lin , Yao-Te Huang
摘要： A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.
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公开(公告)号：US10119909B2
公开(公告)日：2018-11-06
申请号：US15191144
申请日：2016-06-23
发明人： Hung-Hua Lin , Li-Cheng Chu , Ming-Tung Wu , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： G01N21/00 , G01N21/55 , G01N27/327 , G01N33/483 , G01N21/01 , G01N21/25
摘要： A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.
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公开(公告)号：US09446467B2
公开(公告)日：2016-09-20
申请号：US13888921
申请日：2013-05-07
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Xin-Chung Kuang , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
CPC分类号： H01L21/02068 , B23K1/0016 , B23K1/206 , B23K20/026 , B23K20/233 , B23K20/24 , B23K2101/40 , B23K2101/42 , H01L24/89 , H01L2224/80894
摘要： A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
摘要翻译： 一种方法包括在第一包装部件的表面上执行等离子体激活，从第一包装部件的金属焊盘的表面去除氧化物区域，以及执行预接合以将第一包装部件结合到第二包装部件。
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