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1.
公开(公告)号:US11705347B2
公开(公告)日:2023-07-18
申请号:US16892945
申请日:2020-06-04
发明人: Katsuyuki Koizumi
IPC分类号: H01L21/683 , H01L21/67 , H01L21/687
CPC分类号: H01L21/67098 , H01L21/67248 , H01L21/68714
摘要: A thermal regulator for controlling temperature of a substantially circular stage comprising a plurality of first segments and a plurality of second segments in a radial direction and in a circumferential direction, each of the first segments and at least two adjacent second segments defining a set of segments, the thermal regulator includes heaters disposed in the first and second segments, respectively, thermal sensors disposed in the first segments, respectively, a controller configured to control the heaters in response to temperatures determined by the thermal sensors, and a segment switch to switch the second segments to be controlled in conjunction with the first segment in each set of segments.
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2.
公开(公告)号:US10199246B2
公开(公告)日:2019-02-05
申请号:US15021326
申请日:2014-10-16
IPC分类号: H01L21/3065 , H01L21/683 , F27B5/14 , F27B5/18 , F27D11/02 , H01L21/67 , F27B17/00 , F27D19/00
摘要: There is provided a temperature control mechanism comprising: a plurality of combinations of a heater and a thyristor, wherein at least one combination of the heater and the thyristor is provided on a zone-by-zone basis, and wherein an area of an electrostatic chuck for mounting a substrate is divided into a plurality of zones; a power supply configured to supply current to heaters of the plurality of combinations respectively through the thyristors of the plurality of combinations; a pair of filters disposed at a power supply line for supplying electric power from the power supply to the heaters and configured to eliminate high frequency power applied to the power supply.
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公开(公告)号:US20130220545A1
公开(公告)日:2013-08-29
申请号:US13774037
申请日:2013-02-22
发明人: Katsuyuki Koizumi , Takehiro Ueda
IPC分类号: H01L21/683
CPC分类号: H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , Y10T279/23
摘要: A substrate mounting table and a plasma etching apparatus can supply a power to a temperature controlling heater electrode effectively while preventing atmosphere from being leaked and preventing processing uniformity in a surface of a substrate from being deteriorated. The substrate mounting table and the plasma etching apparatus include an insulating member having therein an electrostatic chuck electrode and a temperature controlling heater electrode; a plate-shaped temperature controlling member having therein a temperature controlling medium path through which a temperature controlling medium is circulated; a cylindrical member made of an insulating material and provided within a through hole formed in the plate-shaped temperature controlling member; and a lead line, provided within the cylindrical member, having one end connected to the temperature controlling heater electrode and the other end connected to a connecting terminal provided at a bottom surface side of the cylindrical member.
摘要翻译: 衬底安装台和等离子体蚀刻装置可以有效地向温度控制加热器电极供电,同时防止气体泄漏,并防止衬底表面的加工均匀性劣化。 衬底安装台和等离子体蚀刻装置包括其中具有静电卡盘电极和温度控制加热器电极的绝缘构件; 其中具有温度控制介质循环的温度控制介质路径的板状温度控制构件; 由绝缘材料制成并设置在形成在板状温度控制构件中的通孔内的圆柱形构件; 以及设置在所述筒状构件内的引线,其一端与所述温度控制加热器电极连接,所述另一端与设置在所述筒状构件的底面侧的连接端子连接。
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公开(公告)号:US11373884B2
公开(公告)日:2022-06-28
申请号:US16866232
申请日:2020-05-04
IPC分类号: H01L21/67 , H01J37/32 , H01L21/683
摘要: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.
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公开(公告)号:US10515786B2
公开(公告)日:2019-12-24
申请号:US15270342
申请日:2016-09-20
发明人: Shingo Koiwa , Yasuhisa Kudo , Katsuyuki Koizumi
IPC分类号: H01J37/32 , H01L21/67 , H01L21/683 , F28F27/02
摘要: A mounting table includes a cooling table, a power feed body, an electrostatic chuck, a first elastic member and a clamping member. The power feed body is connected to the cooling table to transmit a high frequency power. A base of the electrostatic chuck has conductivity. An attraction unit has an attraction electrode and a heater therein, and is fastened to the base by metal bonding. The first elastic member is provided between the cooling table and the base to allow the electrostatic chuck to be spaced apart from the cooling table. The first elastic member forms, along with the cooling table and the base, a heat transfer space into which a heat transfer gas is supplied. The clamping member is contacted with the cooling table and the base, and allows the base and the first elastic member to be interposed between the cooling table and the clamping member.
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公开(公告)号:US11735444B2
公开(公告)日:2023-08-22
申请号:US16998264
申请日:2020-08-20
IPC分类号: H01L21/67 , H01L21/687 , H01L21/683
CPC分类号: H01L21/67103 , H01L21/67109 , H01L21/6833 , H01L21/68785
摘要: A stage includes a base having an accommodation space therein, a dielectric layer provided on a first surface of the base and having a placement surface on which a substrate is placed, the dielectric layer including therein a plurality of heaters, and a heater control board disposed in the accommodation space and configured to drive the plurality of heaters. The base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space.
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公开(公告)号:US20210043476A1
公开(公告)日:2021-02-11
申请号:US16987650
申请日:2020-08-07
IPC分类号: H01L21/67 , H01L21/3065 , H01L21/683 , H01L21/687
摘要: A placing table configured to place a substrate on an electrostatic chuck includes a base; the electrostatic chuck placed on a placing surface of the base; and a path formed within the placing table along the placing surface, and configured to allow a heat exchange medium to flow therein from an inlet opening to an outlet opening of the heat exchange medium. A distance between a top surface of the path and the placing surface is constant from the inlet opening to the outlet opening. A cross sectional shape of the path in a direction perpendicular to the top surface is differed depending on a position in the path.
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公开(公告)号:US20210043433A1
公开(公告)日:2021-02-11
申请号:US16987674
申请日:2020-08-07
摘要: A placing table includes a first surface located at an outer side than a substrate; and a second surface on which the substrate is placed. A first path is formed to correspond to the first surface.
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公开(公告)号:US10679869B2
公开(公告)日:2020-06-09
申请号:US15308686
申请日:2015-06-01
IPC分类号: H01L21/67 , H01J37/32 , H01L21/683
摘要: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.
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公开(公告)号:US11935729B2
公开(公告)日:2024-03-19
申请号:US17190178
申请日:2021-03-02
CPC分类号: H01J37/32715 , H01J37/32082 , H01J37/32642 , H02N13/00 , H01J2237/2007 , H01J2237/334
摘要: The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
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