公开(公告)号：US20150212127A1

公开(公告)日：2015-07-30

申请号：US14413170

申请日：2013-06-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Ikeda ,  Yutaka Fujino ,  Hikaru Adachi ,  Hiroyuki Miyashita ,  Yuki Osada ,  Nobuhiko Yamamoto

IPC: G01R27/06 ,  G01R27/28

CPC classification number: G01R27/06 ,  G01R27/28 ,  H01J37/321 ,  H01J37/32192 ,  H01J37/32926 ,  H05H1/46 ,  H05H2001/463 ,  H05H2001/4682

Abstract: A plasma processing apparatus (1) includes a processing container (2) and a microwave introduction device (5) having a plurality of microwave introduction modules (61). A microwave is introduced for each of the plurality of microwave introduction modules (61), and S-parameters for each of combinations of the plurality of microwave introduction modules (61) are obtained based on the introduced microwave and a reflected microwave reflected from the processing container (2) into the plurality of microwave introduction modules (61).

Abstract translation: 等离子体处理装置（1）包括具有多个微波引入模块（61）的处理容器（2）和微波引入装置（5）。 为多个微波引入模块（61）中的每一个引入微波，并且基于引入的微波和从处理反射的反射微波获得多个微波引入模块（61）的每个组合的S参数 容器（2）插入到多个微波引入模块（61）中。

公开(公告)号：US11967485B2

公开(公告)日：2024-04-23

申请号：US17083709

申请日：2020-10-29

Applicant: Tokyo Electron Limited

Inventor： Eiki Kamata ,  Taro Ikeda ,  Mikio Sato ,  Nobuhiko Yamamoto

IPC: H01J37/32 ,  H05H1/46

CPC classification number: H01J37/3222 ,  H01J37/32238 ,  H05H1/46

Abstract: There is provided a plasma processing apparatus including: a chamber having a processing space in which a plasma processing is performed on a substrate and a synthetic space in which electromagnetic waves are synthesized; a dielectric window configured to partition the processing space and the synthetic space; an antenna unit including a plurality of antennas configured to radiate the electromagnetic waves to the synthetic space; an electromagnetic wave output part configured to output the electromagnetic waves to the antenna unit; and a controller configured to control the antenna unit to function as the phased array antenna, wherein the plurality of antennas are helical antennas.

公开(公告)号：US10319567B2

公开(公告)日：2019-06-11

申请号：US15075670

申请日：2016-03-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Ikeda ,  Akira Tanihara ,  Shigeru Kasai ,  Nobuhiko Yamamoto

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32

Abstract: A microwave plasma source for forming a surface wave plasma by radiating a microwave into a chamber of a plasma processing apparatus, which includes: a microwave output part for outputting the microwave; a microwave transmission part for transmitting the microwave; and a microwave radiation member for radiating the microwave into the chamber. The microwave transmission part includes a plurality of microwave introduction mechanisms circumferentially arranged in a peripheral portion of the microwave radiation member and configured to introduce the microwave into the microwave radiation member. The microwave radiation member includes a metal main body, a plurality of dielectric slow-wave members arranged in an overall annular shape in the vicinity of an arrangement surface of the main body, an annular dielectric microwave transmission member arranged in a microwave radiation surface of the main body, and a slot antenna part installed between the slow-wave members and the microwave transmission member.

公开(公告)号：US12046453B2

公开(公告)日：2024-07-23

申请号：US17018532

申请日：2020-09-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Ikeda ,  Atsushi Kubo ,  Eiki Kamata ,  Nobuhiko Yamamoto

IPC: H01J37/32 ,  C23C16/511 ,  C23C16/52 ,  H01L21/67

CPC classification number: H01J37/3222 ,  C23C16/52 ,  H01J37/32266 ,  H01J37/32311 ,  H01L21/67288 ,  C23C16/511 ,  H01J37/32201 ,  H01J37/32229 ,  H01J37/32293 ,  H01J37/3244 ,  H01J37/32715 ,  H01J2237/202

Abstract: A plasma processing apparatus includes: a processing container; a substrate holder disposed within the processing container and configured to hold a substrate thereon; a dielectric window disposed below the substrate holder; and a plurality of phased array antennas disposed below the dielectric window and configured to irradiate a plurality of electromagnetic waves.

公开(公告)号：US11476088B2

公开(公告)日：2022-10-18

申请号：US17144647

申请日：2021-01-08

Applicant: Tokyo Electron Limited

Inventor： Eiki Kamata ,  Taro Ikeda ,  Mikio Sato ,  Nobuhiko Yamamoto

IPC: H01J37/32 ,  H05H1/46 ,  H01Q1/52

Abstract: An array antenna radiates an electromagnetic wave into a chamber of a plasma processing apparatus. The array antenna includes antennas and coupling prevention elements arranged at intervals between the antennas. Each of the coupling prevention elements includes a first member connected to a ceiling wall which is a ground surface in the chamber and a second member connected to a tip end of the first member or a vicinity of the tip end of the first member.

公开(公告)号：US09702913B2

公开(公告)日：2017-07-11

申请号：US14413170

申请日：2013-06-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Ikeda ,  Yutaka Fujino ,  Hikaru Adachi ,  Hiroyuki Miyashita ,  Yuki Osada ,  Nobuhiko Yamamoto

IPC: G01R31/02 ,  C23F1/00 ,  G01R27/06 ,  H05H1/46 ,  H01J37/32 ,  G01R27/28

CPC classification number: G01R27/06 ,  G01R27/28 ,  H01J37/321 ,  H01J37/32192 ,  H01J37/32926 ,  H05H1/46 ,  H05H2001/463 ,  H05H2001/4682

Abstract: A plasma processing apparatus (1) includes a processing container (2) and a microwave introduction device (5) having a plurality of microwave introduction modules (61). A microwave is introduced for each of the plurality of microwave introduction modules (61), and S-parameters for each of combinations of the plurality of microwave introduction modules (61) are obtained based on the introduced microwave and a reflected microwave reflected from the processing container (2) into the plurality of microwave introduction modules (61).