公开(公告)号：US10679865B2

公开(公告)日：2020-06-09

申请号：US16445606

申请日：2019-06-19

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H01L23/12

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

公开(公告)号：US20200266077A1

公开(公告)日：2020-08-20

申请号：US16865905

申请日：2020-05-04

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/15 ,  H01L23/13 ,  H01L23/12 ,  H05K3/00 ,  H05K3/46

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

公开(公告)号：US11081368B2

公开(公告)日：2021-08-03

申请号：US16865905

申请日：2020-05-04

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Yuki Nitta

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H01L23/12

Abstract: The method of dicing a wiring substrate that includes a core substrate having a front surface and a rear surface at least one of which is provided with an adhesive layer and a rim pattern thereon. The adhesive layer is provided with a laminate that has wiring layers and insulating layers, laminating. The rim pattern is provided with the insulating layers laminated thereon. The method includes steps of forming separation grooves by removing portions of the insulating layers laminated on the rim pattern to expose the rim pattern; exposing at least one of the front and rear surfaces of the core substrate by dissolving and removing the rim pattern of the groove bottoms; and dicing the core substrate exposed at groove bottoms, along cutting margins each being smaller than a groove width of each of the groove bottoms.

公开(公告)号：US11006516B2

公开(公告)日：2021-05-11

申请号：US16872787

申请日：2020-05-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

Abstract: A glass wiring board is provided with an analog duplexer including an inductor and a capacitor, and includes: a core wiring board provided with the coil-shaped inductor having through electrodes and wiring patterns provided in a glass substrate via an inorganic adhesive layer, and with a land pattern connected to an outer layer; the capacitor having a structure with a dielectric layer sandwiched between upper and lower electrode patterns on an insulating resin layer covering the core wiring board; and a wiring pattern for connecting to an external component such as an external substrate.

公开(公告)号：US10790209B2

公开(公告)日：2020-09-29

申请号：US15835637

申请日：2017-12-08

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi

IPC: B32B3/00 ,  H01L23/15 ,  H01L23/498 ,  H05K3/46 ,  H05K3/40 ,  H01L21/48 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42

Abstract: A wiring circuit substrate includes a glass base, insulating resin layers, wire groups, a first inorganic adhesive layer, a through electrode, and second conductive layers. The glass base has a through-hole. The insulating resin layers are laminated to the glass base and each have a conductive via formed therein. The wire groups are laminated to the insulating resin layers. The first inorganic adhesive layer is laminated to the inner surface of the through-hole. The through electrode is formed of a first conductive layer laminated to the first inorganic adhesive layer. The second conductive layers are formed on the through electrode and the glass base and electrically connected to the upper and lower ends of the through electrode. The glass base has a surface roughness Ra of 100 nm or less, and the second conductive layers each have an amount of dishing of 5 μm or less above the through electrode.

公开(公告)号：US10056322B2

公开(公告)日：2018-08-21

申请号：US15278900

申请日：2016-09-28

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Koji Imayoshi ,  Syuji Kiuchi

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01028 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/1579 ,  H01L2924/00

Abstract: An interposer which can better prevent detachment of a conductive layer pattern due to thermal expansion and thermal contraction. The interposer includes a substrate having a through hole; an insulative resin layer formed on a surface of the substrate and including a conductive via; a wiring layer disposed on the substrate with the insulative resin layer interposed therebetween; an inorganic adhesive layer formed only on a side surface of the through hole; and a through electrode filled in a connection hole which is formed by the inorganic adhesive layer in the through hole so as to penetrate between both surfaces of the substrate, wherein the through electrode is electrically connected to the wiring layer via the conductive via, and a thermal expansion coefficient of the inorganic adhesive layer is larger than a thermal expansion coefficient of the substrate and smaller than a thermal expansion coefficient of the through electrode.