公开(公告)号：US20240356465A1

公开(公告)日：2024-10-24

申请号：US18635344

申请日：2024-04-15

Applicant: TOTO LTD.

Inventor： Masafumi IKEGUCHI ,  Kouta KOBAYASHI ,  Yutaka MOMIYAMA

IPC: H02N13/00 ,  B23Q3/15

CPC classification number: H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100; a base plate 200 formed of a metal material; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200. When a thickness of the joining layer 300 is T (μm) and a Young's modulus of the joining layer 300 at −100° C. is E (MPa), a condition expressed as E≤0.04×T−0.04 is satisfied.

公开(公告)号：US20250119080A1

公开(公告)日：2025-04-10

申请号：US18896477

申请日：2024-09-25

Applicant: TOTO LTD.

Inventor： Masafumi IKEGUCHI ,  Kouta KOBAYASHI ,  Yutaka MOMIYAMA

IPC: H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100 in which through-holes 140 are formed, a base plate 200 formed of a metal material, and a bonding layer 300 that bonds the dielectric substrate 100 and the base plate 200. When a Young's modulus of the bonding layer 300 is E (MPa), and a distance between a central axis AX0 of the dielectric substrate 100 and a central axis AX1 of each of the through-holes 140 is X (mm), with respect to the through-holes 140 at a position farthest from the central axis AX0, E≤0.2063×X2−59.3887×X+4278.8065 is established.

公开(公告)号：US20230311258A1

公开(公告)日：2023-10-05

申请号：US18121647

申请日：2023-03-15

Applicant: TOTO LTD.

Inventor： Akihito ONO ,  Masafumi IKEGUCHI ,  Tomoki UMETSU ,  Jumpei UEFUJI

IPC: B23Q3/15

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An electrostatic chuck includes a ceramic dielectric substrate and a base plate. The base plate includes a communicating path configured to allow a coolant to pass. The communicating path includes a first flow path part having a pair of side surfaces along a first direction. The first direction is along a flow of the coolant. When viewed along a stacking direction, one side surface of the pair of side surfaces includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions is convex in a second direction. The second direction is perpendicular to the first direction. The second direction is from the other side surface toward the one side surface of the pair of side surfaces. The plurality of concave portions is convex in an opposite direction of the second direction.

公开(公告)号：US20250119079A1

公开(公告)日：2025-04-10

申请号：US18891449

申请日：2024-09-20

Applicant: TOTO LTD.

Inventor： Kouta KOBAYASHI ,  Masafumi IKEGUCHI ,  Yutaka MOMIYAMA

IPC: H02N13/00 ,  B23Q3/15

Abstract: An electrostatic chuck (10) includes a dielectric substrate (100), a base plate (200) formed of a metal material, and a bonding layer (300) bonding the dielectric substrate (100) and the base plate (200). At least a portion of the base plate (200) facing the bonding layer (300) is covered with a ceramic film (231), and a surface of the ceramic film (231) is a bonded surface (S). The bonded surface (S) satisfies at least one of a first condition: arithmetic average height (Sa)≤1.5 μm or a second condition: root mean square height (Sq)≤2.0 μm, and at least one of a third condition: maximum valley depth (Sv)≥20.0 μm or a fourth condition: maximum height (Sz)≥20.0 μm.

公开(公告)号：US20250069933A1

公开(公告)日：2025-02-27

申请号：US18806123

申请日：2024-08-15

Applicant: TOTO LTD.

Inventor： Masafumi IKEGUCHI ,  Kouta KOBAYASHI ,  Yutaka MOMIYAMA

IPC: H01L21/683

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.

公开(公告)号：US20240331985A1

公开(公告)日：2024-10-03

申请号：US18610491

申请日：2024-03-20

Applicant: TOTO LTD.

Inventor： Ryosuke SAKURAI ,  Keisuke SANO ,  Masafumi IKEGUCHI ,  Jun SHIRAISHI ,  Ikuo ITAKURA ,  Yutaka MOMIYAMA

IPC: H01J37/32 ,  C23C16/458 ,  H01L21/683

CPC classification number: H01J37/32715 ,  C23C16/4583 ,  H01J2237/2007 ,  H01J2237/3321 ,  H01L21/6833

Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.

公开(公告)号：US20220319898A1

公开(公告)日：2022-10-06

申请号：US17837115

申请日：2022-06-10

Applicant: TOTO LTD.

Inventor： Masafumi IKEGUCHI ,  Tetsuro ITOYAMA ,  Shuichiro SAIGAN ,  Jun SHIRAISHI

IPC: H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck includes a base plate and a ceramic dielectric substrate. The ceramic dielectric substrate has a first major surface. The first major surface includes at least a first region and a second region. At least one first gas introduction hole connected to at least one of multiple first grooves. The first grooves include a first boundary groove, and at least one first in-region groove. Multiple second grooves and at least one second gas introduction hole are provided in the second region. The second grooves are include a second boundary groove extending along the first boundary and are provided to be most proximal to the first boundary. A groove end portion-end portion distance between the first boundary groove and the second boundary groove is smaller than a groove end portion-end portion distance between the first boundary groove and the first in-region groove.