ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240283379A1

    公开(公告)日:2024-08-22

    申请号:US18443441

    申请日:2024-02-16

    Applicant: TOTO LTD.

    CPC classification number: H02N13/00 C23C16/458

    Abstract: An electrostatic chuck includes: a dielectric substrate on which at least one first gas hole is formed; a base plate on which at least one second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of the at least one first gas hole is formed on a surface of the dielectric substrate. A second opening being an end of the at least one second gas hole is formed at a position which differs from the at least one first opening on a surface of the base plate. A communication groove is formed on the surface of the base plate.

    ELECTROSTATIC CHUCK
    2.
    发明申请

    公开(公告)号:US20220199452A1

    公开(公告)日:2022-06-23

    申请号:US17690337

    申请日:2022-03-09

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate has a first major surface and a second major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the base plate and the first major surface. The ceramic dielectric substrate includes a first hole part. The first porous part includes a porous section, and a first compact section being more compact than the porous section. The porous section including a plurality of sparse portions including a plurality of pores including a first pore and a second pore, and a dense portion having a higher density than the sparse portion.

    ELECTROSTATIC CHUCK
    3.
    发明申请
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20190287840A1

    公开(公告)日:2019-09-19

    申请号:US16352904

    申请日:2019-03-14

    Applicant: TOTO LTD.

    Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.

    ELECTROSTATIC CHUCK AND PROCESSING APPARATUS

    公开(公告)号:US20200286769A1

    公开(公告)日:2020-09-10

    申请号:US16810482

    申请日:2020-03-05

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second porous parts. The ceramic dielectric substrate includes first and second major surfaces. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided in the ceramic dielectric substrate and is opposite to the gas feed channel. The second porous part is provided in the base plate and is opposite to the gas feed channel. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. The first porous part includes a first porous region including pores and a first dense region. The second porous part includes a second porous region including pores and a second dense region.

    ELECTROSTATIC CHUCK AND PROCESSING APPARATUS

    公开(公告)号:US20200286768A1

    公开(公告)日:2020-09-10

    申请号:US16810404

    申请日:2020-03-05

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a first porous part. The ceramic dielectric substrate includes first and second major surfaces, and at least one groove. The second major surface is opposite to the first major surface. The base plate supports the ceramic dielectric substrate and includes a gas feed channel. The first porous part is provided between the groove and the gas feed channel. The ceramic dielectric substrate includes holes communicating with the groove and the gas feed channel and piercing the ceramic dielectric substrate in a first direction from the base plate toward the ceramic dielectric substrate. The first porous part includes at least one porous region including pores, and at least one dense region denser than the porous region. The porous region further includes at least one dense part.

    ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240282612A1

    公开(公告)日:2024-08-22

    申请号:US18443461

    申请日:2024-02-16

    Applicant: TOTO LTD.

    CPC classification number: H01L21/6833 C23C16/4586 C23C16/463

    Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100 which includes a surface 110 on which a substrate W is to be placed and in which through holes (gas holes 150 and lift pin holes 160) that penetrate the surface 110 are formed; an electrode terminal 121 which is provided on a surface 120 of the dielectric substrate 100 on an opposite side to the surface 110; a base plate 200 to be joined to the surface 120 of the dielectric substrate 100; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200 and which is formed of an insulating material. When viewed from a direction perpendicular to the surface 110, spaces 340 are formed at positions within the joining layer 300 that do not overlap with any of the through holes and the electrode terminal 121.

    ELECTROSTATIC CHUCK
    7.
    发明申请

    公开(公告)号:US20210175109A1

    公开(公告)日:2021-06-10

    申请号:US17179994

    申请日:2021-02-19

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.

    ELECTROSTATIC CHUCK
    8.
    发明申请
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20190287839A1

    公开(公告)日:2019-09-19

    申请号:US16352899

    申请日:2019-03-14

    Applicant: TOTO LTD.

    Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.

    ELECTROSTATIC CHUCK
    9.
    发明公开
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20240331985A1

    公开(公告)日:2024-10-03

    申请号:US18610491

    申请日:2024-03-20

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.

    ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240279810A1

    公开(公告)日:2024-08-22

    申请号:US18443418

    申请日:2024-02-16

    Applicant: TOTO LTD.

    CPC classification number: C23C16/4583 C23C16/45561

    Abstract: An electrostatic chuck includes: a dielectric substrate on which a plurality of first gas holes are formed; a base plate on which a second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of each of the first gas holes is formed in plurality on a surface of the dielectric substrate on a side of the joining layer. A second opening being an end of the second gas hole is formed on a surface of the base plate on a side of the joining layer. The second opening is communicated with the plurality of first openings via a communication groove formed on the surface of the base plate on the side of the joining layer.

Patent Agency Ranking