Semiconductor manufacturing apparatus

    公开(公告)号:US12051568B2

    公开(公告)日:2024-07-30

    申请号:US16802666

    申请日:2020-02-27

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, a semiconductor manufacturing apparatus member includes a base and a particle-resistant layer. The base includes a first surface, a second surface crossing the first surface, and an edge portion connecting the first surface and the second surface. The particle-resistant layer includes a polycrystalline ceramic and covering the first surface, the second surface, and the edge portion. The particle-resistant layer includes a first particle-resistant layer provided at the edge portion, and a second particle-resistant layer provided at the first surface. A particle resistance of the first particle-resistant layer is higher than a particle resistance of the second particle-resistant layer.

    Composite structure and semiconductor manufacturing apparatus including composite structure

    公开(公告)号:US12112924B2

    公开(公告)日:2024-10-08

    申请号:US17244299

    申请日:2021-04-29

    Applicant: TOTO LTD.

    Abstract: Disclosed is to provide a composite structure used as a member for a semiconductor manufacturing apparatus as well as a semiconductor manufacturing apparatus. A composite structure including a base material and a structure that is provided on the base material and has a surface to be exposed to a plasma atmosphere, in which the structure has an yttrium-aluminum oxide as a main component, and has a lattice constant a calculated by the following formula (1) being larger than 12.080 Å:

    a=d·(h2+k2+l2)1/2  (1)

    where d represents a lattice plane spacing, and (hkl) represents a Miller index. This structure features excellent low-particle generation and is suitably used a member for a semiconductor apparatus.

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