公开(公告)号：US20240329336A1

公开(公告)日：2024-10-03

申请号：US18190223

申请日：2023-03-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Liang Shao ,  Hsing-Kuo Hsia ,  Chen-Hua Yu ,  Chih-Ming Ke ,  Chih-Wei Tseng ,  You-Rong Shaw

IPC: G02B6/42

CPC classification number: G02B6/4214

Abstract: In some embodiments, a photonic device includes a photonic interconnect structure that includes a first cladding layer; a waveguide over the first cladding layer; a second cladding layer disposed over the waveguide; a transparent material in the first cladding layer and the second cladding layer, the transparent material includes a first sidewall adjacent to the waveguide and a second sidewall tilted with respect to the first sidewall of the transparent material; and a first reflective film over the second sidewall of the transparent material. In some embodiments, the photonic device also includes a light-receiving structure that includes a transparent protrusion above the transparent material, the transparent protrusion including a first sidewall and a second sidewall opposite to the second sidewall of the transparent protrusion; and a second reflective film over the second sidewall of the transparent protrusion and horizontally overlapping the first reflective film.

公开(公告)号：US20240162109A1

公开(公告)日：2024-05-16

申请号：US18152615

申请日：2023-01-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Yi Kuo ,  Chen-Hua Yu ,  Kuo-Chung Yee ,  Yu-Jen Lien ,  Ke-Han Shen ,  Wei-Kong Sheng ,  Chung-Shi Liu ,  Szu-Wei Lu ,  Tsung-Fu Tsai ,  Chung-Ju Lee ,  Chih-Ming Ke

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H10B80/00

CPC classification number: H01L23/3677 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3736 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16225 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29172 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253

Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

公开(公告)号：US11656391B2

公开(公告)日：2023-05-23

申请号：US16882094

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Chih Hsieh ,  Kai Wu ,  Yen-Liang Chen ,  Kai-Hsiung Chen ,  Po-Chung Cheng ,  Chih-Ming Ke

IPC: G03F7/20 ,  G02B5/18 ,  G02F1/31 ,  G03H1/26 ,  G03F1/44

CPC classification number: G02B5/1866 ,  G02B5/18 ,  G02F1/31 ,  G03F1/44 ,  G03F7/2024 ,  G03F7/70616 ,  G03F7/70633 ,  G03H1/26 ,  G02B5/1861

Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

公开(公告)号：US20200284954A1

公开(公告)日：2020-09-10

申请号：US16882094

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Chih Hsieh ,  Kai Wu ,  Yem-Liang Chen ,  Kai-Hsiung Chen ,  Po-Chung Cheng ,  Chih-Ming Ke

IPC: G02B5/18 ,  G03F7/20 ,  G02F1/31 ,  G03H1/26 ,  G03F1/44

Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

公开(公告)号：US10684556B2

公开(公告)日：2020-06-16

申请号：US16402828

申请日：2019-05-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weimin Hu ,  Yang-Hung Chang ,  Kai-Hsiung Chen ,  Chun-Ming Hu ,  Chih-Ming Ke

IPC: G03F7/20

Abstract: The present disclosure provides a method. The method includes patterning a substrate by a patterning tool; collecting a plurality of overlay errors from a plurality of fields on the substrate; identifying noise from the plurality of overlay errors by applying a first filtering operation and a second filtering operation that is different from the first filtering operation. The method further includes grouping the plurality of overlay errors that are not identified as noise into a set of filtered overlay errors; calculating an overlay compensation based on the set of filtered overlay errors; and performing a compensation process to the patterning tool according to the overlay compensation.

公开(公告)号：US10521548B2

公开(公告)日：2019-12-31

申请号：US16042468

申请日：2018-07-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yang-Hung Chang ,  Che-Yuan Sun ,  Chih-Ming Ke ,  Chun-Ming Hu

IPC: G06F17/50 ,  G01R31/28 ,  G01R31/307 ,  G06T7/00

Abstract: Defect information obtained from a test wafer is received. The test wafer was fabricated according to an Integrated Circuit (IC) design layout. A plurality of first regions of interest (ROIs) is received based on the defect information. The first ROIs each correspond to a region of the IC design layout where a wafer defect has occurred. A frequency domain analysis is performed for the first ROIs. A wafer defect probability is forecast for the IC design layout based at least in part on the frequency domain analysis.

公开(公告)号：US20180173110A1

公开(公告)日：2018-06-21

申请号：US15644126

申请日：2017-07-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weimin Hu ,  Yang-Hung Chang ,  Kai-Hsiung Chen ,  Chun-Ming Hu ,  Chih-Ming Ke

IPC: G03F7/20

CPC classification number: G03F7/70633 ,  G03F7/705

Abstract: The present disclosure provides a method. The method includes patterning a substrate by a patterning tool; collecting a plurality of overlay errors from a plurality of fields on the substrate; identifying noise from the plurality of overlay errors by applying a first filtering operation and a second filtering operation that is different from the first filtering operation. The method further includes grouping the plurality of overlay errors that are not identified as noise into a set of filtered overlay errors; calculating an overlay compensation based on the set of filtered overlay errors; and performing a compensation process to the patterning tool according to the overlay compensation.

公开(公告)号：US12062582B2

公开(公告)日：2024-08-13

申请号：US17084628

申请日：2020-10-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Li-Chao Yin ,  Hung-Bin Lin ,  Hsin-Hsien Wu ,  Chih-Ming Ke ,  Chyi Shyuan Chern ,  Ming-Hua Lo

IPC: H01L21/66 ,  G03F7/00 ,  H01L21/30 ,  H01L21/322

CPC classification number: H01L22/12 ,  G03F7/70033 ,  G03F7/70616 ,  G03F7/70783 ,  H01L21/30 ,  H01L21/3228 ,  H01L22/20

Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.

公开(公告)号：US10663633B2

公开(公告)日：2020-05-26

申请号：US15637910

申请日：2017-06-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Chih Hsieh ,  Kai Wu ,  Yen-Liang Chen ,  Kai-Hsiung Chen ,  Po-Chung Cheng ,  Chih-Ming Ke

IPC: G03F7/20 ,  G02B5/18 ,  G02F1/31 ,  G03H1/26 ,  G03F1/44

Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

公开(公告)号：US10281827B2

公开(公告)日：2019-05-07

申请号：US15644126

申请日：2017-07-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Weimin Hu ,  Yang-Hung Chang ,  Kai-Hsiung Chen ,  Chun-Ming Hu ,  Chih-Ming Ke

IPC: G03F7/20

Abstract: The present disclosure provides a method. The method includes patterning a substrate by a patterning tool; collecting a plurality of overlay errors from a plurality of fields on the substrate; identifying noise from the plurality of overlay errors by applying a first filtering operation and a second filtering operation that is different from the first filtering operation. The method further includes grouping the plurality of overlay errors that are not identified as noise into a set of filtered overlay errors; calculating an overlay compensation based on the set of filtered overlay errors; and performing a compensation process to the patterning tool according to the overlay compensation.