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公开(公告)号:US12048135B2
公开(公告)日:2024-07-23
申请号:US18064859
申请日:2022-12-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuo-Hsiu Hsu , Feng-Ming Chang , Kian-Long Lim , Ping-Wei Wang , Lien Jung Hung , Ruey-Wen Chang
IPC: G11C5/06 , G11C7/12 , G11C8/08 , G11C11/412 , G11C11/417 , H10B10/00
CPC classification number: H10B10/12 , G11C7/12 , G11C8/08 , G11C11/412 , G11C11/417
Abstract: A semiconductor structure includes an SRAM cell that includes first and second pull-up (PU) transistors, first and second pull-down (PD) transistors, and first and second pass-gate (PG) transistors. A source, a drain, and a channel of the first PU transistor and a source, a drain, and a channel of the second PU transistor are collinear. A source, a drain, and a channel of the first PD transistor, a source, a drain, and a channel of the second PD transistor, a source, a drain, and a channel of the first PG transistor, and a source, a drain, and a channel of the second PG transistor are collinear.
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公开(公告)号:US20240203486A1
公开(公告)日:2024-06-20
申请号:US18418779
申请日:2024-01-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chih-Chuan YANG , Jui-Wen Chang , Feng-Ming Chang , Kian-Long Lim , Kuo-Hsiu Hsu , Lien Jung Hung , Ping-Wei Wang
IPC: G11C11/417 , H01L29/423 , H10B10/00
CPC classification number: G11C11/417 , H01L29/42392 , H10B10/125
Abstract: The present disclosure describes a method for memory cell placement. The method can include placing a memory cell region in a layout area and placing a well pick-up region and a first power supply routing region along a first side of the memory cell region. The method also includes placing a second power supply routing region and a bitline jumper routing region along a second side of the memory cell region, where the second side is on an opposite side to that of the first side. The method further includes placing a device region along the second side of the memory cell region, where the bitline jumper routing region is between the second power supply routing region and the device region.
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公开(公告)号:US12009428B2
公开(公告)日:2024-06-11
申请号:US17812874
申请日:2022-07-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chih-Chuan Yang , Kuo-Hsiu Hsu , Feng-Ming Chang , Kian-Long Lim , Lien Jung Hung
IPC: H01L29/78 , H01L27/088 , H01L29/06 , H01L29/16 , H01L29/417 , H01L29/66
CPC classification number: H01L29/785 , H01L27/0886 , H01L29/0665 , H01L29/16 , H01L29/41791 , H01L29/66545 , H01L29/6681 , H01L29/66818
Abstract: A semiconductor device including nanosheet field-effect transistors (NSFETs) in a first region and fin field-effect transistors (FinFETs) in a second region and methods of forming the same are disclosed. In an embodiment, a device includes a first memory cell, the first memory cell including a first transistor including a first channel region, the first channel region including a first plurality of semiconductor nanostructures; and a second transistor including a second channel region, the second channel region including a semiconductor fin.
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公开(公告)号:US20220367481A1
公开(公告)日:2022-11-17
申请号:US17874463
申请日:2022-07-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chih-Chuan Yang , Kuo-Hsiu Hsu , Feng-Ming Chang , Wen-Chun Keng , Lien Jung Hung
IPC: H01L27/11
Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.
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公开(公告)号:US20210375883A1
公开(公告)日:2021-12-02
申请号:US16888269
申请日:2020-05-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kuo-Hsiu Hsu , Feng-Ming Chang , Kian-Long Lim , Ping-Wei Wang , Lien Jung Hung , Ruey-Wen Chang
Abstract: A semiconductor structure includes an SRAM cell that includes first and second pull-up (PU) transistors, first and second pull-down (PD) transistors, first and second pass-gate (PG) transistors, and bit line (BL) conductors. The first PU and the first PD transistors form a first inverter. The second PU and the second PD transistors form a second inverter. The first and the second inverters are cross-coupled to form two storage nodes that are coupled to the BL conductors through the first and the second PG transistors. The first and the second PU transistors are formed over an n-type active region over a frontside of the semiconductor structure. The first and the second PD transistors and the first and the second PG transistors are formed over a p-type active region over the frontside of the semiconductor structure. The BL conductors are disposed over a backside of the semiconductor structure.
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公开(公告)号:US10854279B2
公开(公告)日:2020-12-01
申请号:US16921156
申请日:2020-07-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Hao Pao , Kian-Long Lim , Feng-Ming Chang , Lien-Jung Hung
IPC: G11C11/412 , H01L27/11 , H01L27/02 , H01L27/12 , H01L29/78 , H01L27/092
Abstract: A SRAM array is provided, including a first bit cell array and a second bit cell array arranged along a first direction; a strap cell arranged in a second direction and positioned between the first bit cell array and the second bit cell array along the first direction. The strap cell includes a first strap column, a second strap column, a doped P-type region, a doped N-type region, and a deep N-type well region. The first strap column includes a first P-type well region and two first N-type well regions adjacent opposite sides of the first P-type well region along the first direction. The second strap column is adjacent to the first strap column along the second direction. The second strap column includes a second N-type well region and two second P-type well regions adjacent opposite sides of the second N-type well region along the first direction.
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公开(公告)号:US20200251476A1
公开(公告)日:2020-08-06
申请号:US16529380
申请日:2019-08-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Feng-Ming Chang , Chia-Hao Pao , Lien Jung Hung , Ping-Wei Wang
IPC: H01L27/11 , H01L23/535
Abstract: Fin-based well straps are disclosed for improving performance of memory arrays, such as static random access memory arrays. An exemplary well strap cell is disposed between a first memory cell and a second memory cell. The well strap cell includes a p-well, a first n-well, and a second n-well disposed in a substrate. The p-well, the first n-well, and the second n-well are configured in the well strap cell such that a middle portion of the well strap cell is free of the first n-well and the second n-well along a gate length direction. The well strap cell further includes p-well pick up regions to the p-well and n-well pick up regions to the first n-well, the second n-well, or both. The p-well has an I-shaped top view along the gate length direction.
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公开(公告)号:US10515687B2
公开(公告)日:2019-12-24
申请号:US15962409
申请日:2018-04-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Hao Pao , Kian-Long Lim , Feng-Ming Chang , Lien-Jung Hung
IPC: G11C11/412 , H01L27/11 , H01L27/02 , H01L29/78
Abstract: A static random access memory (SRAM) array is provided. The SRAM array includes a first bit cell array, a second bit cell array, and a strap cell. The second bit cell array is arranged along a first direction. The strap cell is arranged along a second direction and is positioned between the first bit cell array and the second bit cell array along the first direction. The strap cell includes an H-shaped NW region, an H-shaped PW region, and a deep N-type well (DNW) region. The H-shaped NW region and the H-shaped PW region each includes two strip portions extending along the first direction and a linking portion extending along the second direction. Two terminals of the linking portion are in contact with the two strip portions.
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公开(公告)号:US09831250B2
公开(公告)日:2017-11-28
申请号:US15059039
申请日:2016-03-02
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wen-Chun Keng , Feng-Ming Chang
CPC classification number: H01L27/1104 , H01L29/7827
Abstract: A static random access memory (SRAM) cell includes first through fourth source diffusion regions sequentially arranged in a first direction, a first pass-gate transistor, a source region of which is formed by the first source diffusion region, first and second pull-up transistors, source regions of which are formed by the second source diffusion region, first and second pull-down transistors, source regions of which are formed by the third source diffusion region, a second pass-gate transistor, a source region of which is formed by the fourth source diffusion region, and an intermediate region between the first and second pass-gate transistors linearly extending along a direction parallel to the first direction and across the entire SRAM cell. Each of the first source diffusion region and the fourth source diffusion region is spaced-apart from the intermediate region.
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公开(公告)号:US12190943B2
公开(公告)日:2025-01-07
申请号:US18336816
申请日:2023-06-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chao-Yuan Chang , Feng-Ming Chang , Jui-Lin Chen , Kian-Long Lim
IPC: G11C11/412 , G11C11/419 , H10B10/00
Abstract: The current disclosure is directed to a SRAM bit cell having a reduced coupling capacitance. In a vertical direction, a wordline “WL” and a bitline “BL” of the SRAM cell are stacked further away from one another to reduce the coupling capacitance between the WL and the BL. In an embodiment, the WL is vertically spaced apart from the BL with one or more metallization level that none of the WL or the BL is formed from. Connection island structures or jumper structures are provided to connect the upper one of the WL or the BL to the transistors of the SRAM cell.
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