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公开(公告)号:US10777466B2
公开(公告)日:2020-09-15
申请号:US15922656
申请日:2018-03-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wen Huang , Chia-Hui Lin , Jaming Chang , Jei Ming Chen , Kai Hung Cheng
IPC: H01L27/088 , H01L21/8234 , H01L29/06 , H01L21/02 , H01L21/762
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
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公开(公告)号:US11990375B2
公开(公告)日:2024-05-21
申请号:US17852716
申请日:2022-06-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wen Huang , Jaming Chang , Kai Hung Cheng , Chia-Hui Lin , Jei Ming Chen
IPC: H01L27/148 , H01L21/02 , H01L21/762 , H01L21/8234 , H01L27/088 , H01L29/06
CPC classification number: H01L21/823481 , H01L21/02148 , H01L21/02159 , H01L21/02164 , H01L21/0217 , H01L21/02178 , H01L21/02181 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/0228 , H01L21/76224 , H01L21/823431 , H01L27/0886 , H01L29/0653
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
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公开(公告)号:US20200373154A1
公开(公告)日:2020-11-26
申请号:US16983187
申请日:2020-08-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Dong-Sheng Li , Chia-Hui Lin , Kai Hung Cheng , Yao-Hsu Sun , Wen-Cheng Wu , Bo-Cyuan Lu , Sung-En Lin , Tai-Chun Huang
IPC: H01L21/027 , H01L21/02 , H01L21/033 , H01L21/28 , H01L21/311 , H01L21/3213 , H01L21/8238
Abstract: A four-layer photoresist and method of forming the same are disclosed. In an embodiment, a method includes forming a semiconductor fin; depositing a target layer on the semiconductor fin; depositing a BARC layer on the target layer; depositing a first mask layer over the BARC layer, the first mask layer being deposited using a plasma process with an RF power of less than 50 W; depositing a second mask layer over the first mask layer using a plasma process with an RF power of less than 500 W; depositing a photoresist layer over the second mask layer; patterning the photoresist layer, the second mask layer, the first mask layer, and the BARC layer to form a first mask; and selectively removing the target layer from a first portion of the semiconductor fin using the first mask, the target layer remaining on a second portion of the semiconductor fin.
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公开(公告)号:US20240282638A1
公开(公告)日:2024-08-22
申请号:US18636384
申请日:2024-04-16
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wen Huang , Jaming Chang , Kai Hung Cheng , Chia-Hui Lin , Jei Ming Chen
IPC: H01L21/8234 , H01L21/02 , H01L21/762 , H01L27/088 , H01L29/06
CPC classification number: H01L21/823481 , H01L21/02148 , H01L21/02159 , H01L21/02164 , H01L21/0217 , H01L21/02178 , H01L21/02181 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/0228 , H01L21/76224 , H01L21/823431 , H01L27/0886 , H01L29/0653
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
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公开(公告)号:US20220328360A1
公开(公告)日:2022-10-13
申请号:US17852716
申请日:2022-06-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wen Huang , Jaming Chang , Kai Hung Cheng , Chia-Hui Lin , Jei Ming Chen
IPC: H01L21/8234 , H01L29/06 , H01L21/02 , H01L21/762 , H01L27/088
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
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公开(公告)号:US11380593B2
公开(公告)日:2022-07-05
申请号:US17019475
申请日:2020-09-14
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Wen Huang , Jaming Chang , Kai Hung Cheng , Chia-Hui Lin , Jei Ming Chen
IPC: H01L27/088 , H01L21/8234 , H01L29/06 , H01L21/02 , H01L21/762
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
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公开(公告)号:US11195717B2
公开(公告)日:2021-12-07
申请号:US16983187
申请日:2020-08-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Dong-Sheng Li , Chia-Hui Lin , Kai Hung Cheng , Yao-Hsu Sun , Wen-Cheng Wu , Bo-Cyuan Lu , Sung-En Lin , Tai-Chun Huang
IPC: H01L21/02 , H01L21/027 , H01L21/033 , H01L21/28 , H01L21/3213 , H01L21/311 , H01L21/8238 , G03F7/09 , G03F7/16 , G03F7/20 , G03F7/26
Abstract: A four-layer photoresist and method of forming the same are disclosed. In an embodiment, a method includes forming a semiconductor fin; depositing a target layer on the semiconductor fin; depositing a BARC layer on the target layer; depositing a first mask layer over the BARC layer, the first mask layer being deposited using a plasma process with an RF power of less than 50 W; depositing a second mask layer over the first mask layer using a plasma process with an RF power of less than 500 W; depositing a photoresist layer over the second mask layer; patterning the photoresist layer, the second mask layer, the first mask layer, and the BARC layer to form a first mask; and selectively removing the target layer from a first portion of the semiconductor fin using the first mask, the target layer remaining on a second portion of the semiconductor fin.
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