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公开(公告)号:US20180148076A1
公开(公告)日:2018-05-31
申请号:US15645980
申请日:2017-07-10
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Shih-Hung CHIEN , Jen-Ti WANG , Fu-Hsien LI , Chih-Hung LIU , Yung-Lin HSU
CPC classification number: B61L23/044 , B60M1/12 , B60M1/28 , B61B13/00 , B61D3/02 , B61K9/08 , B61L23/047 , B61L25/025
Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.
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2.
公开(公告)号:US20170049284A1
公开(公告)日:2017-02-23
申请号:US14832173
申请日:2015-08-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hsueh-Lei WANG , Jen-Ti WANG , Ting-Wei WANG , Wen-Chieh TSOU
CPC classification number: C23C16/4405 , A47L9/02 , H01L21/00 , H01L21/67011 , H01L21/67028 , H01L21/67379 , H01L21/67393 , H01L21/67775 , H04B7/24
Abstract: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.
Abstract translation: 提供了一种用于清洁半导体制造中的处理装置的负载端口的清洁模块。 清洁模块包括具有形成在壳体的底壁面板上的至少一个开口的壳体。 清洁模块还包括定位在壳体中的过滤器单元。 倾斜模块还包括驱动组件。 驱动组件布置成对应于开口并且定位在壳体中。 驱动组件用于从壳体的外部经由开口到过滤器单元产生空气流。 过滤器单元用于从空气流中分离颗粒或污染物。
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公开(公告)号:US20230411193A1
公开(公告)日:2023-12-21
申请号:US17843228
申请日:2022-06-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chun-Jung HUANG , Y.Y. LEE , Kuang Huan HSU , Li-Hsin CHU , Jen-Ti WANG , Chieh HSU
IPC: H01L21/677
CPC classification number: H01L21/67724
Abstract: When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.
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公开(公告)号:US20210249297A1
公开(公告)日:2021-08-12
申请号:US16787966
申请日:2020-02-11
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chi-Yuan CHU , Jen-Ti WANG , Wei-Chih CHEN , Kuo-Fong CHUANG , Cheng-Ho HUNG
IPC: H01L21/687 , H01L21/67 , H01L21/677
Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.
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5.
公开(公告)号:US20200075378A1
公开(公告)日:2020-03-05
申请号:US16520599
申请日:2019-07-24
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Tzu-Chi CHIU , Jen-Ti WANG , Ting-Wei WANG , Kuo-Fong CHUANG
IPC: H01L21/677 , H01L21/67 , H01L21/673
Abstract: A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.
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公开(公告)号:US20240355659A1
公开(公告)日:2024-10-24
申请号:US18758239
申请日:2024-06-28
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Chih CHEN , Shi-Chi CHEN , Ting-Wei WANG , Jen-Ti WANG , Kuo-Fong CHUANG
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67733 , H01L21/67259 , H01L21/67706
Abstract: A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.
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公开(公告)号:US20220285190A1
公开(公告)日:2022-09-08
申请号:US17748932
申请日:2022-05-19
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Chih CHEN , Shi-Chi CHEN , Ting-Wei WANG , Jen-Ti WANG , Kuo-Fong CHUANG
IPC: H01L21/677 , H01L21/67
Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
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公开(公告)号:US20200062285A1
公开(公告)日:2020-02-27
申请号:US16673678
申请日:2019-11-04
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Shih-Hung CHIEN , Jen-Ti WANG , Fu-Hsien LI , Chih-Hung LIU , Yung-Lin HSU
Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.
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公开(公告)号:US20180118398A1
公开(公告)日:2018-05-03
申请号:US15339343
申请日:2016-10-31
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Fu-Hsien LI , Chi-Feng TUNG , Chi Yuan CHU , Jen-Ti WANG , Hsiang Yin SHEN
IPC: B65B69/00 , H01L21/67 , H01L21/683
CPC classification number: H01L21/6838 , B65B69/0008 , H01L21/67196
Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
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公开(公告)号:US20250100161A1
公开(公告)日:2025-03-27
申请号:US18974213
申请日:2024-12-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Jen-Ti WANG , Yi-Ming CHEN , Chih-Wei LIN , Cheng-Ho HUNG , Fu-Hsien LI
IPC: B25J11/00 , B23P6/00 , B25J1/04 , B25J18/00 , G01B11/24 , G01B11/30 , G01N33/00 , H01L21/02 , H01L21/66 , H01L21/673 , H01L21/677
Abstract: A method includes receiving a carrier, the carrier including a carrier body, a first filter, and a housing securing the first filter to the carrier body. The method further includes uninstalling the housing from the carrier, replacing the first filter with a second filter, reinstalling the housing on the carrier body, and inspecting the second filter. Inspecting the second filter includes using an automatic inspection mechanism to detect surface flatness of the second filter.
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