公开(公告)号：US20100174398A1

公开(公告)日：2010-07-08

申请号：US12651879

申请日：2010-01-04

申请人： Taizan Kobayashi ,  Yukio Ozaki ,  Toshinori Kasuga ,  Yasuyuki Masuda ,  Nobuaki Kawashima

发明人： Taizan Kobayashi ,  Yukio Ozaki ,  Toshinori Kasuga ,  Yasuyuki Masuda ,  Nobuaki Kawashima

IPC分类号： B25J13/08 ,  G01C3/00 ,  G06F17/00

CPC分类号： H01L21/681 ,  H01L21/6715

摘要： A position measuring apparatus includes a distance measuring part which obtains at least three pieces of distance information between at least three measurement points on a measured plane of an object and a displacement sensor, an imaging part which images a projection image on the measured plane of the object, and a calculating part which obtains tilt information of the measured plane based on the at least three distance information pieces and obtains position information of the object based on the tilt information and the projection image.

摘要翻译： 一种位置测量装置，包括距离测量部分，其在物体的测量平面上的至少三个测量点与位移传感器之间获得至少三条距离信息，在所测量的平面上对投影图像进行成像的成像部件 对象和计算部分，其基于所述至少三个距离信息获取所测量的平面的倾斜信息，并且基于倾斜信息和投影图像获得对象的位置信息。

公开(公告)号：US07905268B2

公开(公告)日：2011-03-15

申请号：US12564431

申请日：2009-09-22

申请人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

发明人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

IPC分类号： B32B37/00

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

摘要翻译： 一种用于制造电子装置的超声波接合装置，其包括填充在电子部件和基板之间的基板，电子部件和底部填充物，包括：头部，其包括构造成安装电子部件的工具表面;擦拭单元，其被配置为擦拭 通过在擦拭台上使用擦拭部件，将附着在头部的工具表面上的预固化底部填充物，超声波接合单元构造成将电子部件与基板超声波接合并将头部抵靠擦拭部件按压在 所述擦拭台被配置为当所述擦拭单元提供擦拭时检测施加在所述擦拭台上的擦拭构件和所述工具表面之间的第一压力;以及控制器，被配置为基于所述擦拭台控制由所述超声波接合单元施加的第二压力， 检测器的检测结果。

公开(公告)号：US07938160B2

公开(公告)日：2011-05-10

申请号：US12564423

申请日：2009-09-22

申请人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

发明人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

IPC分类号： B32B37/00

CPC分类号： H01L24/75 ,  H01L24/12 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

摘要翻译： 超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。 超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。 擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及 第二驱动器，其被配置为在所述平面内驱动所述盒。 第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

公开(公告)号：US07823618B2

公开(公告)日：2010-11-02

申请号：US12564444

申请日：2009-09-22

申请人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

发明人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

IPC分类号： B32B37/00

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

摘要翻译： 一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物 通过在擦拭台上使用擦拭构件来使头部的工具表面。 擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部 并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。

公开(公告)号：US07233453B2

公开(公告)日：2007-06-19

申请号：US10641300

申请日：2003-08-15

申请人： Tohru Harada ,  Taizan Kobayashi ,  Toshinori Kasuga ,  Yukio Ozaki ,  Eiji Takada ,  Hirofumi Ohsawa ,  Masanori Fukushi

发明人： Tohru Harada ,  Taizan Kobayashi ,  Toshinori Kasuga ,  Yukio Ozaki ,  Eiji Takada ,  Hirofumi Ohsawa ,  Masanori Fukushi

IPC分类号： G11B5/09 ,  G11B21/02

CPC分类号： G11B5/59633

摘要： A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

摘要翻译： 振动提取处理单元从非接触式传感器的时钟信号中提取与旋转同步的偏转分量，以便校正时钟抖动。 时钟产生单元根据来自振动提取处理单元的时钟信号产生预先设置的任何格式频率的时钟信号。 扇区校正处理单元测量由于频率偏转引起的误差，以便根据测量的误差来校正包含存储在存储器中的伺服帧信号的每个扇区的格式模式信号的写入开始位置。 写入处理单元根据对应于盘的单圈和格式频率时钟信号的同步信号从存储器中读出校正的格式模式信号，然后写入盘介质面。

公开(公告)号：US07595582B2

公开(公告)日：2009-09-29

申请号：US11143646

申请日：2005-06-03

申请人： Yukio Ozaki ,  Toshinori Kasuga

发明人： Yukio Ozaki ,  Toshinori Kasuga

IPC分类号： H01L41/053

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating member 13. The depressing member 15 includes: leg portions 15b which are disposed so as to leave spaces between the leg portions and both side faces 13a of the vibrating member 13 parallel with a vibration direction A; and supporting portions 15c through which the leg portions 15b and the side faces 13a of the vibrating member 13 are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions 15c parallel with the side face 13a of the vibrating member 13, a length L2 along the vibration direction A of the vibrating member 13 is shorter than a length L1 along a depressing direction B of the depressing member 15.

摘要翻译： 本发明的谐振器1包括：保持电子部件12并向电子部件12施加振动的振动部件13; 以及按压部件15，通过振动部件13向基板11的侧面施加按压力。按压部件15包括：腿部15b，其设置成在腿部与两者之间留有间隙 振动部件13的与振动方向A平行的侧面13a; 以及支撑部分15c，腿部15b和振动构件13的侧面13a将彼此联接。 对于与振动部件13的侧面13a平行的支撑部15c的截面尺寸，沿着振动部件13的振动方向A的长度L2比沿着振动部件13的振动方向A的长度L1短 按压构件15的方向B.

公开(公告)号：US20080048004A1

公开(公告)日：2008-02-28

申请号：US11907554

申请日：2007-10-15

申请人： Yukio Ozaki ,  Toshinori Kasuga

发明人： Yukio Ozaki ,  Toshinori Kasuga

IPC分类号： B23K1/06

CPC分类号： H01L24/75 ,  B23K1/0016 ,  B23K1/06 ,  B23K20/10 ,  B23K20/106 ,  B23K2101/42 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A resonator 15 includes: a main shaft 12 that is coupled to an ultrasonic vibrator 11 and extends in an advancement direction of an ultrasonic wave generated from the ultrasonic vibrator 11; and protrusions 13a and 13b protruding in a direction intersecting a longitudinal direction from a center plane Lc in the longitudinal direction of the main shaft 11, wherein a plurality of holes 41a, 41b are formed symmetrically with respect to a central plane Lc in the longitudinal direction of the main shaft 12, inside a section substantially orthogonal to a protruding direction of the protrusions 13a and 13b in the vicinity of the center in the longitudinal direction of the main shaft 12 from which the protrusions 13a, 13b protrude.

摘要翻译： 谐振器15包括：主轴12，其连接到超声波振动器11并沿超声波振动器11产生的超声波的前进方向延伸; 以及从主轴11的长度方向的中心面Lc沿与长度方向相交的方向突出的突出部13a，13b，其中，多个孔41a，41a形成为相对于中心面Lc对称 在主轴12的纵向方向上，在与主轴12的纵向方向上的中心附近的突起13a和13b的突出方向大致正交的部分的内侧，突出部13a，13 b突出。

公开(公告)号：US07218030B2

公开(公告)日：2007-05-15

申请号：US11182753

申请日：2005-07-18

申请人： Toshinori Kasuga ,  Yukio Ozaki

发明人： Toshinori Kasuga ,  Yukio Ozaki

IPC分类号： H01L41/09

CPC分类号： B23K20/10 ,  B06B1/0253

摘要： An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

摘要翻译： 振荡装置包括驱动器，基于用于指定波形的存储数据产生波形信号，以便将波形信号输出到换能器。 检测器检测提供给换能器的电压和电流之间的相位差。 存储单元保持反映换能器特性的增益数据。 增益数据指定对应于各个相位差的增益。 算术单元基于检测器检测到的相位差和增益数据中包含的增益来计算波形的频率。 考虑到换能器的特性，振荡装置能够确定适合换能器的增益。 允许波形信号的频率在较短的时间内跟随谐振频率的变化。 因此振荡可以保持良好。

公开(公告)号：US20060113351A1

公开(公告)日：2006-06-01

申请号：US11105437

申请日：2005-04-14

申请人： Yukio Ozaki ,  Toshinori Kasuga

发明人： Yukio Ozaki ,  Toshinori Kasuga

IPC分类号： B23K20/12

CPC分类号： B23K20/106 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An ultrasonic head 10a, which is used in an ultrasonic bonder for bonding an LSI chip and a substrate by using the ultrasonic vibration, includes: a protrusion 13a constituting a resonating apparatus 15 for contacting with the LSI chip and carrying out the ultrasonic vibration; a thermal conductive elastic body 17a placed on a surface of a main shaft 12 constituting the resonating apparatus 15; and a heater 16a which is placed on a surface of the thermal conductive elastic body 17a and produces a heat and gives the heat through the thermal conductive elastic body 17a and the main shaft 12 and protrusion 13a constituting the resonating apparatus 15 to a vicinity of a bonding portion between the LSI chip and the substrate.

摘要翻译： 超声波头10a用于通过使用超声波振动来连接LSI芯片和基板的超声波焊接机中，包括：突起13a，其构成用于与LSI芯片接触并进行超声波振动的谐振装置15 ; 布置在构成谐振装置15的主轴12的表面上的导热弹性体17a; 以及加热器16a，其放置在导热性弹性体17a的表面上，并产生热量，并且通过导热弹性体17a和构成谐振装置15的主轴12和突起13a产生热量至 在LSI芯片和基板之间的接合部分附近。

公开(公告)号：US20110240059A1

公开(公告)日：2011-10-06

申请号：US13073328

申请日：2011-03-28

申请人： Yukio OZAKI ,  Michinao Nomura ,  Mitsuo Takeuchi ,  Toshinori Kasuga

发明人： Yukio OZAKI ,  Michinao Nomura ,  Mitsuo Takeuchi ,  Toshinori Kasuga

IPC分类号： B08B3/00

CPC分类号： B08B3/12 ,  B08B2203/0229

摘要： A cleaning apparatus includes a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned, an agitator to induce agitation in the cleaning solution supplied to the object, an oscillating unit to oscillate the agitator, a drive unit to move any one of the object and the agitator so as to change a clearance between the object and the agitator, a detection unit to detect impedance of the oscillator, and a control unit to control the clearance by controlling the drive unit based on the impedance.

摘要翻译： 清洁装置包括供给单元，该供给单元至少将初始量的清洗液供给到待清洗物体的特定部位，搅拌器，在供给到被检体的清洗液中引起搅动，振荡单元使振动器振荡， 用于移动物体和搅拌器中的任何一个以驱动物体和搅拌器之间的间隙的驱动单元，用于检测振荡器的阻抗的检测单元以及通过控制驱动单元来控制间隙的控制单元 阻抗。